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At least 289 records · Page 16

The nature of the bonding in XCO for X = Fe, Ni, and Cu

The bonding in the (5,3)Sigma - and 3Delta states of FeCO, the (3,1)Sigma + , 3Delta, and 3Pi states of NiCO, and the 2Sigma + state of CuCO are analyzed using the constrained-space orbital-variation (CSOV) technique for both (CASSCF) and SCF wave functions. The bonding is discussed in terms of sigma repulsion between the metals 4s and the CO 5-sigma and CO-to-metal sigma donation when there is an empty or partly occupied d-sigma orbital and metal-to-CO 2pi(asterisk) backdonation. The bonding is compared for the different metals and between the different states.

Bauschlicher, C. W., Jr.↗

Chemical bonding technology

Primers employed in bonding together the various material interfaces in a photovoltaic module are being developed. The approach develops interfacial adhesion by generating actual chemical bonds between the various materials bonded together. The current status of the program is described along with the progress toward developing two general purpose primers for ethylene vinyl acetate (EVA), one for glass and metals, and another for plastic films.

Plueddemann, E.↗

On nd bonding in the transition metal trimers: Comparison of Sc3 and Y3

CASSCF/CCI calculations are presented for the low-lying states of Y3. Comparison of the wave functions for Y3 and Sc3 indicates substantial 4d-5p hybridization in Y3, but little 3d-4p hybridization in Sc3. The increased 4d-5p hybridization leads to stabilization of 4dpi bonding with respect to 4dsigma bonding for equilateral triangle Y3, and also leads to 4d-5p bonding for linear geometries. These effects lead to a different ordering of states for equilateral triangle geometries and a smaller excitation energy to the linear configuration for Y3 as compared to Sc3.

Walch, Stephen P.↗

Effect of bonding on the performance of a piezoactuator-based active control system

The utilization of piezoelectric actuators in controlling the structural vibrations of flexible beams is studied. A Modified Independent Modal Space Control (MIMSC) method is devised to select the optimal location, control gains and excitation voltage of the piezoelectric actuators in a way that would minimize the amplitudes of vibrations of beams to which these actuators are bonded, as well as the input control energy necessary to suppress these vibrations. The presented method accounts for the effects that the piezoelectric actuators and the bonding layers have on changing the elastic and inertial properties of the flexible beams. Numerical examples are presented to illustrate the application of the MIMSC method and to demonstrate the effect of the physical and geometrical properties of the bonding layer on the dynamic performance of the actively controlled beams. The obtained results emphasize the importance of the devised method in designing more realistic active control systems for flexible beams, in particular, and large flexible structures in general.

Baz, A.↗

A comparison of the bonding in Cr(NO)4 and Ni(CO)4

The bonding in Cr(NO)4 is very ionic, with about 1.5 electrons donated from the Cr to the NO 2pi orbitals. There is also a NO sigma donation of about 0.5 electrons to the Cr, yielding a net charge of Cr of about 1. A large MCSCF expansion is needed to describe both the ionic and covalent contributions to the Cr 3d-NO 2pi bonding. This bonding is compared to that in the isoelectronic Ni(CO)4.

Bauschlicher, C. W., Jr.↗

The importance of atomic and molecular correlation on the bonding in transition metal compounds

The determination of accurate spectroscopic parameters for molecular systems containing transition metal atoms is shown to require extensive data sets and a high level correlation treatment, and techniques and their limitations are considered. Extensive results reported on the transition metal atoms, hydrides, oxides, and dimers makes possible the design of a calculation to correctly describe the mixing of different atomic asymptotes, and to give a correct balance between molecular bonding and exchange interactions. Examples considered include the dipole moment of the 2Delta state of NiH, which can help determine the mixture of 3d(8)4s(2) and 3d(9)4s(1) in the NiH wavefunction, and the bonding in CrO, where an equivalent description of the relative energies associated with the Cr 3d-3d atomic exchange and the Cr-O bond is important.

Bauschlicher, Charles W., Jr.↗

Nondestructive evaluation of adhesive bond strength using the stress wave factor technique

Acousto-ultrasonic nondestructive evaluation has been conducted to evaluate the adhesive bond strength between rubber and steel plates using the stress wave factor (SWF) measurement technique. Specimens with different bond strength were manufactured and tested using the SWF technique. Two approaches were used to define the SWF. One approach defines the SWF as the signal energy and the other approach defines the SWF as the square root of the zero moment of the frequency spectrum of the received signal. The strength of the rubber-steel adhesive joint was then evaluated using the destructive peel strength test method. It was observed that in both approaches higher values of the SWF measurements correspond to higher values of the peel strength test data. Therefore, these results show that the stress wave factor technique has the potential of being used in quality assurance of the adhesive bond strength between rubber and steel substrates.

Dos Reis, Henrique L. M.↗

Stress ratio effect on cyclic debonding in adhesively bonded composite joints

A study was conducted to investigate the stress ratio effect on cyclic debond growth behavior in adhesively bonded composite joints. The system studied consisted of graphite/epoxy adherends bonded with a toughened epoxy adhesive. This study showed that the strain energy release rate range was the driving factor for cyclic debonding of the tested bonded system when subjected to cyclic loads with different stress ratios for both mode I and mixed mode I-II loadings.

Mall, S.↗

The use of fluoroepoxy compounds as adhesives to bond fluoroplastics without any surface treatment

The use of fluoroepoxy compounds as adhesives to bond fluoroplastics was investigated. Fluoroepoxy compounds with a F-content higher than 46 percent were able to bond a highly fluorinated plastic such as Teflon PTFE (76 percent F) to give a respectable bond strength without any surface treatment. The advantage of the fluoroepoxy adhesive vanished when applied to a less fluorinated plastic such as Tefzel which contains 55 percent fluorine. Among the curing agents explored, octafluorooctamethylenediamine showed its potential as a cocuring agent for improving both the viscosity of the compound and the flexibility of the cured product.

Lee, Sheng Yen↗

Strong, Low-Resistance Bonds For AMTEC Electrodes

Heat of operating cell helps form contacts. Strong, low-electrical-resistance contacts between elements of current-collection grid in alkali-metal thermoelectric converter (AMTEC) cell obtained by simple in-place thermocompression bonding. Bonds formed between porous electrode of molybdenum film, nickel or cobalt strips overlying film, and molybdenum tie wires running at right angles to strips. Bonding method also works on films of tungsten or tungsten/platinum.

Williams, Roger M.↗

Bonding Gauges To Carbon/Carbon Composites

Thermal-expansion properties modified to prevent bonds from failing. Proposed transition layer deposited between substrate and strain or temperature gauge to be bonded to substrate. Intended particularly for gauges that must operate at temperatures above 600 degrees F (320 degrees C) and substrates like fiber-reinforced carbon/carbon composites. Reduces stress caused by difference between thermal expansions of gauge and substrate materials. Without transition layer, stress often weakens or breaks bond.

Lemcoe, M. M.↗

A study on thermal barrier coatings including thermal expansion mismatch and bond coat oxidation

The present investigation deals with a plasma-sprayed thermal barrier coating (TBC) intended for high temperature applications to advanced gas turbine blades. Typically, this type of coating system consists of a zirconia-yttria ceramic layer with a nickel-chromium-aluminum bond coat on a superalloy substrate. The problem on hand is a complex one due to the fact that bond coat oxidation and thermal mismatch occur in the TBC. Cracking in the TBC has also been experimentally illustrated. A clearer understanding of the mechanical behavior of the TBC is investigated. The stress states in a model thermal barrier coating as it cools down in air is studied. The powerful finite element method was utilized to model a coating cylindrical specimen. Four successively refined finite element models were developed. Some results obtained using the first two models have been reported previously. The major accomplishment is the successful development of an elastic TBC finite element model known as TBCG with interface geometry between the ceramic layer and the bond coat. An equally important milestone is the near-completion of the new elastic-plastic TBC finite element model called TBCGEP which yielded initial results. Representative results are presented.

Chang, George C.↗

Determining bonding, thickness, and density via thermal wave impedance NDE

Bonding, density, and thickness of coatings have a vital effect on their performance in many applications. Pioneering development work on thermal wave nondestructive evaluation (NDE) methods during the past 25 years has resulted in an array of useful techniques for performing bonding, density, and thickness measurements in a practical shop environment. The most useful thermal wave methods for this purpose are based on thermal wave surface impedance measurement or scanning. A pulse of heat from either a thermal transducer or a hot gas pulse is projected onto the surface, and the resulting temperature response is analyzed to unfold the bonding, density, and thickness of the coating. An advanced emissivity independent infrared method was applied to detect the temperature response. These methods were recently completely computerized and can automatically provide information on coating quality in near real-time using the proper equipment. Complex shapes such as turbine blades can be scanned. Microscopic inhomogeneities such as microstructural differences and small, normal, isolated voids do not cause problems but are seen as slight differences in the bulk thermal properties. Test objects with rough surfaces can be effectively nondestructively evaluated using proper thermal surface impedance methods. Some of the basic principles involved, as well as metallographic results illustrating the ability of the thermal wave surface impedance method to detect natural nonbonds under a two-layer thermally sprayed coating, will be presented.

Green, D. R.↗

Investigations of bonded and curved microchannel plate stacks

The technique of fusing, or bonding, individual microchannel plate (MCP) stacks together offers the possibility of improving the uniformity of MCP stack operating characteristics and provides a convenient monolithic format. Here, the effectiveness of bonded MCP stacks and stacks of MCPs with curved surfaces is investigated to determine if MCP requirements for future astrophysical detectors can be achieved. The results show that both configurations give superior MCP performance characteristics. However, some problems remain with regard to the fabrication of bonded MCP stacks resulting in poor flat field characteristics and increased background.

Siegmund, O. H. W.↗

Test Data of Flow Field of Shuttle SRM Nozzle Joint with Bond Defects, Using Unheated Air

The nozzle-to-case joint on the Shuttle SRM (as redesigned after the Challenger accident) features an adhesive sealant filling and bonding the joint, with a wiper O-ring to prevent the adhesive from reaching and disabling the closure O-ring. Flawless implementation of that joint design would ensure that hot, corrosive propellant combustion gases never reach the closure O-ring. However, understanding the flow field related to bonding defects is prudent. A comprehensive test program was conducted to quantify such flow fields and associated heating environments. A two-dimensional, full-scale model represented 65 inches of the nozzle joint, using unheated air as the test medium, in a blowdown mode. Geometry variations modeled RSRM assembly tolerances, and two types of bonding defects: pullaways and blowholes. A range of the magnitude of each type defect was tested. Also a range of operational parameters was tested, representative of the RSRM flow environment, including duplication of RSRM Mach and Reynolds numbers. Extensive instrumentation was provided to quantify pressures, heat rates, and velocities. The resulting data established that larger geometric defects cause larger pressure and larger heating, at the closure O-ring region. Velocity trends were not so straight-forward. Variations in assembly tolerances did not generally affect flow fields or heating. Operational parameters affected flow fields and heating as might be expected, increasing density or velocity increased heating. Complete details of this test effort are presented.

Hair, Leroy M.↗

Tensile behavior of bonded scarf joints between composite adherends

Tensile tests of bonded scarf joints indicate that shallow angle joints are sensitive to slight adherend tip bluntness. For scarf angles ranging from 9.2 to 1.1 degrees stress concentrations from blunt adherend tips significantly limit the increased strength expected from larger bond area. The bonded joints fail by two failure modes depending on the scarf angle. Although most of the joints in this study were scarfed by a surface grinder, small angle scarfs can be cut very accurately with a hand held rotary bur.

Adkins, David W.↗

Theoretical study of the bonding in LaFe(2+), LaRu(2+) and YRu(2+)

The bonding in LaFe(2+) and LaRu(2+) involves nearly equal contributions from La(+) and La(2+). The second IP of Y is larger than that of La and this leads to predominantly Y(+) + Ru(+) character in the YRu(2+) wavefunction. The remarkable stability of these systems derives from multiple d-d bonds that lead to a bond-order of between two and three. Thus the ground states of these dications, which have relatively deep molecular wells and large barriers to dissociation, have essentially infinite lifetimes with respect to unimolecular decay.

Bauschlicher, Charles W., Jr.↗

Measurement of the intrinsic bond strength of brittle thin films on flexible substrates

The brittle cracking and subsequent debonding of nickel films deposited on polymer substrates subjected to uniaxial strain is investigated. Stress analyses for a film/substrate system are performed. Based on the analysis, the interfacial bond strength between brittle thin films and flexible substrates can be evaluated in terms of the tensile strength of the coating and the length of the largest segment that first debonds. Experiments were performed on Ni films with different thicknesses evaporated on polyethylene terephthalate substrates and the intrinsic bond strength was evaluated. The interfacial bond strengths were shown to be relatively independent of the film thickness for the range studied.

Guo, Q.↗