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At least 289 records · Page 16

Radiation Effects on Current Field Programmable Technologies

Manufacturers of field programmable gate arrays (FPGAS) take different technological and architectural approaches that directly affect radiation performance. Similar y technological and architectural features are used in related technologies such as programmable substrates and quick-turn application specific integrated circuits (ASICs). After analyzing current technologies and architectures and their radiation-effects implications, this paper includes extensive test data quantifying various devices total dose and single event susceptibilities, including performance degradation effects and temporary or permanent re-configuration faults. Test results will concentrate on recent technologies being used in space flight electronic systems and those being developed for use in the near term. This paper will provide the first extensive study of various configuration memories used in programmable devices. Radiation performance limits and their impacts will be discussed for each design. In addition, the interplay between device scaling, process, bias voltage, design, and architecture will be explored. Lastly, areas of ongoing research will be discussed.

Katz, R.↗

High Performance Low Cost Power Conditioning Subsystems Using Smart Power/ Power Integrated Circuits in Photovoltaic Power Systems

New technologies like Smart Power, and Power Integrated Circuits are the wave of the future in providing high performance low cost power conditioning subsystem (PCS)in small to large power applications. This paper discusses circuit designs using these devices that are suitable for PCS in photovoltaic and other industrial applications such as electrical appliances, instrumentation, AC motor drives, battery chargers, automobiles, telecommunications, UPS, and switch mode power supplies. It examines the cost of high volume production and current technological barriers asociated with the development of these technologies.

smart↗

IEEE 1393 Spaceborne Fiber Optic Data Bus: A Standard Approach to On-Board Payload Data Handling Networks for the AIAA Space Technology Conference and Exposition "Partnering in the 21th Century"

The Spaceborne Fiber Optic Data Bus (SFODB) is the next generation in on-board data handling networks. It will do for high speed payloads what SAE 1773 has done for on-board command and telemetry systems. That is, it will significantly reduce the cost of payload development, integration and test through interface standardization. As defined in IEEE 1393, SFODB is a 1 Gb/s, fiber optic network specifically designed to support the real-time, on-board data handling requirements of remote sensing spacecraft. The network is highly reliable, fault tolerant, and capable of withstanding the rigors of launch and the harsh space environment. SFODB achieves this operational and environmental performance while maintaining the small size, light weight, and low power necessary for spaceborne applications. SFODB was developed jointly by DoD and NASA GSFC to meet the on-board data handling needs of Remote Sensing satellites. This jointly funded project produced a complete set of flight transmitters, receivers and protocol ASICS; a complete Development & Evaluation System; and, the IEEE 1393 standard.

Andrucyk, Dennis J.↗

A Spacecraft Housekeeping System-on-Chip in a Radiation Hardened Structured ASIC

Housekeeping systems are essential to health monitoring of spacecraft and instruments. Typically, sensors are distributed across various sub-systems and data is collected using components such as analog-to-digital converters, analog multiplexers and amplifiers. In most cases programmable devices are used to implement the data acquisition control and storage, and the interface to higher level systems. Such discrete implementations require additional size, weight, power and interconnect complexity versus an integrated circuit solution, as well as the qualification of multiple parts. Although commercial devices are readily available, they are not suitable for space applications due the radiation tolerance and qualification requirements. The Housekeeping System-o n-A-Chip (HKSOC) is a low power, radiation hardened integrated solution suitable for spacecraft and instrument control and data collection. A prototype has been designed and includes a wide variety of functions including a 16-channel analog front-end for driving and reading sensors, analog-to-digital and digital-to-analog converters, on-chip temperature sensor, power supply current sense circuits, general purpose comparators and amplifiers, a 32-bit processor, digital I/O, pulse-width modulation (PWM) generators, timers and I2C master and slave serial interfaces. In addition, the device can operate in a bypass mode where the processor is disabled and external logic is used to control the analog and mixed signal functions. The device is suitable for stand-alone or distributed systems where multiple chips can be deployed across different sub-systems as intelligent nodes with computing and processing capabilities.

Suarez, George↗

Improved Charge Sensing on a SiMOS Double Quantum Dot using a Cryogenic Skipper Readout ASIC (Quandarum)

Major outstanding questions in high-energy physics such as the nature of dark matter and the existence of interactions beyond the standard model require new measurement techniques which are extremely sensitive to minute electromagnetic fields. An array of entangled spin qubits is a promising system for building novel detectors due to its combination of sensitivity and controllability. CMOS-based electron spin qubits, which have demonstrated the operational requirements for fault-tolerant quantum computing [1], offer a particular opportunity due to their compatibility with classical electronics, which allows the leveraging of decades of development of low-noise cryogenic detectors for physics. In this work, we combine a SiMOS double-quantum dot device architecture with a state-of-the-art cryoelectronic readout circuit [2-3] aimed to demonstrate improved charge readout using a single-electron transistor (SET). We identify the design characteristics for an SET that facilitate the use of on-chip classical electronics as a low-power, high-bandwidth first amplification stage and explore opportunities for sensor-readout co-design to minimize noise. This is the first of a series of steps to demonstrate high-fidelity readout of a large array of spin qubit with enough sensitivity to probe processes of interest for the investigation of beyond-standard-model physics.

Quinn, Adam [Fermilab]↗

First beam tests of prototype silicon modules for the CMS High Granularity Endcap Calorimeter

The High Luminosity phase of the Large Hadron Collider will deliver 10 times more integrated luminosity than the existing collider, posing significant challenges for radiation tolerance and event pileup on detectors, especially for forward calorimetry. As part of its upgrade program, the Compact Muon Solenoid collaboration is designing a high-granularity calorimeter (HGCAL) to replace the existing endcap calorimeters. It will feature unprecedented transverse and longitudinal readout and triggering segmentation for both electromagnetic and hadronic sections. The electromagnetic section and a large fraction of the hadronic section will be based on hexagonal silicon sensors of 0.5–1 cm 2 cell size, with the remainder of the hadronic section being based on highly-segmented scintillators with silicon photomultiplier readout. The intrinsic high-precision timing capabilities of the silicon sensors will add an extra dimension to event reconstruction, especially in terms of pileup rejection. First hexagonal silicon modules, using the existing Skiroc2 front-end ASIC developed for CALICE, have been tested in beams at Fermilab and CERN in 2016. Here, we present results from these tests, in terms of system stability, calibration with minimum-ionizing particles and resolution (energy, position and timing) for electrons, and the comparisons of these quantities with GEANT4-based simulation.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

CMS HGCAL ECON-D ASIC : Impact of CMOS fabrication process tuning on performance and radiation tolerance

The CMS experiment’s High Granularity Calorimeter (HGCAL) upgrade will replace CMS’s existing endcap calorimeters in preparation for the High Luminosity LHC. To effectively use over 6 million channels of this “imaging”calorimeter, CMS has developed two novel Endcap Concentrator (ECON) ASICs to perform data compression/selection on detector. The ECON-D ASIC operates on the 750kHz data path, and the ECON-T ASIC on the 40MHz trigger path. These 65 nm CMOS ASICs are radiation tolerant to 200 Mrad and low power, operating at less than 2.5 mW/channel. The first full-functionality prototype ECONs were produced and characterized in 2021-23, and an initial engineering run was performed in 2024. ECON-D radiation testing for the engineering run revealed that the chip’s internal SRAMs produce intermittent read errors for a non-negligible fraction of chips. Further investigation indicated that the SRAM performance is highly sensitive to the exact parameters of the CMOS fabrication process. To both study this process sensitivity and mitigate SRAM performance issues, twenty ECON wafers were produced in 2025 with a range of doping concentrations designed to tune the underlying transistor threshold voltage by 0%, 5%, 10%, and 15% from nominal. This talk will present first measurements of ECON-D performance, power consumption, and radiation tolerance for these four variations of CMOS process.

Syal, Chinar [Fermilab]↗

Parallel-Processing Equalizers for Multi-Gbps Communications

Architectures have been proposed for the design of frequency-domain least-mean-square complex equalizers that would be integral parts of parallel- processing digital receivers of multi-gigahertz radio signals and other quadrature-phase-shift-keying (QPSK) or 16-quadrature-amplitude-modulation (16-QAM) of data signals at rates of multiple gigabits per second. Equalizers as used here denotes receiver subsystems that compensate for distortions in the phase and frequency responses of the broad-band radio-frequency channels typically used to convey such signals. The proposed architectures are suitable for realization in very-large-scale integrated (VLSI) circuitry and, in particular, complementary metal oxide semiconductor (CMOS) application- specific integrated circuits (ASICs) operating at frequencies lower than modulation symbol rates. A digital receiver of the type to which the proposed architecture applies (see Figure 1) would include an analog-to-digital converter (A/D) operating at a rate, fs, of 4 samples per symbol period. To obtain the high speed necessary for sampling, the A/D and a 1:16 demultiplexer immediately following it would be constructed as GaAs integrated circuits. The parallel-processing circuitry downstream of the demultiplexer, including a demodulator followed by an equalizer, would operate at a rate of only fs/16 (in other words, at 1/4 of the symbol rate). The output from the equalizer would be four parallel streams of in-phase (I) and quadrature (Q) samples.

Gray, Andrew↗

A 4 x 4 array module of position-sensitive virtual Frisch-grid CdZnTe detectors for gamma-ray imaging spectrometers

Arrays of position-sensitive virtual Frisch-grid CdZnTe (CZT) detectors offer an economical approach to making high efficiency and high energy resolution gamma cameras for spectroscopy and imaging of radioactive sources. There are many application areas for such instruments including gamma-rays astronomy, medical and industrial imaging, nonproliferation and nuclear safeguards. We present the test results from a 4x4 array module coupled to the front-end ASIC. The array houses 16 detectors made of 6x6x20 mm 3 CZT crystals. Each crystal is encapsulated inside an ultrathin polyester shell and furnished with four 5-mm-wide charge-sensing pads placed near the anode on each side of the detector. The pad’s signals are used to measure X-Y coordinates while the cathode signals give the interaction depths (Z coordinates). Combined together the signals provide 3D position information of the interaction points which can be used to correct the detector response non-uniformity. This allows developers to use standard grade (unselected) CZT crystals while retaining high spectroscopic performance comparable with that of the H3D pixelated detectors. The array’s design provides flexibility to replace individual detectors and extend their sizes, potentially increasing upwards of 4 cm in height. We started development of position-sensitive VFG detectors several years ago and today this technology has reached a high-maturity level and is ready to use in practical applications.

3D charge-loss correction↗

An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduced Board Size for Space Based Electronics

This paper presents our work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuit (ASIC) applications. FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry. Our Interposer focuses on the needs of Micro Semi’s RTG4 FPGA. We developed the interposer using COTS embedded foil capacitors. The Interposer is customized to the capacitance requirements for each of the FPGA banks. We evaluated three foil manufactures Oak Mitsui, 3M and TDK. The three different designs were evaluated, but we will focus on the Oak-Mitsui based Interposer that we constructed and tested. Through simulations, we validate the horizontal and vertical interconnect inductances, that FPGA decoupling requirements are met. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.

Hunter, Don J↗

A survey of techniques for optimizing transformer inference

Recent years have seen a phenomenal rise in the performance and applications of transformer neural networks. The family of transformer networks, including Bidirectional Encoder Representations from Transformer (BERT), Generative Pretrained Transformer (GPT) and Vision Transformer (ViT), have shown their effectiveness across Natural Language Processing (NLP) and Computer Vision (CV) domains. Transformer-based networks such as ChatGPT have impacted the lives of common men. However, the quest for high predictive performance has led to an exponential increase in transformers' memory and compute footprint. Researchers have proposed techniques to optimize transformer inference at all levels of abstraction. Further, this paper presents a comprehensive survey of techniques for optimizing the inference phase of transformer networks. We survey techniques such as knowledge distillation, pruning, quantization, neural architecture search and lightweight network design at the algorithmic level. We further review hardware-level optimization techniques and the design of novel hardware accelerators for transformers. We summarize the quantitative results on the number of parameters/FLOPs and the accuracy of several models/techniques to showcase the tradeoff exercised by them. We also outline future directions in this rapidly evolving field of research. We believe that this survey will educate both novice and seasoned researchers and also spark a plethora of research efforts in this field.

97 MATHEMATICS AND COMPUTING↗

Flexible high speed codec

The project's objective is to develop an advanced high speed coding technology that provides substantial coding gains with limited bandwidth expansion for several common modulation types. The resulting technique is applicable to several continuous and burst communication environments. Decoding provides a significant gain with hard decisions alone and can utilize soft decision information when available from the demodulator to increase the coding gain. The hard decision codec will be implemented using a single application specific integrated circuit (ASIC) chip. It will be capable of coding and decoding as well as some formatting and synchronization functions at data rates up to 300 megabits per second (Mb/s). Code rate is a function of the block length and can vary from 7/8 to 15/16. Length of coded bursts can be any multiple of 32 that is greater than or equal to 256 bits. Coding may be switched in or out on a burst by burst basis with no change in the throughput delay. Reliability information in the form of 3-bit (8-level) soft decisions, can be exploited using applique circuitry around the hard decision codec. This applique circuitry will be discrete logic in the present contract. However, ease of transition to LSI is one of the design guidelines. Discussed here is the selected coding technique. Its application to some communication systems is described. Performance with 4, 8, and 16-ary Phase Shift Keying (PSK) modulation is also presented.

Boyd, R. W.↗

Development of Thermal Infrared Sensor to Supplement Operational Land Imager

The thermal infrared sensor (TIRS) is a quantum well infrared photodetector (QWIP)-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 m. The focal plane will contain three 640 ~512 QWIP arrays mounted onto a silicon substrate. The readout integrated circuit (ROIC) addresses each pixel on the QWIP arrays and reads out the pixel value (signal). The ROIC is controlled by the focal plane electronics (FPE) by means of clock signals and bias voltage value. The means of how the FPE is designed to control and interact with the TIRS focal plane assembly (FPA) is the basis for this work. The technology developed under the FPE is for the TIRS focal plane assembly (FPA). The FPE must interact with the FPA to command and control the FPA, extract analog signals from the FPA, and then convert the analog signals to digital format and send them via a serial link (USB) to a computer. The FPE accomplishes the described functions by converting electrical power from generic power supplies to the required bias power that is needed by the FPA. The FPE also generates digital clocking signals and shifts the typical transistor-to-transistor logic (TTL) to }5 V required by the FPA. The FPE also uses an application- specific integrated circuit (ASIC) named System Image, Digitizing, Enhancing, Controlling, And Retrieving (SIDECAR) from Teledyne Corp. to generate the clocking patterns commanded by the user. The uniqueness of the FPE for TIRS lies in that the TIRS FPA has three QWIP detector arrays, and all three detector arrays must be in synchronization while in operation. This is to avoid data skewing while observing Earth flying in space. The observing scenario may be customized by uploading new control software to the SIDECAR.

Shu, Peter↗

Towards Automated Generation of Chiplet-Based Systems

The Software Defined Architectures (SODA) Synthesizer is an open-source compiler-based tool able to automatically generate domain-specialized systems targeting Application- Specific Integrated Circuits (ASICs) or Field Programmable Gate Arrays (FPGAs) starting from high-level programming. SODA is composed of a high-level frontend, SODA-OPT, which leverages the multilevel intermediate representation (MLIR) framework to interface with productive programming tools (e.g., machine learning frameworks), identify kernels suitable for acceleration, and perform high-level optimizations, and of a state-of-the-art high-level synthesis backend, Bambu from the PandA framework, to generate custom accelerators. One specific application of the SODA Synthesizer is the generation of accelerators to enable ultra-low latency inference and control on autonomous systems for scientific discovery (e.g., electron microscopes, sensors in particle accelerators, etc.). This talk will discuss ongoing work on the SODA synthesizer to enable no-human-in-the-loop generation and design space exploration of the chiplets for highly specialized artificial intelligence accelerators. Connecting these highly specialized chiplets to general-purpose cores or programmable accelerators will allow to quickly deploy autonomous systems for scientific discovery.

Limaye, Ankur M.↗

Magnetospheric Atmospheric X-ray Imaging Experiment (MAXIE)

This report summarizes the activities sponsored by the Office of Naval Research for the Magnetospheric Atmospheric X-ray Imaging Experiment (MAXIE). The MAXIE instrument was developed as a joint activity of Lockheed, The Aerospace Corporation, and the University of Bergen, Norway. Lockheed was responsible for the overall management of the program, interfacing with the appropriate government agencies, the overall electrical and mechanical design, flight software, environmental testing, spacecraft integration activities, on orbit checkout, and data processing activities. The Magnetospheric Atmospheric X-ray Imaging Experiment (MAXIE), the ONR 401 experiment, is the first in a new class of satellite-borne remote sensing instruments. The primary innovation is the ability to obtain rapid, sequential, images with high sensitivity of the earth's X ray aurora from a low altitude polar orbiting satellite. These images can be used to identify dynamic temporal variations in the three-dimensional (energy and position) distribution of electron precipitation into the atmosphere. MAXIE was launched on the TIROS NOAA-13 satellite on 9 August 1993. The experiment performed well during its turn-on sequence; however, the spacecraft bus failed on 21 August 1993. New spacebased technologies successfully used in MAXIE were mixed-mode ASIC microcircuits, a zero torque scanning system with associated viscoelastic damping, a paraffin stow release mechanism, a parallel integrating PHA processor, a low noise Si(Li) sensor telescope, and an advanced thermal cooling system. MAXIE's on orbit operation, control of penetrating particle backgrounds, and scientific data indicated good overall performance.

Imhof, W. L.↗

The ePix10k 2-megapixel hard X-ray detector at LCLS

The ePix10ka2M (ePix10k) is a new large area detector specifically developed for X-ray free-electron laser (XFEL) applications. The hybrid pixel detector was developed at SLAC to provide a hard X-ray area detector with a high dynamic range, running at the 120 Hz repetition rate of the Linac Coherent Light Source (LCLS). The ePix10k consists of 16 modules, each with 352 × 384 pixels of 100 µm × 100 µm distributed on four ASICs, resulting in a 2.16 megapixel detector, with a 16.5 cm × 16.5 cm active area and ∼80% coverage. The high dynamic range is achieved with three distinct gain settings (low, medium, high) as well as two auto-ranging modes (high-to-low and medium-to-low). Here the three fixed gain modes are evaluated. The resulting dynamic range (from single photon counting to 10000 photons pixel −1 pulse −1 at 8 keV) makes it suitable for a large number of different XFEL experiments. The ePix10k replaces the large CSPAD in operation since 2011. The dimensions of the two detectors are similar, making the upgrade from CSPAD to ePix10k straightforward for most setups, with the ePix10k improving on experimental performance. The SLAC-developed ePix cameras all utilize a similar platform, are tailored to target different experimental conditions and are designed to provide an upgrade path for future high-repetition-rate XFELs. Here the first measurements on this new ePix10k detector are presented and the performance under typical XFEL conditions evaluated during an LCLS X-ray diffuse scattering experiment measuring the 9.5 keV X-ray photons scattered from a thin liquid jet.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Design and Evaluation of the LAr Trigger Digitizer Board in the ATLAS Phase-I Upgrade

The Phase-I upgrade of the trigger readout electronics for the ATLAS Liquid Argon (LAr) calorimeters will be installed during the second long shutdown of the Large Hadron Collider (LHC) in 2019-2020 which will enable enhanced instantaneous luminosities during LHC Run 3 from 2021 through 2023. In this trigger upgrade, so-called supercells are introduced to provide higher granularity, higher resolution and longitudinal shower shape information from the LAr calorimeters to the Level-1 trigger processors. A new LAr Trigger Digitizer Board (LTDB) will process and digitize up to 320 channels of supercell signals, and transmit them via 40 fiber optical links to the back end where the data are further processed and transmitted to the trigger processors. Five pairs of bidirectional GBT links are used for slow control and monitoring between LTDB and the Front-End LInk eXchange (FELIX) in the ATLAS Trigger and Data Acquisition (TDAQ) system. Here, the LTDB also outputs 64 summed analog legacy signals to the current Tower Builder Board via a new baseplane. A test system for the production of 124 LTDBs has been developed, supporting configuration and calibration of all ASICs

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

A 24-Channel Digitizer With a JESD204B-Compliant Serial Interface for High-Speed Detectors

In this report a 24-channel application-specific integrated circuit (ASIC) for the readout of high-speed CMOS active pixel sensors for charged particle detection is presented. The chip comprises 24 preamplifiers, 24 distinct 12-bit, 25 MSPS Pipelined analog-to-digital converters (ADCs) with self-calibration, an internal phase-locked loop (PLL), and a 3 Gbps serial interface that conforms to the JESD204B standard. To simplify interfacing with a variety of sensors, the ASIC also includes an automatic offset calibration loop. The high level of integration of the ASIC reduces overall system cost and area, and exploiting the signal characteristics of the image sensor allows the ADC to be optimized for reduced power dissipation. The use of an integrated serializer and an industry standard protocol simplifies integration of the ASIC into a complete camera system. The ASIC, called the High-Speed Image Preprocessor Targeted for Electron Readout, or HIPSTER, with a die area of 64.26 mm 2 , is packaged in a 480-ball grid array (BGA) and is fabricated in 180-nm CMOS technology. HIPSTER achieves typical differential nonlinearity (DNL) < 0.55 LSB, input-referred thermal noise of $114.5 μV-rms, and a bit error rate (BER) of better than 10-14. The power dissipation is 98 mW/channel.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗