A Co-Design Approach to Understanding the Impact of Ultra-Wide-Bandgap Semiconductor Material Properties on Power Device Performance (invited).
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Calculated results for transient heating and melting of glass shield at stagnation point of reentering icbm
Uniaxial wave propagation in viscoelastic bar due to step displacement at end solved in terms of Fourier sine integral
Finite-element computer program solves for nodal point displacements in an axisymmetric solid. The options in the program include plane stress analysis, axisymmetric solids analysis, nonlinear /plastic/ analysis, and equivalent stress and strain.
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Progress is described in developing, through mathematical expressions, values for the parameters which apparently determine the values of atomic density, melting point, and principal elastic constant for the alkali halides. This necessarily required the review and refinement of these data for the monohalides in general and for LiH. A more sensitive and dimensionless expression of the mass factor appears to have promise and a still more sensitive one is suggested for future study. A periodicity factor based on inert gas core configuration has been suggested to replace the atomic number previously used.
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Announced report discusses experimental test program in which five different solar cell array designs were evaluated by subjecting them to 60 thermal cycles from minus 190 deg to 0.0 deg. Results indicate that solder-coated cells combined with Kovar n-interconnectors and p-interconnectors are more durable under thermal loading than other configurations.