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At least 271 records · Page 15

Building Reliable Printed Circuit Boards - the Lessons Learned

"Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. This one day workshop will discuss a variety of failure mechanisms that effect the functionality of PCBs. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. With the help of examples and case studies, a wide range of failure mechanisms will be discussed, case studies are focused on digital circuits, however some failures in analog, double sided boards are also presented. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues."

Sood, Bhanu↗

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗

Feasibility study of a 110 watt per kilogram lightweight solar array system

An investigation of the feasibility of a solar array panel subsystem which will produce 10,000 watts of electrical output at 1 A.U. with an overall beginning-of-life power-to-weight ratio of at least 110 watt/kg is reported. A description of the current baseline configuration which meets these requirements is presented. A parametric analysis of the single boom, two blanket planar solar array system was performed to arrive at the optimum system aspect ratio. A novel concept for the stiffening of a lightweight solar array by canting the solar cell blankets at a small angle to take advantage of the inherent in-plane stiffness to increase the symmetric out-of-plane frequency is introduced along with a preliminary analysis of the stiffening effect. A comparison of welded and soldered solar cell interconnections leads to the conclusion that welding is required on this ultralightweight solar array. The use of a boron/aluminum composite material in a BI-STEM type deployable boom is investigated as a possible advancement in the state-of-the-art.

Shepard, N. F.↗

Nanoporous Silica Thermal Insulation for Space Shuttle Cryogenic Tanks: A Case Study

Nanoporous silica (with typical 10-50 nm porous radii) has been benchmarked for thermal insulators capable of maintaining a 150 K/cm temperature gradient. For cryogenic use in aerospace applications, the combined features for low-density, high thermal insulation factors, and low temperature compatibility are demonstrated in a prototype sandwich structure between two propulsion tanks. Theoretical modelling based on a nanoscale fractal structure suggest that the thermal conductivity scales proportionally (exponent, 1.7) with the material density-lower density increases the thermal insulation rating. Computer simulations, however, support the optimization tradeoff between material strength (Young moduli, proportional to density with exponent, 3.7), the characteristic (colloidal silica, less than 5 nm) particle size, and the thermal rating. The results of these simulations indicate that as nanosized particles are incorporated into the silica backbone, the resulting physical properties will be tailored by the smallest characteristic length and their fractal interconnections (dimension and fractal size). The application specifies a prototype panel which takes advantage of the processing flexibility inherent in sol-gel chemistry.

Noever, David A.↗

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.

Printed circuit boards↗

Modes of interconnected lattice trusses using continuum models, part 1

This represents a continuing systematic attempt to explore the use of continuum models--in contrast to the Finite Element Models currently universally in use--to develop feedback control laws for stability enhancement of structures, particularly large structures, for deployment in space. We shall show that for the control objective, continuum models do offer unique advantages. It must be admitted of course that developing continuum models for arbitrary structures is no easy task. In this paper we take advantage of the special nature of current Large Space Structures--typified by the NASA-LaRC Evolutionary Model which will be our main concern--which consists of interconnected orthogonal lattice trusses each with identical bays. Using an equivalent one-dimensional Timoshenko beam model, we develop an almost complete continuum model for the evolutionary structure. We do this in stages, beginning only with the main bus as flexible and then going on to make all the appendages also flexible-except for the antenna structure. Based on these models we proceed to develop formulas for mode frequencies and shapes. These are shown to be the roots of the determinant of a matrix of small dimension compared with mode calculations using Finite Element Models, even though the matrix involves transcendental functions. The formulas allow us to study asymptotic properties of the modes and how they evolve as we increase the number of bodies which are treated as flexible. The asymptotics, in fact, become simpler.

Balakrishnan, A. V.↗

Analysis of the origin of Aufeis feed-water on the arctic slope of Alaska

The origin of water feeding large aufeis fields (overflow river ice) on the Arctic Slope of Alaska is analyzed. Field measurements of two large aufeis fields on the eastern Arctic Slope were taken during July of 1978 and 1979. Measurements of aufeis extent and distribution were made using LANDSAT Multispectral Scanner Subsystem (MSS) satellite data from 1973 through 1979. In addition, ice cores were analyzed in the laboratory. Results of the field and laboratory studies indicate that the water derived from aufeis melt water has a chemical composition different from the adjacent upstream river water. Large aufeis fields are found in association with springs and faults thus indicating a subterranean origin of the feed water. In addition, the maximum extent of large aufeis fields was not found to follow meteorological patterns which would only be expected if the origin of the feed water were local. It is concluded that extent of large aufeis in a given river channel on the Arctic Slope is controlled by discharge from reservoirs of groundwater. It seems probable that precipitation passes into limestone aquifers in the Brooks Range, through an interconnecting system of subterranean fractures in calcareous rocks and ultimately discharges into alluvial sediments on the coastal plain to form aufeis. It is speculated that only small aufeis patches are affected by local meteorological parameters in the months just prior to aufeis formation.

Hall, D. K.↗

Development of an intelligent interface for adding spatial objects to a knowledge-based geographic information system

Earth Scientists lack adequate tools for quantifying complex relationships between existing data layers and studying and modeling the dynamic interactions of these data layers. There is a need for an earth systems tool to manipulate multi-layered, heterogeneous data sets that are spatially indexed, such as sensor imagery and maps, easily and intelligently in a single system. The system can access and manipulate data from multiple sensor sources, maps, and from a learned object hierarchy using an advanced knowledge-based geographical information system. A prototype Knowledge-Based Geographic Information System (KBGIS) was recently constructed. Many of the system internals are well developed, but the system lacks an adequate user interface. A methodology is described for developing an intelligent user interface and extending KBGIS to interconnect with existing NASA systems, such as imagery from the Land Analysis System (LAS), atmospheric data in Common Data Format (CDF), and visualization of complex data with the National Space Science Data Center Graphics System. This would allow NASA to quickly explore the utility of such a system, given the ability to transfer data in and out of KBGIS easily. The use and maintenance of the object hierarchies as polymorphic data types brings, to data management, a while new set of problems and issues, few of which have been explored above the prototype level.

Campbell, William J.↗

Collisionless effects on beam-return current systems in solar flares

A theoretical study of the beam-return current system (BRCS) in solar flares shows that the precipitating electrons modify the way in which the return current (RC) is carried by the background plasma. In particular it is found that the RC is not carried by the bulk of the electrons but by a small number of high-velocity electrons. For beam/plasma densities exceeding approximately 0.001, this can reduce the effects of collisions and heating by the RC. For higher-density beams, where the RC could be unstable to current-driven instabilities, the effects of strong turbulence anomalous resistivity prevent the appearance of such instabilities. The main conclusion is that the BRCS is interconnected, and that the beam-generated strong turbulence determines how the RC is carried.

Vlahos, L.↗

Time-variant analysis of rotorcraft systems dynamics - An exploitation of vector processors

In this paper a generalized algorithmic procedure is presented for handling constraints in mechanical transmissions. The latter are treated as multibody systems of interconnected rigid/flexible bodies. The constraint Jacobian matrices are generated automatically and suitably updated in time, depending on the geometrical and kinematical constraint conditions describing the interconnection between shafts or gears. The type of constraints are classified based on the interconnection of the bodies by assuming that one or more points of contact exist between them. The effects due to elastic deformation of the flexible bodies are included by allowing each body element to undergo small deformations. The procedure is based on recursively formulated Kane's dynamical equations of motion and the finite element method, including the concept of geometrical stiffening effects. The method is implemented on an IBM-3090-600j vector processor with pipe-lining capabilities. A significant increase in the speed of execution is achieved by vectorizing the developed code in computationally intensive areas. An example consisting of two meshing disks rotating at high angular velocity is presented. Applications are intended for the study of the dynamic behavior of helicopter transmissions.

Amirouche, F. M. L.↗

FSA field test report, 1980 - 1982

Photovoltaic modules made of new and developing materials were tested in a continuing study of weatherability, compatibility, and corrosion protection. Over a two-year period, 365 two-cell submodules have been exposed for various intervals at three outdoor sites in Southern California or subjected to laboratory acceptance tests. Results to date show little loss of maximum power output, except in two types of modules. In the first of these, failure is due to cell fracture from the stresses that arise as water is regained from the surrounding air by a hardboard substrate, which shrank as it dried during its encapsulation in plastic film at 150 C in vacuo. In the second, the glass superstrate is sensitive to cracking, which also damages the cells electrostatically bonded to it; inadequate bonding of interconnects to the cells is also a problem in these modules. In a third type of module, a polyurethane pottant has begun to yellow, though as yet without significant effect on maximum power output.

Maxwell, H. G.↗

Crew Member Interface with Space Station Furnace Facility

The Space Station Furnace Facility (SSFF) is a facility located in the International Space Station United States Laboratory (ISS US Lab) for materials research in the microgravity environment. The SSFF will accommodate basic research, commercial applications, and studies of phenomena of metals and alloys, electronic and photonic materials, and glasses and ceramics. To support this broad base of research requirements, the SSFF will operate, regulate, and support a variety of Experiment Modules (EMs). To meet station requirements concerning the microgravity level needed for experiments, station is providing an active vibration isolation system, and SSFF provides the interface. SSFF physically consists of a Core Rack and two instrument racks (IRs) that occupy three adjacent ISS US Lab rack locations within the International Space Station (ISS). All SSFF racks are modified International Standard Payload Racks (ISPR). SSFF racks will have a 50% larger pass through area on the lower sides than ISPRs to accommodate the many rack to rack interconnections. The Instrument Racks are further modified with lowered floors and an additional removable panel (15" x 22") on top of the rack for access if needed. The Core Rack shall contain all centralized Core subsystems and ISS subsystem equipment. The two Instrument Racks shall contain the distributed Core subsystem equipment, ISS subsystem equipment, and the EMs. The Core System, which includes the Core Rack, the IR structures, and subsystem components located in the IRs serves as the central control and management for the IRs and the EMs. The Core System receives the resources provided by the International Space Station (ISS) and modifies, allocates, and distributes these resources to meet the operational requirements of the furnace. The Core System is able to support a total of four EMs and can control, support, and activate/deactivate the operations of two EMs, simultaneously. The IRs can be configured to house two small EMs or one tall vertical EM, and serve as the interface between the Core and the respective EM. The Core Rack and an adjacent Instrument Rack (containing one or more furnaces) will be delivered to the ISS in one launch. This is Integrated Configuration One (ICI). The Core Rack and IRI will be passive during transport in the Mini Pressurized Logistics Module (MPLM): Any subsequent EMs to operate within IRI are installed on-orbit. The second IR (containing one or more furnaces) is delivered to ISS on a subsequent launch which will establish Integrated Configuration Two (IC2). Additional integrated configurations will be established with the replacement of EMs or Instrument Racks.

Cash, Martha B.↗

Customer premise service study for 30/20 GHz satellite system

Satellite systems in which the space segment operates in the 30/20 GHz frequency band are defined and compared as to their potential for providing various types of communications services to customer premises and the economic and technical feasibility of doing so. Technical tasks performed include: market postulation, definition of the ground segment, definition of the space segment, definition of the integrated satellite system, service costs for satellite systems, sensitivity analysis, and critical technology. Based on an analysis of market data, a sufficiently large market for services is projected so as to make the system economically viable. A large market, and hence a high capacity satellite system, is found to be necessary to minimize service costs, i.e., economy of scale is found to hold. The wide bandwidth expected to be available in the 30/20 GHz band, along with frequency reuse which further increases the effective system bandwidth, makes possible the high capacity system. Extensive ground networking is required in most systems to both connect users into the system and to interconnect Earth stations to provide spatial diversity. Earth station spatial diversity is found to be a cost effective means of compensating the large fading encountered in the 30/20 GHz operating band.

Milton, R. T.↗

Reliability models applicable to space telescope solar array assembly system

A complex system may consist of a number of subsystems with several components in series, parallel, or combination of both series and parallel. In order to predict how well the system will perform, it is necessary to know the reliabilities of the subsystems and the reliability of the whole system. The objective of the present study is to develop mathematical models of the reliability which are applicable to complex systems. The models are determined by assuming k failures out of n components in a subsystem. By taking k = 1 and k = n, these models reduce to parallel and series models; hence, the models can be specialized to parallel, series combination systems. The models are developed by assuming the failure rates of the components as functions of time and as such, can be applied to processes with or without aging effects. The reliability models are further specialized to Space Telescope Solar Arrray (STSA) System. The STSA consists of 20 identical solar panel assemblies (SPA's). The reliabilities of the SPA's are determined by the reliabilities of solar cell strings, interconnects, and diodes. The estimates of the reliability of the system for one to five years are calculated by using the reliability estimates of solar cells and interconnects given n ESA documents. Aging effects in relation to breaks in interconnects are discussed.

Patil, S. A.↗

Computer aided reliability, availability, and safety modeling for fault-tolerant computer systems with commentary on the HARP program

Many of the most challenging reliability problems of our present decade involve complex distributed systems such as interconnected telephone switching computers, air traffic control centers, aircraft and space vehicles, and local area and wide area computer networks. In addition to the challenge of complexity, modern fault-tolerant computer systems require very high levels of reliability, e.g., avionic computers with MTTF goals of one billion hours. Most analysts find that it is too difficult to model such complex systems without computer aided design programs. In response to this need, NASA has developed a suite of computer aided reliability modeling programs beginning with CARE 3 and including a group of new programs such as: HARP, HARP-PC, Reliability Analysts Workbench (Combination of model solvers SURE, STEM, PAWS, and common front-end model ASSIST), and the Fault Tree Compiler. The HARP program is studied and how well the user can model systems using this program is investigated. One of the important objectives will be to study how user friendly this program is, e.g., how easy it is to model the system, provide the input information, and interpret the results. The experiences of the author and his graduate students who used HARP in two graduate courses are described. Some brief comparisons were made with the ARIES program which the students also used. Theoretical studies of the modeling techniques used in HARP are also included. Of course no answer can be any more accurate than the fidelity of the model, thus an Appendix is included which discusses modeling accuracy. A broad viewpoint is taken and all problems which occurred in the use of HARP are discussed. Such problems include: computer system problems, installation manual problems, user manual problems, program inconsistencies, program limitations, confusing notation, long run times, accuracy problems, etc.

Shooman, Martin L.↗

Experimental Study on Mitigation of Lifetime-Limiting Dielectric Cracking in Extreme Temperature 4H-SiC JFET Integrated Circuits

While NASA Glenn Research Center's "Generation 10" 4H-SiC Junction Field Effect Transistor (JFET) integrated circuits (ICs) have uniquely demonstrated 500 °C electrical operation for durations of over a year, this experimental work has also revealed that physical cracking of chip dielectric passivation layers ultimately limits extreme-environment operating lifetime [1-3]. The prevention of such dielectric passivation cracks should therefore improve IC high temperature durability and yield, leading to more beneficial technology adoption into aerospace, automotive, and energy systems. This report describes Generation 10.2, 11.1, and 11.2 die tested under unbiased and unpackaged accelerated age testing at 500 °C, 600 °C, 720 °C, and 800 °C in air-atmosphere ovens for 100- and 200-hour duration. Additional samples were separately subjected to 10 thermal cycles between the same high temperatures (with 10-hour high-temperature soak each cycle) and 50 °C. It is shown that having two stoichiometric Si3N4 layers in the interconnect dielectric stack substantially decreases the amount of dielectric cracking observed following these oven tests.

Spry, D. J.↗

Evaluation of Open Cell Foam Heat Transfer Enhancement for Liquid Rocket Engine

As NASA pursues the exploration mission, advanced propulsion for the next generation of spacecraft will be needed. These new propulsion systems will require higher performance and increased durability, despite current limitations on materials. A break-through technology is needed in the thrust chamber. In this paper the idea of using a porous metallic foam is examined for its potential cooling enhancement capabilities. The goal is to increase the chamber wall cooling without creating an additional pressure drop penalty. A feasibility study based on experiments at laboratory-scale conditions was performed and analysis at rocket conditions is underway. In the experiment, heat transfer and pressure drop data were collected using air as the coolant in a copper or nickel foam filled annular channel. The foam-channel performance was evaluated based on comparison with conventional microchannel cooling passages under equal pressure drop conditions. The heat transfer enhancement of the foam channel over the microchannel ranges from 130% to 172%. The enhancement is relatively independent of the pressure drop and increases with decreasing pore size. A direct numerical simulation model of the foam heat exchange has been built. The model is based on the actual metal foam microstructure of thin ligaments (0.2- 0.3 mm in diameter) that form a network of interconnected open-cells. The cell dimension is around 2 mm. The numerical model was built using the FLUENT CFD code. Comparison of the pressure drop results predicted by the current model with those experimental data of Leong and Jin [8] shows favorable comparisons. Pressure drop predictions have been made using hydrogen as a coolant at typical rocket conditions. Conjugate heat transfer analysis using the foam filled channel is planned for the future.

Chung, J. N.↗

Estimation of End-of-Life Solar Absorptivity for Complex, Multi-Phased Space Missions

Solar absorptivity degradation over time is an important contributor to the thermal performance of a spacecraft at the end of its life. When environments are complex and include many different factors known to impact solar absorptivity degradation, such as UV, charged particles, contamination, or lunar dust coverage, combining data from several different studies can be done to estimate total degradation. While the most conservative way is to stack delta absorptivity from each factor to come up with a total delta, this may be overly conservative for long or complex missions with multiple mission phases. As absorptivity increases the rate of degradation decreases, and synergistic effects need to be taken into account. In this report an alternate method is proposed using Gateway materials as an example. This method determines which environmental factor will be dominant at what time (such as contamination or charged particles) and uses that degradation rate for that mission phase. For the next mission phase, the new absorptivity can be used instead of the original BOL absorptivity to determine degradation rate. This approach prevents overestimating optical degradation when considering degradation from interconnected sources.

Brandon Michael Hoffmann↗