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At least 271 records · Page 15

Building Reliable Printed Circuit Boards - the Lessons Learned

"Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. This one day workshop will discuss a variety of failure mechanisms that effect the functionality of PCBs. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. With the help of examples and case studies, a wide range of failure mechanisms will be discussed, case studies are focused on digital circuits, however some failures in analog, double sided boards are also presented. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues."

Sood, Bhanu↗

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗

Fully Printed High-Frequency Phased-Array Antenna on Flexible Substrate

To address the issues of flexible electronics needed for surface-to-surface, surface-to-orbit, and back-to-Earth communications necessary for manned exploration of the Moon, Mars, and beyond, a room-temperature printing process has been developed to create active, phased-array antennas (PAAs) on a flexible Kapton substrate. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proven feasible for phased-array antenna systems. The carrier mobility of an individual CNT is estimated to be at least 100,000 sq cm/V(dot)s. The CNT network in solution has carrier mobility as high as 46,770 sq cm/V(dot)s, and has a large current-density carrying capacity of approx. 1,000 mA/sq cm , which corresponds to a high carrying power of over 2,000 mW/ sq cm. Such high carrier mobility, and large current carrying capacity, allows the achievement of high-speed (>100 GHz), high-power, flexible electronic circuits that can be monolithically integrated on NASA s active phasedarray antennas for various applications, such as pressurized rovers, pressurized habitats, and spacesuits, as well as for locating beacon towers for lunar surface navigation, which will likely be performed at S-band and attached to a mobile astronaut. A fully printed 2-bit 2-element phasedarray antenna (PAA) working at 5.6 GHz, incorporating the CNT FETs as phase shifters, is demonstrated. The PAA is printed out at room temperature on 100-mm thick Kapton substrate. Four CNT FETs are printed together with microstrip time delay lines to function as a 2-bit phase shifter. The FET switch exhibits a switching speed of 0.2 ns, and works well for a 5.6-GHz RF signal. The operating frequency is measured to be 5.6 GHz, versus the state-of-the-art flexible FET operating frequency of 52 MHz. The source-drain current density is measured to be over 1,000 mA/sq cm, while the conventional organic FETs, and single carbon nanotube-based FETs, are typically in the mA to mA/sq cm range. The switching voltage used is 1.8 V, while the state-of-the-art flexible FET has a gate voltage around 50 V. The gate voltage can effectively control the source-drain current with an ON-OFF ratio of over 1,000 obtained at a low Vds bias of 1.8 V. The azimuth steering angles of PAA are measured at 0deg, -14.5deg, -30deg, and 48.6deg. The measured far-field patterns agree well with simulation results. The efficiency of the 2-bit 2-element PAA is measured to be 39 percent, including the loss of transmission line, FET switch, and coupling loss of RF probes. With further optimization, the efficiency is expected to be around 50-60 percent.

Chen, Yihong↗

3D printed graphene-based self-powered strain sensors for smart tires in autonomous vehicles

The transition of autonomous vehicles into fleets requires an advanced control system design that relies on continuous feedback from the tires. Smart tires enable continuous monitoring of dynamic parameters by combining strain sensing with traditional tire functions. Here, we provide breakthrough in this direction by demonstrating tire-integrated system that combines direct mask-less 3D printed strain gauges, flexible piezoelectric energy harvester for powering the sensors and secure wireless data transfer electronics, and machine learning for predictive data analysis. Ink of graphene based material was designed to directly print strain sensor for measuring tire-road interactions under varying driving speeds, normal load, and tire pressure. A secure wireless data transfer hardware powered by a piezoelectric patch is implemented to demonstrate self-powered sensing and wireless communication capability. Combined, this study significantly advances the design and fabrication of cost-effective smart tires by demonstrating practical self-powered wireless strain sensing capability.

33 ADVANCED PROPULSION SYSTEMS↗

Additively Manufactured Plastic Plasma Spectrometer

We report results in development and testing of a low resource top hat electrostatic analyzer (ESA) for space plasma measurements. This device has been additively manufactured (3D-printed) using fused deposition modeling. The classic top hat design is composed of four plastic pieces, without any surface coatings. The three conducting electrodes are printed from carbon nanotube infused polyether ether ketone (CNT-PEEK). The fourth piece, an insulating electrode support, uses pure PEEK. This ESA is designed to detect electrons in space from 10eV up to 30 keV. We demonstrate that the printed CNT-PEEK is sufficiently electrically conductive to support the fast high voltage slewing often required for high time resolution measurements. The plastic ESA has been successfully vibrated beyond standard pre-flight levels, tested under keV electron beam illumination over a wide range of temperatures, and tested under UV illumination, simulating the solar Ly-α flux. In comparison with an identical machined aluminum ESA, our CNT-PEEK ESA provides nominal energy/angle band passes, closely matching simulation. These band passes imply minimal impact from surface charging at beam energies of 2-3 keV, although more investigation is needed. We also find that the CNT-PEEK ESA provides far superior out-of-band electron rejection and UV photon rejection compared to the machined aluminum ESA. We do not detect any problems with trapped gases or outgassing. This development offers potential for significant mass savings, implementation of otherwise unattainable geometric configurations, and dramatic simplification in manufacturing and assembly processes required for development of space plasma instruments.

Quetzal Larrick↗

Characterization of Properties of Laser Powder Bed Fusion 3D-Printed Inconel 718 for Centrifugal Turbomachinery Applications

Here, this paper presents the results of a comprehensive effort to characterize the properties of Inconel 718 produced by a form of laser powder bed fusion (LPBF) additive manufacturing (AM) or 3D-printing, subsequently subjected to hot isostatic pressing (HIP) and heat treatment according to standards F3055-14a and AMS 5663, respectively. Material property data, while broadly available for traditional Inconel 718 presentations (e.g. forgings or castings), is currently lacking for the 3D-printed material. It is expected that while limited in size, the experimental data sets presented provide sufficient information to glean the capability of LPBF Inconel 718. These include: 1) Chemical composition, electron backscatter diffraction (EBSD), and x-ray energy dispersive spectroscopy (XEDS) characterization of 3D-printed material structure; 2) Tensile properties — 0.2% yield stress, ultimate stress, modulus of elasticity, and elongation to failure — based on 108 samples, as functions of temperature and sample print orientation; 3) Creep rupture data including the Larson-Miller parameter, based on 21 samples; and 4) High cycle fatigue data based on 21 samples as a function of temperature. Results are compared to available standards and/or data for forged, cast, and other AM Inconel 718. A key observation of this study, based on the EBSD results, is that while the material appears to approach full recrystallization following heat treatment, there is a detectable fraction of the material that does not fully recrystallize, resulting in a material with mechanical properties (e.g. yield stress, creep rupture) measurably lower than those of forgings, but higher than those of castings.

30 DIRECT ENERGY CONVERSION↗

A LArTPC with Vertical Drift for the DUNE Far Detector

The Far Detector of the Deep Underground Neutrino Experiment (DUNE) will be a large LArdetector located at a baseline of 1300 kilometers, 1.5 km deep underground. It is planned to bemade up of four modules, each with a total mass of 17 kt of LAr, at least the first two of which willconsist in Liquid Argon Time Projection Chambers (LArTPCs). To prove the feasibility of theLArTPC technology at the kiloton scale, the ProtoDUNE Single and Dual-Phase detectors wereconstructed and operated at the CERN Neutrino facility.This document describes the Vertical Drift detector concept, which is proposed to instrument thesecond DUNE module. It consists of a TPC where the electrons drift vertically, with a cathodesuspended at mid-height, towards anodes placed at the bottom and top of the detector. The anodeswould be made out of printed PCBs instead of wires, and the new disposition would allow the topreadout electronics to be accessible during the lifetime of the experiment. An enhanced photo-detection system is also proposed, with the photo-sensors placed on the cryostat walls and thecathode, but posing a challenge in terms of power and signal transmission. Studies are ongoingboth to overcome the technical challenges of this new design and to finalize the concept.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications

Here, in this study, electromagnetic and radiation shielding structures were fabricated by 3D printing acrylonitrile butadiene styrene (ABS) structures via fused filament fabrication and electroplating with copper (Cu) and nickel (Ni) metals. Prior to electroplating, the printed ABS materials were made conductive by surface electrodeposition of polypyrrole (PPy). ABS adsorbs the pyrrole monomer, which subsequently polymerizes via oxidation forming conductive PPy layer on the printed structures. The successful anchoring of PPy layer can be attributed to its hydrogen bonding and electrostatic interactions with ABS. Thermal analysis, optical, and electron microscopy equipped with energy dispersive X-ray were employed to characterize the printed shielding structures, while the interference and radiation shielding effectiveness were evaluated using a spectrum analyzer and dosimeter, respectively. The interference shielding was found to be effective at 60 ± 5 dB over relatively small frequency range. Shielding was also apparent against gamma and X-ray ionizing rays, but more significantly effective against beta rays. Furthermore, the Cu/Ni coating was able to reduce any heat-induced dimensional changes for the 3D printed ABS substrate without compromising the mechanical integrity.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Recycling of Printed Circuit Boards to Recover Critical Materials

The printed circuit board (PCB), a central component of most electronic devices, represents a significant fraction of the electronic product waste stream. The complex composition of PCBs, consisting of metals, polymers, and fiberglass, requires specialized recovery steps to reclaim valuable and critical materials and the safe disposal of brominated compounds. In this review paper, we describe the current state of critical material recovery and traditional recycling technologies and identify key obstacles to large-scale implementation. Metals present at high concentrations, such as copper, lead, and iron, are conventionally recovered from PCBs using hydrometallurgical, pyrometallurgical, or electrometallurgical processes. Hydrometallurgical methods achieve high selectivity through chemical leaching but pose significant challenges for effluent and reagent recovery. Pyrometallurgical methods facilitate rapid metal separation through smelting but require substantial energy and may release harmful gases. Electrometallurgical techniques produce high-purity metals but are constrained by pretreatment requirements and the consumption of energy. The non-metallic fraction of PCB waste is recycled using thermochemical conversion, microwave-aided heating, and direct recycling of epoxy–fiberglass composites, enabling material or energy recovery. The recovered polymer from direct recycling may have reduced mechanical strength and poor compatibility with new polymer matrices, and the resulting products from the thermal conversion suffer from incomplete conversion, degradation of quality, and residual contamination, as compared to synthetic polymers. Recent process developments have focused on extracting rare earth and supply-critical materials present at lower concentrations in the waste stream. The literature on existing and emerging approaches for recycling PCB wastes is reviewed to identify sustainable, economically viable, and environmentally responsible strategies for the recovery and reuse of critical materials from waste streams.

36 MATERIALS SCIENCE↗

A Fully Nonmetallic Gas Turbine Engine Enabled by Additive Manufacturing, Part II: Additive Manufacturing and Characterization of Polymer Composites

This publication is the second part of the three part report of the project entitled "A Fully Nonmetallic Gas Turbine Engine Enabled by Additive Manufacturing" funded by NASA Aeronautics Research Institute (NARI). The objective of this project was to conduct additive manufacturing to produce aircraft engine components by Fused Deposition Modeling (FDM), using commercially available polyetherimides-Ultem 9085 and experimental Ultem 1000 mixed with 10% chopped carbon fiber. A property comparison between FDM-printed and injection molded coupons for Ultem 9085, Ultem 1000 resin and the fiber-filled composite Ultem 1000 was carried out. Furthermore, an acoustic liner was printed from Ultem 9085 simulating conventional honeycomb structured liners and tested in a wind tunnel. Composite compressor inlet guide vanes were also printed using fiber-filled Ultem 1000 filaments and tested in a cascade rig. The fiber-filled Ultem 1000 filaments and composite vanes were characterized by scanning electron microscope (SEM) and acid digestion to determine the porosity of FDM-printed articles which ranged from 25 to 31%. Coupons of Ultem 9085, experimental Ultem 1000 composites and XH6050 resin were tested at room temperature and 400F to evaluate their corresponding mechanical properties. A preliminary modeling was also initiated to predict the mechanical properties of FDM-printed Ultem 9085 coupons in relation to varied raster angles and void contents, using the GRC-developed MAC/GMC program.

Polymer↗

Additive Manufacturing of Ultem Polymers and Composites

The objective of this project was to conduct additive manufacturing to produce aircraft engine components by Fused Deposition Modeling (FDM), using commercially available polyetherimdes Ultem 9085 and experimental Ultem 1000 filled with 10 chopped carbon fiber. A property comparison between FDM-printed and injection molded coupons for Ultem 9085, Ultem 1000 resin and the fiber-filled composite Ultem 1000 was carried out. Furthermore, an acoustic liner was printed from Ultem 9085 simulating conventional honeycomb structured liners and tested in a wind tunnel. Composite compressor inlet guide vanes were also printed using fiber-filled Ultem 1000 filaments and tested in a cascade rig. The fiber-filled Ultem 1000 filaments and composite vanes were characterized by scanning electron microscope (SEM) and acid digestion to determine the porosity of FDM-printed articles which ranged from 25-31. Coupons of Ultem 9085, experimental Ultem 1000 composites and XH6050 resin were tested at room temperature and 400F to evaluate their corresponding mechanical properties.

Polymer↗

Additive Manufacturing and Characterization of Ultem Polymers and Composites

The objective of this project was to conduct additive manufacturing to produce aircraft engine components by Fused Deposition Modeling (FDM), using commercially available polyetherimides - Ultem 9085 and experimental Ultem 1000 mixed with 10 percent chopped carbon fiber. A property comparison between FDM-printed and injection-molded coupons for Ultem 9085, Ultem 1000 resin and the fiber-filled composite Ultem 1000 was carried out. Furthermore, an acoustic liner was printed from Ultem 9085 simulating conventional honeycomb structured liners and tested in a wind tunnel. Composite compressor inlet guide vanes were also printed using fiber-filled Ultem 1000 filaments and tested in a cascade rig. The fiber-filled Ultem 1000 filaments and composite vanes were characterized by scanning electron microscope (SEM) and acid digestion to determine the porosity of FDM-printed articles which ranged from 25-31 percent. Coupons of Ultem 9085 and experimental Ultem 1000 composites were tested at room temperature and 400 degrees Fahrenheit to evaluate their corresponding mechanical properties.

Polymers↗

3D Printing of Polyelectrolyte Complex-Integrated Photocurable Hydrogel Resins

In this study, we developed a photocurable hydrogel resin incorporating a polyelectrolyte complex (PEC) for 3D printing. Acrylamide-based monomers were formulated with varying PEC contents (0–15 wt %) in an aqueous KBr medium to fabricate patterned porous hydrogel structures. The morphology of printed hydrogels was characterized by field-emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. Notably, the PEC5 and PEC10 formulations exhibited optimal thermal stability and compressive properties, attributed to the homogeneous distribution of PEC domains within the hydrogel matrix. Furthermore, dye adsorption experiments demonstrated excellent removal efficiency, highlighting the potential of PEC-containing hydrogels for environmental remediation applications, particularly in the treatment of dye-contaminated wastewater.

Yang, Jinchul [University of Tennesse Knoxville]↗

Procedure Parsing: A Method for Parsing Handwritten Documents into Computer-Based Procedures

The nuclear industry is heavily procedure driven, where almost everything has a step-by-step instruction that is expected to be followed in detail. Historically, these procedures were printed on paper copies. Recently, the industry transitioned towards electronic copies (i.e., PDFs on tablets). One major drive for this transition is the introduction of human error and loss of situation awareness when using paper copies. However, electronic copies of documents inherently have the same error traps as their paper cousins. Therefore, there is an increased interest in a way to utilize the information in the step-by-step guidance, but to present it in a dynamic manner that guides the user and adapts to any encountered conditions. Researchers at Idaho National Laboratory propose a flexible, automated method based on document parsing and augmented by natural language processing (NLP) techniques, to address these shortcomings and capitalize on these recent advancements in machine learning. The proposed method provides a cost-effective solution for computer-assisted procedure parsing of hand-written control room procedures, originally authored in Word or PDF formats, into instructions that can be displayed as computer-based procedures (CBP) in a modern graphical user interface. The researchers devised, implemented and demonstrated the Operating Procedure Extender for Novel Systems (OPENS) method in 2020. The key to OPENS is to map the original procedure text into a context-free grammar, tying content to equipment, locations, and other steps, actions, etc. This formal grammar is then used to isolate and define keywords and actions verbs, such as “measure” or “evaluate” and tie them to specific equipment referenced within that step or located in other steps, substeps, actions, subactions and tables throughout the procedure. OPENS generates an abstract syntax tree from the document which it uses to store a copy of this information in the open-standard, machine-readable and human-readable file formats XML and JSON. The XML is useful to preserve the relational aspects of the procedure for referencing tables and branching information so the user can be directed to the next appropriate active step based on the values entered for that step and previous steps. The JSON is useful for storing and exchanging data objects used to track responses to previous steps and state changes in simulated environments. In future iterations, these formats can also be used for storing more detailed information about input during plant operation or simulation. The techniques the researcher developed could further be improved by integration of recent advancements in machine learning. NLP methods could standardize documents, correct for grammatical error, and provide automated semantic validation. The researcher expects that self-supervised techniques applied to collections of natural language instructions could strengthen the model with broader context. All these methods together give us a practical way to automatically extract protocols from documents and user interactions, empowering researchers, procedure writers and nuclear operators while moving the industry forward.

99 GENERAL AND MISCELLANEOUS↗

Long life assurance study for manned spacecraft long life hardware. Volume 4: Special long life assurance studies

Guidelines for the selection of equipment to be used for manned spacecraft in order to assure a five year maintenance-free service life were developed. A special study was conducted to determine the adequacy of the procedures used to determine the quality and effectiveness of various components. The subjects examined are: (1) temperature cycling for acceptance of electronic assemblies; (2) accelerated testing techniques; (3) electronic part screening techniques; (4) electronic part derating practices; (5) vibration life extension of printed circuit board assemblies; and (6) tolerance funnelling and test requirements.

Source record↗

Life support subsystem monitoring instrumentation

The recognition of the need for instrumentation in manned spacecraft life-support subsystems has increased significantly over the past several years. Of the required control and monitoring instrumentation, this paper will focus on the monitoring instrumentation as applied to life-support subsystems. The initial approach used independent sensors, independent sensor signal conditioning circuitry, and independent logic circuitry to provide shutdown protection only. This monitoring system was replaced with a coordinated series of printed circuit cards, each of which contains all the electronics to service one sensor and provide performance trend information, fault detection and isolation information, and shutdown protection. Finally, a review of sensor and instrumentation problems is presented, and the requirement for sensors with built-in signal conditioning and provisions for in situ calibration is discussed.

Powell, J. D.↗

Electron Beam Welding of Additively Manufactured Niobium Alloy Heat Pipes

Additively manufactured refractory alloy-liquid metal heat pipes are being developed and tested for thermal management systems within nuclear propulsion and power applications. This study investigated electron beam (EB) welded joints on a laser powder bed fusion printed niobium alloy (C-103) and the impact of multiple joined heat pipe sections on working fluid flow and container leak-tightness. Results showed that EB welded joints connecting multiple heat pipe sections do not impact working fluid wicking behavior and the printed C-103 material and the EB welds joining the tubular sections created a leak-tight container. Interestingly, CT data showed an order of magnitude greater number and volume of porosity indications in the ground mating surface weld compared to the as-printed mating surface weld. The work concluded that AM is a viable manufacturing process for niobium alloy heat pipes and provided valuable insights for future AM heat pipe research and development.

Electron beam welding↗

Multiphysics simulation of microscale copper printing by confined electrodeposition using a nozzle array

3D printing of metals at the microscale and nanoscale is crucial to produce high-density interconnects and intricate structures in electronic devices. Conventional melting and sintering processes are not suitable for these scales due to a reliance on individual metal particles in the size range of tens of micrometers. Confined electrodeposition (CED) is an established alternative to conventional metal 3D printing processes in which an electrolyte is used to selectively induce deposition of the metal on the printing surface. However, commercialization and efficiency of this process have been limited due to a reliance on sub-micrometer nozzles to achieve desirable deposition rates and single nozzle to achieve uniformity of printed structures. Here, we address these challenges by computationally analyzing an array of microscale nozzles. We tailor the convection within the electrolyte to alter both deposition rate and geometric uniformity of the printed structures. The results show that for large nozzles the evaporation alone is not sufficient to obtain high deposition rates, yet an external pressure can be used to increase deposition and alter uniformity (thickness) of printed structures. Our results can be used to design and analyze new experiments toward parallel multi-nozzle deposition using CED toward high-throughput metal printing.

3D printing↗