Price estimates for the production of wafers from silicon ingots
The status of the inside-diameter sawing, (ID), multiblade sawing (MBS), and fixed-abrasive slicing technique (FAST) processes are discussed with respect to the estimated price each process adds on to the price of the final photovoltaic module. The expected improvements in each process, based on the knowledge of the current level of technology, are projected for the next two to five years and the expected add-on prices in 1983 and 1986 are estimated.