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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Development and Application of Microfabricated Chemical Gas Sensors For Aerospace Applications

Aerospace applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. In particular, factors such as minimal sensor size, weight, and power consumption are particularly important. Development areas which have potential aerospace applications include launch vehicle leak detection, engine health monitoring and control, and fire detection. Sensor development for these applications is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors. 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity. 3) The development of high temperature semiconductors, especially silicon carbide. Sensor development for each application involves its own challenges in the fields of materials science and fabrication technology. This paper discusses the needs of space applications and the point-contact sensor technology being developed to address these needs. Sensors to measure hydrogen, hydrocarbons, nitrogen oxides (Nox, carbon monoxide, oxygen, and carbon dioxide are being developed. A description is given of each sensor type and its present stage of development. Demonstration and application these sensor technologies will be described. The demonstrations range from use of a microsystem based hydrogen sensor on the Shuttle to engine demonstration of a nanocrystalline based sensor for NO, detection. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.

Hunter, G. W.↗
NASA NTRS2001

Microfabricated Chemical Sensors for Aerospace Fire Detection Applications

The detection of fires on-board commercial aircraft is extremely important for safety reasons. Although dependable fire detection equipment presently exists within the cabin, detection of fire within the cargo hold has been less reliable and susceptible to false alarms. A second, independent method of fire detection to complement the conventional smoke detection techniques, such as the measurement of chemical species indicative of a fire, will help reduce false alarms and improve aircraft safety. Although many chemical species are indicative of a fire, two species of particular interest are CO and CO2. This paper discusses microfabricated chemical sensor development tailored to meet the needs of fire safety applications. This development is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors. 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity. 3) The development of high temperature semiconductors, especially silicon carbide. The individual sensor being developed and their level of maturity will be presented.

Hunter, Gary W.↗
NASA NTRS2005

New Deep Reactive Ion Etching Process Developed for the Microfabrication of Silicon Carbide

Silicon carbide (SiC) is a promising material for harsh environment sensors and electronics because it can enable such devices to withstand high temperatures and corrosive environments. Microfabrication techniques have been studied extensively in an effort to obtain the same flexibility of machining SiC that is possible for the fabrication of silicon devices. Bulk micromachining using deep reactive ion etching (DRIE) is attractive because it allows the fabrication of microstructures with high aspect ratios (etch depth divided by lateral feature size) in single-crystal or polycrystalline wafers. Previously, the Sensors and Electronics Branch of the NASA Glenn Research Center developed a DRIE process for SiC using the etchant gases sulfur hexafluoride (SF6) and argon (Ar). This process provides an adequate etch rate of 0.2 m/min and yields a smooth surface at the etch bottom. However, the etch sidewalls are rougher than desired, as shown in the preceding photomicrograph. Furthermore, the resulting structures have sides that slope inwards, rather than being precisely vertical. A new DRIE process for SiC was developed at Glenn that produces smooth, vertical sidewalls, while maintaining an adequately high etch rate.

Evans, Laura J.↗
NASA NTRS2002

Development of electroplated magnetic materials for MEMS

Soft ferromagnetic materials have thus far found the most utility in magnetic-MEMS, because the technologies necessary for depositing and micromachining them have been well developed previously by the data storage industry.

MEMS magnetic materials↗
NASA NTRS2002

Dynamics of vibratory microgyroscopes

In this report we provide a vectorial derivation of the equations of motion characterizing the dynamite behavior of both ideal and non-ideal vibratory micromachined gyroscopes.

MEMS gyroscopes vibratory gyroscopes↗
NASA NTRS1994

Microtechnology in Telecommunications for Spacecraft Cost and Mass Reduction

This paper examines the incorporation of both microelectronics and micromachining (termed microtechnologies) as applied to deep space telecommunication subsystems. Using the Pluto Fast Flyby Pre-Project as a main case study we have reduced the subsystem mass by 50%.

MCM amplifiers filters switches Goldstone Deep Spa↗
NASA NTRS1993

A New Force Balanced Accelerometer Using Tunneling Tip Position Sensing

In this paper, we report the initial development of a single-axis bulk micromachined accelerometer. The device employs an electron tunneling tip as a position detector in a force feedback control system. Control electrodes are placed above and below the proof mass and act as electrostatic force plates. Using the force plates, the position of the proof mass relative to the tunneling tip can be controlled.

accelerometers sensors position detectors↗
NASA NTRS1993

Microinstruments for a Low Power, Low Mass Weather Station

Advances in electronics and instrument technology over the past thirty years have enabled a new concept for NASA missions, an evolution from large Voyager-class spacecraft to smaller, less costly Discovery and Explorer missions. By taking advantage of micromachining and micro-instrumentation, this reduction in size can be accomplished without requiring a sacrifice in performance. In some cases, the small payload will enable new types of missions which would be otherwise inconceivable. A microweather station is envisioned as an enabling technology for a network of weather stations on Mars for measuring wind, temperature, pressure, humidity, and aerosol concentration in the Martian planetary boundary layer...

Hoenk, M. E.↗
NASA NTRS2002

NEMS for space and terrestrial applications

Nanoscale electromechanical systems (NEMS) techniques were used to manufacture a membrane used to supply singly charged un-fractured ions for mass spectrometry. The innovative nanostructure, developed at the Jet Propulsion Laboratory (JPL), is a major advance over micromachined 'volcano' field ionization devices and filaments or other energy-intensive devices, achieving nearly 100% ionization of gases and vapors without appreciable fracture.

Nanoscale electromechanical systems NEMS soft ioni↗
NASA NTRS1998

Micro Inertial Reference System for Microspacecraft

This paper reports on the development of a silicon bulk micromachined vibratory gyroscope designed for a micro inertial reference system for microspacecraft applications.

Micro inertial reference system microspacecraft si↗
NASA NTRS1995

Design and Process Considerations for a Tunneling Tip Accelerometer

In this paper, we discuss issues related to the fabrication of a bulk micromachined single axis accelerometer. The accelerometer is designed to have a full scale range of ten millig and a sensitivity of tens of nanog. During the process, three distinctly different die are fabricated. These are subsequently assembled using an ally bonding technique. During the bonding operation, electrical contacts are made between layers. The accelerometer is controlled by electrostatic force plates above and below the proof mass. The lower electrode has a dual role. In operation, it provides a necessary control electrode. When not in operation, it is used to clamp the proof mass and prevents its motion. Results of the fabrication process and initial testing of the clamping function are reported.

tunneling tip accelerometer, accelerometer fabrica↗
NASA NTRS2004

Isolated post resonator mesogyroscope

A new symmetric vibratory gyroscope principle has been devised in which a central post proof mass is counter-rocked against an outer sensing plate such that the motion is isolated from the gyroscope case. Prototype gyroscopes have been designed and fabricated with micromachined silicon at mesoscale (20-cm resonator width), vs. microscale (e.g., 2-mm resonator width) to achieve higher sensitivity and machined precision. This novel mesogyro design arose out of an ongoing technical cooperation between JPL and Boeing begun in 1997 to advance the design of micro-inertial sensors for low-cost space applications. This paper describes the theory of operation of the mesogyro and relationships with other vibratory gyroscopes, the mechanical design, closed loop electronics design, bulk silicon fabrication and packaged gyroscope assembly and test methods. The initial packaged prototype test results are reported for what is believed to be the first silicon mesogyroscope.

mesogyroscope↗
NASA NTRS2006

Temperature-dependent Refractive Index of Silicon and Germanium

Silicon and germanium are perhaps the two most well-understood semiconductor materials in the context of solid state device technologies and more recently micromachining and nanotechnology. Meanwhile, these two materials are also important in the field of infrared lens design. Optical instruments designed for the wavelength range where these two materials are transmissive achieve best performance when cooled to cryogenic temperatures to enhance signal from the scene over instrument background radiation. In order to enable high quality lens designs using silicon and germanium at cryogenic temperatures, we have measured the absolute refractive index of multiple prisms of these two materials using the Cryogenic, High-Accuracy Refraction Measuring System (CHARMS) at NASA's Goddard Space Flight Center, as a function of both wavelength and temperature. For silicon, we report absolute refractive index and thermo-optic coefficient (dn/dT) at temperatures ranging from 20 to 300 K at wavelengths from 1.1 to 5.6 pin, while for germanium, we cover temperatures ranging from 20 to 300 K and wavelengths from 1.9 to 5.5 microns. We compare our measurements with others in the literature and provide temperature-dependent Sellmeier coefficients based on our data to allow accurate interpolation of index to other wavelengths and temperatures. Citing the wide variety of values for the refractive indices of these two materials found in the literature, we reiterate the importance of measuring the refractive index of a sample from the same batch of raw material from which final optical components are cut when absolute accuracy greater than k5 x 10" is desired.

Frey, Bradley J.↗
NASA NTRS2007

Comparing the Robustness of High-Frequency Traveling-Wave Tube Slow-Wave Circuits

A three-dimensional electromagnetic field simulation software package was used to compute the cold-test parameters, phase velocity, on-axis interaction impedance, and attenuation, for several high-frequency traveling-wave tube slow-wave circuit geometries. This research effort determined the effects of variations in circuit dimensions on cold-test performance. The parameter variations were based on the tolerances of conventional micromachining techniques.

Chevalier, Christine T.↗
NASA NTRS2007

Fabrication of a Thermally Isolated and Pre-amplified Transistor Module with Polyimide Micro-wires for Cryogenic Detectors

For use in cryogenic applications such as bolometer and x-ray microcalorimeter arrays, pre-amplifying Junction Field Effect Transistors (JFETs) are often required for the readout electronics. The optimum operating temperature of the JFETs is 130 Kelvin while the cryogenic detectors operate in the milli-Kelvin range. Thus, the JFETs must be heated up but thermally isolated from the surrounding cryogenic instruments. In the past, the thermal isolation was accomplished by suspending the JFETs with low conductance wires such as manganium or stainless steel on a Kevlar support platform [I]. This also achieved electrical connections. However, this assembly required manual soldering work, which could raise a reliability issue for the cryogenic applications. In order to eliminate the manual work, polyimide micro-wires were developed [2]. The wires must be of sufficient length to decrease the heat load and in tension to prevent microphonic noise from vibration of the wires: the polyimide wires were patterned into llS"shaped curves over a thin metal wires such as aluminum, titanium, or niobium. The bilayer of the films were then suspended by etching silicon substrate thus to make freestanding air bridges (enough explanation?). In this paper, we present a method to fabricate micromachined JFET mechanical modules suspended by polyimide Pyraline micro-wires and heated up with built-in aluminum micro-heaters.

Oh, L. H.↗