Encapsulated adhesive systems and their potential applications
Microencapsulation of bonded reactive resins in packaging, logistics and adhesive applications at room and elevated temperatures
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Microencapsulation of bonded reactive resins in packaging, logistics and adhesive applications at room and elevated temperatures
Compound formed from dimethylpolysiloxane, ammonium phosphate, and ground glass is nonflammable in air environment and self-extingushing in atmosphere of 60 percent oxygen and 40 percent nitrogen. Material may have applications for reducing industrial fire hazards and should interest aircraft industry, machinery manufacturers, and automotive industry.
The overall program objective was to develop a flexible compound which not only functioned in a manned aerospace environment as an effective electrical insulation, but whose flammability characteristics in 16.5 psia, 60% oxygen/40% nitrogen were evidenced by rapid self-extinguishment and minimal thermal (pyrolysis) degradation. The following polymeric matrices were examined in depth: fluoroelastomers, modified fluoroelastomers, silicone RTV's, and modified silicone and fluorosilicone RTV's. Almost none of these systems burned in air, but all burned in 6.2 psia oxygen. Inorganic, organic, and inorganic/organic additives were evaluated in conjunction with these polymers in order to achieve the required survival in the 16.5 psia 60/40 environment. Depending upon formulations, it was possible to achieve nonflammable products when tested in the 1/4 in. x 1/4 in. x 1 in. configuration, even up to and including 16.5 psia oxygen. However, in order to assure this level of flame resistance, it was found necessary to heavily load the matrix with the additives. This resulted in a significant reduction in mechanical properties and large increases in viscosities. Optimization of formulations to obtain a suitable balance between these properties and flammability resistance led to the final selection of Formulation 387 as the primary system.
Oxide-passivated semiconductor chip is given protective glass coating by means of vapor deposition over metallic substrate of integrated circuit (IC). Method provides more reliable oxide-passivation and hermetic sealing in current use. Chips and scratches incurred during dicing, testing, and assembly are markedly reduced.
Two fluorosilicone rubber formulations have been produced which are nonflammable or self-extinguishing. Extensive report was prepared which includes information on testing and describes many alternate formulations.
The effect of high humidity (95% RH) at 60 C, 70 C, 85 C and 100 C on the solid-to-liquid reversion of polyurethane elastomers (used for potting electrical connectors and conformal coating printed circuit boards) was investigated. Hardness measurements were conducted on eleven elastomers to track reversion for a 101-day period. The primary purpose of the tests was to provide data to predict service life for the polyurethane elastomers. This was not accomplished as the hardness did not deteriorate rapidly enough at the lower test temperatures. The tests did determine that the potting and coating materials most widely used on the S-1C Program are susceptible to reversion but appear adequate for service in the S-1C environment.
Based upon extensive contacts with vendors, a broad array of non-flammable polymeric specie, and additives generally noted to have flame retarding properties, were considered. The following polymeric matrices were examined: modified silicone and fluorosilicone RTV's polyesters, epoxies, urethanes, and epoxy-urethanes. Optimization of formulations to obtain a suitable balance between the various properties and flammability resistance led to the final selection of a silicone RTV/additive-loaded compound which meets almost all program requirements. The very low valued properties found are within a realistic level of design toleration. Complete formulation, processing, and test data is provided for this compound, EPOCAST 87517-A/B, and the other formulations prepared by the project. Details of those test methods are presented along with procedures utilized in the program. In addition, a description of the special flammability facility previously designed and then modified for this program is also presented.
Tables are presented which include: material properties; elemental analysis; silicone RTV formulations; polyester systems and processing; epoxy preblends and processing; urethane materials and processing; epoxy-urethanes elemental analysis; flammability test results, and vacuum effects.
Appendices are presented which include: statement of work; material vendor contacts; formulation/processing data sheet; upward propagation test; flammability test conditions/results sheet; odor test; vacuum stability requirements; flammability test facility; determination of offgassing products and carbon monoxide test; and pneumatic and mechanical impact test guidelines.
Techniques involving softening or dissolving of potting materials leaves electronics unaffected. Procedure may be used with almost any solvent or plastic within acceptable temperature and pressure ranges.
The experiment was designed to detect possible convection caused by a steplike compositional variation in a liquid metal in a microgravity environment. Wetting and nonwetting ampoules were used to try to determine the extent of the stirring effects if they were present. Since stirring effects can be caused by temperature gradients, the temperature gradients were minimized. Steplike compositional variation was created by pressure bonding a lead-0.05 atom percent gold alloy to pure lead. Two diffusion temperatures (923 K and 723 K) were used; if no stirring effects were present, it was hoped that the liquid diffusion parameters for gold in lead could be obtained. Two identifical experimental arrangements were used to compare the transport mechanisms of gold in liquid lead in unit gravity and microgravity environments.
This experiment was designed to determine the extent of surface tension induced convection caused by a steplike compositional variation in a liquid metal. Preliminary results are presented.
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Reflector directs intense, sharply focused heat precisely where it is needed for zone-refining semiconductor materials. Reflector is especially suited for compound semiconductors which must be sealed inside capsule to prevent vaporizing during zone refining. Device is flattened toroid with elliptical-cross-section, much like horizontal partly-inflated inner tube.
A development program was performed for evaluating, modifying, and optimizing the Lockheed formulated liquid transparent filmforming Spraylon fluorocarbon protective coating for silicon solar cells and modules. The program objectives were designed to meet the requirements of the low-cost automated solar cell array fabrication process. As part of the study, a computer program was used to establish the limits of the safe working stress in the coated silicon solar cell array system under severe thermal shock.
The liquid transparent film-forming, fluorocarbon, Spraylon, a protective coating for terrestrial solar cell modules was evaluated. Two modules were completed and field tested. Problems developed early in the field testing which led to the shortened test period, specifically, lifting of the antireflection coating, followed in some areas by complete film delamination. It is believed that although these problems were certainly induced by the presence of the SPRAYLON film, they were not failures of the material per se. Instead, assembly procedures, module design, and cell coating quality should be evaluated to determine cause of failure.
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The status of development of the techniques for employing electrostatic bonding in conjunction with terrestrial solar cells is presented.