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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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257 records · Page 15
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Hydrogen and deuterium tunneling in niobium

We use density functional methods to identify the atomic configurations of H and D atoms trapped by O impurities embedded in bulk Nb. The O atoms are located at the octahedral position in the Nb body-centered cubic (BCC) lattice, and H (D) atoms tunnel between two degenerate tetrahedral sites separated by a mirror plane. Using nudged elastic band (NEB) methods, we calculate the double-well potential for O-H and O-D impurities and the wave functions and tunnel splittings for H and D atoms. Our results agree with those obtained from analysis of heat capacity and neutron scattering measurements on Nb with low concentrations of O-H and O-D.

density functional theory↗
DOE OSTI2022

On the Feasibility of 1T Ferroelectric FET Memory Array

To fully exploit the ferroelectric field effect transistor (FeFET) as compact embedded nonvolatile memory for various computing and storage applications, it is desirable to use a single FeFET (1T) as a unit cell and arrange the cells into an array. However, many write mechanisms for an 1T FeFET array reported in the literature are yet to be validated experimentally. In this work, we performed a comprehensive experimental characterization on the write operations in an 1T- NOR and 1T- AND array using n-channel bulk FeFETs. We discovered that: 1) the source/drain contact can only supply minority carriers (i.e., electrons) to the channel for polarization screening during the low- V TH state programming; 2) the body contact can not only supply majority carriers (i.e., holes) for efficient high- V TH state write, but also depletion charge for low- V TH state programming, though with lower efficiency; and 3) during the low/high- V TH programming, only the path that can supply negative/positive screening charges, respectively, need to respond, which necessitates the application of proper write biases on the corresponding terminal. Based on the understanding of these write mechanisms, we show the importance of localized body contact or column-wise body contact for the successful high- V TH state programming. We also show that the previously proposed C- AND write scheme fails to program the FeFET to the low- V TH state for our devices. Finally, we propose several write schemes for both 1T- AND and 1T- NOR arrays for various scenarios providing insights for choosing the appropriate write scheme, which will facilitate the adoption of 1T FeFET memory arrays for emerging applications.

FeFET↗
DOE OSTI2022

Mooring System Cost Estimates for Wave Energy Farms in Shared Mooring Arrays

As wave energy converters (WECs) become more advanced and cost-efficient, so too must their mooring systems. A key question in the development plans for WECs is the cost of the mooring system, particularly for large wave farms. WEC devices deployed in a WEC farm array, where each device can be connected by shared mooring lines in various array layouts, have potential to reduce mooring system costs significantly. This paper presents the modeling and designing of mooring systems for large WEC arrays and the calculation of the cost of each mooring system to determine the change in cost as the number of WECs in a farm increases. A baseline mooring system for a single floating oscillating water column (OWC) WEC was developed for this analysis. The mooring system utilizes four anchored mooring lines connected to a square assembly of wire rope mooring lines, supported by four floating buoys, and attached to the floating WEC by four polyester rope mooring lines. This assembly, referred to as a floating cell, can be tiled to form various rectangular WEC arrays. The objective of this analysis is to determine how the mooring system cost changes as more WECs are added to an array layout, each with their own interconnected floating cell. To do this, complete mooring systems need to be designed for each WEC array layout. To narrow down the design space of a WEC array mooring system, a couple assumptions were made. It was assumed that the floating cell parameters of the baseline design were to stay constant across all floating cells in the WEC array. It was also assumed that the anchored mooring lines would be of the baseline configuration, a predominantly chain mooring line with a short section of polyester rope near the fairlead, and a drag-embedment anchor. These anchored lines were assumed to extend from the outer edges of the WEC array, inline with the headings of the wire rope mooring lines of the floating cells, or diagonal if extending from a corner of the WEC array. Full mooring systems were designed for 2xN and NxN WEC array layouts and efficiently simulated in the mooring dynamics simulation tool, MoorDyn, to ensure all dynamic constraints were met. The system costs were calculated and then refined by shortening unnecessary chain line lengths and reducing the chain diameters of the downstream anchored mooring lines. It was found that, in general, mooring system costs per WEC decrease when WECs are installed in an array. Compared to the baseline mooring system for a single WEC, the 2x3 mooring system array had the lowest mooring system cost per WEC, reducing the cost per WEC by 59%. The 3x3 and 4x4 array mooring systems also saw significant reductions in cost per WEC but had negligible cost savings between the two designs, primarily because the larger 4x4 mooring system requires larger chain diameters, which increases cost. These results provide an interesting glimpse into modeling, designing, and calculating the cost of mooring systems for large WEC arrays.

cost↗
DOE OSTI2023

Benchmarking Microscale Ductility Measurements (Final Report of the Project DE-NE0008799)

Conventional macroscale experimentation is generally considered to be straightforward with few limitations. Conversely, micro/nanoscale experimentation presents numerous challenges in loading device design, sample preparation and handling, as well as accurate understanding of grain size and local texture effects on recorded measurements. Despite these challenges, nanopillar compression, MEMs based micro-tension, and nanoindentation approaches have been able to provide fundamental contributions to the understanding of material behavior at small lengthscales. However, the overarching shortcoming of these micro/nanoscale experimentation approaches, is the inability to directly translate measurements evaluated at the nm and µm length scales (e.g., hardness) to macroscale tensile material behavior (i.e., elastic modulus, yield strength, and ductility). The objectives of the proposed study are, 1) to establish best practices for obtaining tensile microscale ductility measurements, and 2) to validate methodologies to for comparing microscale ductility measurements to macroscale ductility measurements. In order to achieve these objectives, a multi-lengthscale, multi-temperature testing protocol and simulation framework are executed first on copper as a model material to validate the following approach, and second on reactor grade Zircaloy-2. Experiments are conducted on specimens extracted from the same test piece to ensure nominally identical grain size and texture from specimens to specimen. Motivated by the need to isolate the contribution of size-effects on obtained mechanical property measurements, specimens are manufactured with thicknesses at the micro- (1-10 µm), meso- (10-100's µm), and macroscales (sub-sized ASTM E8). In-situ full-field deformation techniques (scanning electron microscopy (SEM) grid methods and optical DIC) are incorporated into testing at each specimen length-scale to capture plasticity localization and evolution. Experimental testing for all specimens is conducted at both room temperature and elevated temperatures to probe the role of thermal activation on plastic deformation accommodation processes. Simulation efforts focus on examining the mechanical behavior of microscale specimens using a finite element approach with explicitly resolved grain morphologies, and an embedded crystal plasticity model. The cost-efficient implementation method allows for the modeling of a statistically significant number of both real (i.e., digital twin) and generated microstructures to obtain an understanding of the interrelationships between specimen microstructure and geometric variables (grain size, texture, specimen geometry, etc.) on microscale mechanical behavior.

36 MATERIALS SCIENCE↗
DOE OSTI2023

PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling

Lateral gallium nitride (GaN) high-electron-mobility transistors (HEMTs) present better electrical characteristics compared to silicon or silicon carbide devices such as high switching speed and low gate charge, but also present additional challenges on the module design. Here, this paper discusses a high-density GaN power module with double-sided cooling, low inductance, on-package decoupling capacitors, and integrated gate drivers. The GaN dies as well as the gate drive are sandwiched between the printed circuit board (PCB) and direct bonded copper (DBC) substrate to achieve compact loop and double-sided cooling effect. Design considerations and thermal performance are analyzed. A module assembly procedure is presented utilizing the layer-by-layer attachment process. Finally, a 2.7 cm x 1.8 cm half-bridge GaN power module is fabricated and tested, achieving a low power-loop inductance of 1.03 nH, and the overshoot voltage of the switching waveform is less than 5% under a 400-V/25-A double-pulse test. The thermal resistance is 0.32 K/W, verified by simulation and experimental results. The design and assembly process can be generalized and applied to high power applications to achieve high power density and high performance.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗