Diffuse-Interface Modeling and Multiscale-Relay Simulation of Metal Oxidation Kinetics-With Revisit on Wagner's Theory
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Abstract Compared to other computational physics areas such as codes for general computational fluid dynamics, the documentation of verification methods for plasma fluid codes remains under developed. Current analytical solutions for plasma are often highly limited in terms of testing highly coupled physics, due to the harsh assumptions needed to derive even simple plasma equations. This work highlights these limitations, suggesting the method of manufactured solutions (MMSs) as a potential option for future verification efforts. To demonstrate the flexibility of MMS in verifying these highly coupled systems, the Multiphysics Object-Oriented Simulation Environment (MOOSE) framework was utilized. Thanks to the MOOSE framework’s robustness and modularity, as well as to its physics module capabilities and ecosystem applications (i.e. Zapdos and the chemical reaction network) developed for plasma physics modeling and simulation, this report lays the groundwork for a structured method of conducting plasma fluid code verification.
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Here, using the spin Seebeck effect (SSE), we study the propagation distance of thermally induced spin currents inside a magnetic insulator thin film in the short-range regime. We disambiguate spin currents driven by temperature and chemical potential gradients by comparing the SSE signal before and after adding a heat-sinking capping layer on the same device. We report that the measured spin decay behavior near the heat source is well accounted for by a diffusion model where the magnon diffusion length is in submicron range, in other words, two orders of magnitude smaller than previous estimates inferred from the long-range behavior. Our results highlight the caveat in applying a diffusive theory to describe thermally generated magnon transport, where a single decay length may not capture the behavior on all length scales.
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Abstract. Soil thickness plays a central role in the interactions between vegetation, soils, and topography, where it controls the retention and release of water, carbon, nitrogen, and metals. However, mapping soil thickness, here defined as the mobile regolith layer, at high spatial resolution remains challenging. Here, we develop a hybrid model that combines a process-based model and empirical relationships to estimate the spatial heterogeneity of soil thickness with fine spatial resolution (0.5 m). We apply this model to two aspects of hillslopes (southwest- and northeast-facing, respectively) in the East River watershed in Colorado. Two independent measurement methods – auger and cone penetrometer – are used to sample soil thickness at 78 locations to calibrate the local value of unconstrained parameters within the hybrid model. Sensitivity analysis using the hybrid model reveals that the diffusion coefficient used in hillslope diffusion modeling has the largest sensitivity among all input parameters. In addition, our results from both sampling and modeling show that, in general, the northeast-facing hillslope has a deeper soil layer than the southwest-facing hillslope. By comparing the soil thickness estimated between a machine-learning approach and this hybrid model, the hybrid model provides higher accuracy and requires less sampling data. Modeling results further reveal that the southwest-facing hillslope has a slightly faster surface soil erosion rate and soil production rate than the northeast-facing hillslope, which suggests that the relatively less dense vegetation cover and drier surface soils on the southwest-facing slopes influence soil properties. With seven parameters in total for calibration, this hybrid model can provide a realistic soil thickness map with a relatively small amount of sampling dataset comparing to machine-learning approach. Integrating process-based modeling and statistical analysis not only provides a thorough understanding of the fundamental mechanisms for soil thickness prediction but also integrates the strengths of both statistical approaches and process-based modeling approaches.
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