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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15
All sourcesNASA NTRSDOE OSTI
NASA NTRS1966

Hole saw drill attachment has zero force reaction

Zero reaction tools require no force application by workers in space. The tool accomplishes hole cutting by holding the workpiece and feeding the cutting blade into and through it by forces entirely absorbed within the tool.

Holmes, A. E.↗
NASA NTRS1972

Stratigraphy of the Apollo 15 drill core

The crew of Apollo 15 collected at 242-centimeter-long core of the regolith of the moon developed on the surface of Palus Putredinis 3 deg 39 min 20 sec E, 26 deg 26 min 00 sec N. The 2.04-centimeter-diameter core, which has a mass of 1333.2 grams, consists of 42 major textural units, with thicknesses ranging from a few milliliters to 13 centimeters thick. The regolith is not homogeneous and is composed of many layers that are mostly ejecta from impact events.

Heiken, G.↗
NASA NTRS1973

Preliminary stratigraphy of the Apollo 15 drill core

The crew of Apollo 15 collected a 242-cm-long core of the regolith developed on the surface of Palus Putredinus (3 deg 39 min 20 sec E, 26 deg 26 min 00 sec N). This core consists of 42 major textural units, which range from a few millimeters to 13 cm thick. The regolith at this site was deposited layer by layer, each layer having been reworked, to some degree, by micrometeorite bombardment. The particle composition of six layers for which samples were obtained varies in a random fashion, thus supporting the heterogeneous, layered model of the regolith. The ratio of lithic fragments derived from the Apennine Front to that derived from the mare surface is about 1:1. This lithic ratio, in a regolith section 3.75 km from the base of the front, is an indication of the efficiency of lateral transport of soil by impact processes and mass wasting.

Heiken, G.↗
NASA NTRS1977

Laser drilling of vias in dielectric for high density multilayer LSHI thick film circuits

A design analysis of a high density multilevel thick film digital microcircuit used for large scale integration is presented. The circuit employs 4 mil lines, 4 mil spaces and requires 4 mil diameter vias. Present screened and fired thick film technology is limited on a production basis to 16 mil square vias. A process whereby 4 mil diameter vias can be fabricated in production using laser technology was described along with a process to produce 4 mil diameter vias for conductor patterns which have 4 mil lines and 4 mil spacings.

Cocca, T.↗