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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14

Oxide Dispersion Strengthened Ferritic Steel Wire Feedstock Development for Large Format Additive Manufacturing - CRADA 620 (Abstract)

This CRADA project funded through DOE’s INFUSE program seeks to demonstrate the viability of fabricating large, complex parts from oxide dispersion strengthened (ODS) steel with advanced manufacturing. Exhibiting excellent radiation tolerance and high mechanical performance at elevated temperatures, ODS steel is a promising structural material candidate for near-plasma components in fusion energy systems. Its use, however, has been limited by a lack of manufacturability. This project will seek to produce ODS steel wire through a solid-state shear assisted extrusion process and then demonstrate that the wire can undergo controlled local melting while being welded with the final part sufficiently retaining the beneficial properties of ODS steel. This would allow the use of wire-arc additive manufacturing (WAAM) to manufacture large-scale ODS parts, even though ODS is currently only available as a powder. WAAM is a promising technique for producing components like the replaceable ARC vacuum vessel in CFS’ fusion reactor design. Meanwhile, this project will also expand PNNL’s capability in producing custom wire feedstock with friction extrusion, enabling downstream large-scale manufacturing with WAAM and solid-state based additive manufacturing.

36 MATERIALS SCIENCE↗

Rapid Bayesian High Entropy Alloy Designs Fabricated via Wire Arc Additive Manufacturing

Purpose: This project seeks to demonstrate a new high-throughput (rapid) alloy design technique applied to creating new high entropy alloys (HEAs) for extreme environments. High entropy alloys shift the design paradigm from being focused on a single principal element (e.g. nickel-based alloys) to target alloys that include high atomic fractions (X >10%) of multiple elements. These HEA materials can exhibit sluggish diffusion and enhanced corrosion resistance, ideal for potential applications in advanced ultra supercritical (A-USC) steam cycles for power generation. Scope: The addition of multiple elements in high atomic fractions creates an enormous design space that cannot easily be investigated by traditional material design strategies such as designed of experiments (DOE). This project utilizes a Bayesian machine learning algorithm that has been modified to work with calculation of phase diagrams (CALPHAD) software. This Bayesian algorithm reduces manual inputs and increase the likelihood of achieving an optimal solution. Compositional inputs to this algorithm will be assessed using existing material property models for high temperature strength and corrosion resistance. The target for alloy performance will be a 15% (~100 ⁰C) increase in allowable service temperature beyond heat-resistant stainless steels while maintaining or improving alloy cost and corrosion resistance. Haynes 230 was selected as a baseline, which is 57 wt% Ni with 22 wt% Cr 14 wt% W, and 2 wt% Mo as solid solution strengtheners. In addition to rapid design via Bayesian machine learning, the alloys were rapidly fabricated using a multi-wire arc additive manufacturing (mWAAM) technique which allows for precise control of alloy composition and assessing of alloy design “windows” to study composition effects. Build speeds for wire-arc additive processes are among the highest for additive technologies enabling rapid and reliable sample fabrication when compared to conventional methods such as arc button melting. The mWAAM samples will be rapidly characterized via instrumented indentation for room temperature modulus and strength and for elevated temperature strength via hot hardness tests. After being screened with hardness testing, potential alloys will be further evaluated with conventional microscopy techniques including scanning electron microscopy (SEM) and transmission electron microscopy (TEM) to assess agreement with modeling results. The most promising compositions will also be evaluated by printing full sized tensile specimens for mechanical behavior tests at elevated temperatures. Results: Bayesian machine learning of a single performance function was initially used to optimize five performance metrics: 1) single phase stability, 2) yield strength, 3) creep resistance (low diffusion coefficient), 4) freezing range (weldability), and 5) material cost. The single performance function was suboptimal as assumptions had to be made about the results while formulating the optimization. A goal-oriented Bayesian optimization strategy (Hanaoka, 2021) was implemented with CALPHAD for use with the five metrics above. This multi-objective Bayesian optimization (MOBO) enabled the design of NiCrCoFe alloys with V and W additions. A base composition of NiCoCr was selected as Ni provides a stable FCC matrix, Cr aids corrosion/oxidation resistance, and Co is a solid-solutions strengthener that also improves creep by increasing the activation energy. Fe helps reduce diffusion coefficients and cost. Finally, V and W were selected for their reasonable solubility and high atomic misfit to aid in solid solution strengthening. Cracking of the mWAAM specimens was an early issue, and the Easton solidification cracking model (Easton et al., 2014a) was selected for addition to the MOBO function. High performing alloys fabricated by mWAAM included Ni 28 Cr 25 Co 26 Fe 15 V 8 and Ni 62 Cr 18 Co 1 Fe 3 W 15 . It was observed that even after adapting the mWAAM process for W, the W did not fully dissolve. To fully evaluate the Ni 62 Cr 18 Co 1 Fe 3 W 15 composition, a cored wire (80-20 NiCr sheath/powder core) was manufactured and printed via WAAM, and HIP’ing was utilized to homogenize and densify the printed alloy. The V and W alloys produced met metrics 1 (solid solution), 4 (solidification cracking), and 5 (cost). However, an unmodeled mechanism of thermal stress cracking was identified in the WAAM produced materials, perhaps exacerbated by the lack of grain boundary strengthening elements (B, C). Conclusions & Recommendations: A high-throughput (rapid) alloy design technique was applied to designing and manufacturing new high entropy alloys (HEAs) for extreme environments utilizing MOBO and mWAAM. The developed process was rapid and effective in addressing the mechanisms included in the model. The lack of grain boundary strengthening element additions (e.g., B, C) was a simplification that likely produced thermal stress cracking that turned into a large part of the investigation. Additions on the order of 0.005 wt% B and 0.05 wt% C likely would have minimized thermal stress grain boundary cracking. Overall, the high throughput design strategy is promising for rapid design of metrics-driven alloys for advanced ultra supercritical (A-USC) steam cycles for power generation. The MOBO and mWAAM process could be commercialized to accelerate metrics-driven alloy design. In addition, the cored-wire process utilized for scale-up is a promising high-volume process for WAAM alloy development and scale-up.

36 MATERIALS SCIENCE↗

Wire Plane Transparency: Commissioning the Time Projection Chambers for the Short-Baseline Near Detector

The Short Baseline Near Detector (SBND) serves as the near detector for Fermilab's Short Baseline Neutrino (SBN) programme. It is a 112-ton Liquid Argon Time Projection Chamber (LArTPC) designed to study neutrino-argon interactions and search for new physics phenomena such as sterile neutrinos. Situated just 110 m from the Booster Neutrino Beam (BNB), SBND just began its first physics run and is expected to record over two million neutrino interactions annually. Commissioning the time projection chambers of SBND is crucial for optimising detector performance. Each of the two anodes is composed of three charge-sensing wire planes which detect drifting ionisation electrons from charged particles traversing the detector. The wire planes, arranged with different 2D orientations, facilitate the 3D reconstruction of neutrino interactions. Electron transport induces signals on the first two planes, with the signal being collected by the rear plane. The first two induction planes require transparency to ensure all drift electrons reach the collection plane. This transparency depends on the bias voltages applied to the wires and the spacing between them. Fine-tuning these bias voltages ensures the optimisation of wire plane transparency. In this poster, I will demonstrate how transparency can be assessed by analysing the waveforms from cosmic-ray muon tracks traversing the detector at specific orientations.

McCusker, Bethany [Unlisted, US]↗

Heat Diffusion in High-Cp Nb3Sn Composite Superconducting Wires

A major focus of Nb3Sn accelerator magnets is on significantly reducing or eliminating their training. Demonstration of an approach to increase the Cp of Nb3Sn magnets using new materials and technologies is very important both for particle accelerators and light sources. It would improve thermal stability and lead to much shorter magnet training, with substantial savings in machines’ commissioning costs. Both Hypertech and Bruker-OST have attempted to introduce high-Cp elements in their wire design. This paper includes a description of these advanced wires, the finite element model of their heat diffusion properties as compared with the standard wires, and whenever available, a comparison between the minimum quench energy (MQE) calculated by the model and actual MQE measurements on wires.

43 PARTICLE ACCELERATORS↗

Automatic reel controls filler wire in welding machines

Automatic reel on automatic welding equipment takes up slack in the reel-fed filler wire when welding operation is terminated. The reel maintains constant, adjustable tension on the wire during the welding operation and rewinds the wire from the wire feed unit when the welding is completed.

Millett, A. V.↗

Metal Oxide Silicon /MOS/ transistors protected from destructive damage by wire

Loop of flexible, small diameter, nickel wire protects metal oxide silicon /MOS/ transistors from a damaging electrostatic potential. The wire is attached to a music-wire spring, slipped over the MOS transistor case, and released so the spring tensions the wire loop around all the transistor leads, shorting them together. This allows handling without danger of damage.

Deboo, G. J.↗

Dual wire weld feed proportioner

Dual feed mechanism enables proportioning of two different weld feed wires during automated TIG welding to produce a weld alloy deposit of the desired composition. The wires are fed into the weld simultaneously. The relative feed rates of the wires and the wire diameters determine the weld deposit composition.

Nugent, R. E.↗

Magnet-wire wrapping tool for integrated circuits

Wire-dispensing tool which resembles mechanical pencil is used to wrap magnet wire around integrated circuit terminals uniformly and securely without damaging insulative coating on wire. Tool is hand-held and easily manipulated to execute wire wrapping movements.

Takahashi, T. H.↗

Electro-optical device for monitoring wire size

Device recognizes variations in wire size and is being used during computer memory-plane fabrication. Decrease in wire diameter, due to stretching, permits removal of wire from memory-plant mold. Monitoring provides means of detecting imperfect wire and permits fabrication of computer memory plane to be stopped prior to its insertion into mold.

Burcher, E. E.↗

High strength, wire-reinforced electroformed structures

Using half-round reinforcing wires, electrodeposited matrix metal readily fills spaces between wires in intimate contact with wires and without voids. Procedure combines advantages of electroforming with high-strength of commonly available wire to produce non-welded shell structures for high pressure uses.

Kazaroff, J. M.↗

A digital fly-by-wire technology development program using an F-8C test aircraft

A digital fly-by-wire flight control system has been installed in an F-8C test airplane and has undergone extensive ground and flight testing as part of an overall program to develop digital fly-by-wire technology. This is the first airplane to fly with a digital fly-by-wire system as its primary means of control and with no mechanical reversion capability. Forty-two test flights were made for a total flight time of 57 hours. Six pilots participated in the evaluation. This paper presents an overview of the digital fly-by-wire program and discusses some of the flight-test results.

Jarvis, C. R.↗

An overview of NASA's digital fly-by-wire technology development program

The feasibility of using digital fly-by-wire systems to control aircraft was demonstrated by developing and flight testing a single channel system, which used Apollo hardware, in an F-8C test airplane. This is the first airplane to fly with a digital fly-by-wire system as its primary means of control and with no mechanical reversion capability. The development and flight test of a triplex digital fly-by-wire system, which will serve as an experimental prototype for future operational digital fly-by-wire systems, is underway.

Jarvis, C. R.↗

High reliability bond program using small diameter aluminum wire

The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

Macha, M.↗

An overview of NASA's digital fly-by-wire technology development program

The feasibility of using digital fly by wire systems to control aircraft was demonstrated by developing and flight testing a single channel system, which used Apollo hardware, in an F-8C test airplane. This is the first airplane to fly with a digital fly by wire system as its primary means of control and with no mechanical reversion capability. The development and flight test of a triplex digital fly by wire system, which will serve as an experimental prototype for future operational digital fly by wire systems, are underway.

Jarvis, C. R.↗

Printed wiring board system programmer's manual

The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

Brinkerhoff, C. D.↗

Semiautomatic labeling of small wires

Semi-automatic-wire labeling equipment installs heat-shrink identification sleeves on small-diameter wires for moderate-size production runs. Supply reel contains wire of desired diameter and is cut into lengths set on the measuring rolls. Required number of identification sleeves are slipped over wire, which is then placed through sleeve-releasing mechanism. Sleeves are shrunk at 350 degrees F in an infrared oven.

David, L. P.↗

Metallic hot wire anemometer

A hot wire anemometer is described which has a body formed of heat resistant metal such as an alloy high in nickel content which supports a probe wire disposed in a V groove in the body. The V groove contains a high temperature ceramic adhesive that partially encompasses the downstream side of the probe wire. Mechanical and electrical connection to the probe wire is achieved through conductive support rods that are constructed of the same high temperature metal, insulation between the body and the conductor rods being provided by a coating of an oxide of the same material which coating is formed in situ. The oxide coating insulates the conductor rods from the body, mechanically fixes the conductors within the body, and maintains its integrity at elevated temperatures.

Lemos, F. R.↗

Easily-wired toggle switch

Crimp-type connectors reduce assembly and disassembly time. With design, no switch preparation is necessary and socket contracts are crimped to wires inserted in module attached to back of toggle switch engaging pins inside module to make electrical connections. Wires are easily removed with standard detachment tool. Design can accommodate wires of any gage and as many terminals can be placed on switch as wire gage and switch dimensions will allow.

Dean, W. T.↗