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At least 253 records · Page 14

Reliability-Based Design of Thermal Protection Systems with Support Vector Machines

The primary objective of this work was to develop a computationally efficient and accurate approach to reliability analysis of thermal protection systems using support vector machines. An adaptive sampling approach was introduced informs a iterative support vector machine approximation of the limit state function used for measuring reliability. The proposed sampling approach efficient adds samples along the limit state function until the reliability approximation is converged. This methodology is applied to two samples, mathematical functions to test and demonstrate the applicability. Then, the adaptive sampling-based support vector machine approach is applied to the reliability analysis of a thermal protection system. The results of all three problems highlight the potential capability of the new approach in terms of accuracy and computational saving in determining thermal protection system reliability.

White, Laura M.↗

Going beyond reliability to robustness and resilience in space systems

The words reliability, robustness, and resilience, are often used interchangeably to describe tough and dependable systems but the distinctions between them suggest how to design more serviceable space systems. Reliability is simply the quality of consistently performing well. A system that dependably meets its design requirements in the specified environments is reliable. The designers may not consider themselves responsible for failures under unanticipated conditions. Robustness is the capability of performing without failure under a wide range of conditions, which can go beyond the expected range to include possible off-nominal conditions. Resilience is the ability to recover from or adapt to damaging events, such as failures, accidents, external disruptions, and repurposing. Such changes are usually unanticipated. They often invalidate the usual operating assumptions and cause system failure. Reliability, robustness, and resilience describe dependable performance under increasingly difficult conditions, first the specified environment, then a wider possible environment, and finally unanticipated damaging events. These three are increasingly desirable and increasingly difficult to achieve. Engineering for resilience would design systems that can ignore or repair failures, survive accidents, and recover from disruptions. Increasing the resilience of space systems, the ability to perform after unanticipated events, would greatly increase space crew safety. Improving reliability and robustness can be done by dealing with known sources of problems, but improving resilience requires implementing a general approach to reducing the impact of unknown future events. Two contrasting approaches are reducing system complexity and adding supervisory control. The need for resilience has been claimed for decades but little has been accomplished. Systems designers assume that they understand requirements, technologies, designs, architectures, integration, testing, operations, and environments. The potential problems of changes, failures, accidents, unknown environments, and unknown unknowns are ignored. Systems designers are typically overconfident and ignore the need for robustness and resilience.

Harry W Jones↗

Reliability-Aware Requirements Development for Autonomy Software

Autonomy is the ability of a system to make decisions and take actions in the presence of uncertainty. Validating autonomy, therefore, is a matter of validating that the system makes intelligent decisions even when there might be discrepancies between the observed and the expected state of the world as well as when the possible outcome of each of the possible courses of action is uncertain. During the requirements engineering phase, the functions, including those that are required to be autonomous and their expected behavior are specified. However, in the case of autonomous software system, it is challenging to specify all possible scenarios that the software may encounter. Additionally, since autonomous behaviors cannot always be fully predetermined, it is difficult to reason about their completeness and correctness. While these challenges are also faced with non-autonomous system, they are more prevalent for autonomous system due to their complexity and emergent behavior. Our efforts have been three-fold. On one hand, we have developed a goal-based method for requirements decomposition. We have embedded this approach into a higher-level systems engineering framework and then developed methods for decision and reliability analysis within this framework. And finally, we use simulation analysis to validate the more theoretical methods and provide a feedback mechanism. The decision analysis approach (DA) helps in identifying and mitigating the run-time risks, by bringing to the forefront the uncertainties, decisions, interactions, and other factors that may cause autonomous software to make erroneous decisions. The DA framework is used to quantify, for each decision that the software can make, failure risk due to uncertainties. The information about the key decisions and circumstances that can cause autonomous system to make incorrect decisions are used to generate test scenarios to be run in a simulator to ensure that the system can handle error-prone circumstances. The results or outcomes from decisions, based on the simulated scenarios, can then be leveraged to further gain insight of the assured system. We combine a goal-based approach with simulation analysis to facilitate requirements development for autonomous systems and further provide a method for run-time systems level reliability considerations during the autonomous software development process. The DA and the reliability analysis methods provide a formalism for the consideration of uncertainty in the run time decision-making process for autonomous software. This formalism considers the uncertainty involved in the outcome of different courses of action, in terms of performance and cost, as well as a method to consider the system level reliability implications. System level reliability considerations for autonomous software decision making contribute to the satisfaction of the system level goals over the lifecycle of a given mission. We demonstrate our approach using a hypothetical rover path planning example. The requirements for our rover simulator are based on existing literature about Mars rovers and lessons learned from real world observations at JPL. The specifics of the autonomy design for the Mars rovers, that have not been previously cleared for external release, are not used for our demonstrations.

Lindvall, Mikael↗

Topics in Reliability

This talk will wind through the details of history of reliability in the agency, where things are today, and where we need to go tomorrow. It will provide many examples of reliability that are often discounted because they are not tied to some mantra from the past. Furthermore, it will separate us from the red herrings that are ever present based on the misuse of terms and practices in reliability. It will delve into several key subject matter areas that have long been considered the key reliability drivers, such as parts, printed circuit boards, radiation, and workmanship. Finally, it will highlight how the Center and Agency need to change our approach at learning lessons from past experiences to maintain a basis for reliability long into the future.

COTS↗

Reliable IR Line Lists for N2O and OCS Isotopologues for High Temperature Applications up to 2000 K

To address the needs of planetary and exoplanetary atmosphere studies towards JWST, HWO and future IR astronomy missions, theoretical IR line lists of Carbonyl Sulfide (OCS) and Nitrous Oxide (N2O) are generated to provide complete, reliable, and consistent IR reference data in the range of 0 - 15,000 cm-1, or wavelength longer than 0.67 Å, for temperature up to 2000 K. The line lists are quantum mechanically computed using spectroscopically accurate potential energy surfaces empirically refined with reliable high-resolution experimental data, and high-quality dipole moment surfaces constructed at CCSD(T) level with aug-cc-pVT/Q/5(+d)Z basis and extrapolations to complete basis set limit. The Ames N2O line list includes the primary isotopologue 14N2 16O (denoted "446") with J=0-210 and E' up to 25,000 cm-1, and 11 minor isotopologues of 15N and 17/18O with J=0-150 and lower E' cutoffs. For OCS, Ames "natural" 296 K line list includes 12 most abundant isotopologues. The intensity contribution of OCS minor isotopologues at higher temperature is non-negligible, e.g., 8.6 ± 4.9% at 1000 K. The 16O12C32S (93.7%) and 16O12C34S (4.2%) transitions are computed with J=0-240 and E'< 22,000 cm-1, plus J=0-150 and E' < 16,000 cm-1 for five more minor isotopologues. Reliable Effective Hamiltonian models (e.g., NOSL-296 for 14N2 16O), experimental data collections, and reliable HITRAN or MARVEL levels are combined with quantum rovibrational calculations to deliver accurate and consistent empirical corrections for line positions. The reliability and accuracy of our IR intensity predictions are demonstrated by comparison with available databases, line lists, and experiments, at both room temperature and at high temperature. The line lists will be freely available to public online at ZENODO and NAS data portal. We acknowledge the financial support from NASA XRP and APRA programs.

Planetary↗

Scaled CMOS Reliability and Considerations for Spacecraft Systems: Bottom-Up and Top-Down Perspective

New space missions will increasingly rely on more advanced technologies because of system requirements for higher performance, particularly in instruments and high-speed processing. Component-level reliability challenges with scaled CMOS in spacecraft systems from a bottom-up perspective have been presented. Fundamental Front-end and Back-end processing reliability issues with more aggressively scaled parts have been discussed. Effective thermal management from system-level to the componentlevel (top-down) is a key element in overall design of reliable systems. Thermal management in space systems must consider a wide range of issues, including thermal loading of many different components, and frequent temperature cycling of some systems. Both perspectives (top-down and bottom-up) play a large role in robust, reliable spacecraft system design.

Scaled CMOS↗

Generation and analysis of large reliability models

An effort has been underway for several years at NASA's Langley Research Center to extend the capability of Markov modeling techniques for reliability analysis to the designers of highly reliable avionic systems. This effort has been focused in the areas of increased model abstraction and increased computational capability. The reliability model generator (RMG), a software tool which uses as input a graphical, object-oriented block diagram of the system, is discussed. RMG uses an automated failure modes-effects analysis algorithm to produce the reliability model from the graphical description. Also considered is the ASSURE software tool, a parallel processing program which uses the ASSIST modeling language and SURE semi-Markov solution technique. An executable failure modes-effects analysis is used by ASSURE. The successful combination of the power of graphical representation, automated model generation, and parallel computation leads to the conclusion that large system architectures can now be analyzed.

Aerospace electronics↗

An Ultra Reliability for Project for NASA

NASA has embarked on a new program designed to improve the reliability of NASA systems. In this context, the goal for ultra reliability is to ultimately improve the systems by an order of magnitude. The approach outlined in this presentation involves five steps: 1. Divide NASA systems into seven sectors; 2. Establish sector champions and representatives from each NASA center; 3. Develop a challenge list for each sector using a team of NASA experts in each area with the sector champion facilitating the effort; 4. Develop mitigation strategies for each of the sectors' challenge lists and rank their importance by holding a workshop with area experts from government (NASA and non-NASA), universities and industry; 5. Develop a set of tasks for each sector in order of importance for improving the reliability of NASA systems. Several NASA-wide workshops have been held, identifying issues for reliability improvement and providing mitigation strategies for these issues.

ultra-reliability↗

Column Grid Array Rework for High Reliability

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

high reliability↗

Users Guide on Scaled CMOS Reliability: NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance

Reliability of advanced CMOS technology is a complex problem that is usually addressed from the standpoint of specific failure mechanisms rather than overall reliability of a finished microcircuit. A detailed treatment of CMOS reliability in scaled devices can be found in Ref. 1; it should be consulted for a more thorough discussion. The present document provides a more concise treatment of the scaled CMOS reliability problem, emphasizing differences in the recommended approach for these advanced devices compared to that of less aggressively scaled devices. It includes specific recommendations that can be used by flight projects that use advanced CMOS. The primary emphasis is on conventional memories, microprocessors, and related devices.

Scaled CMOS↗

Space Radiation Effects and Reliability Consideration for the Proposed Jupiter Europa Orbiter

The proposed Jupiter Europa Orbiter (JEO) mission to explore the Jovian moon Europa poses a number of challenges. The spacecraft must operate for about seven years during the transit time to the vicinity of Jupiter, and then endure unusually high radiation levels during exploration and orbiting phases. The ability to withstand usually high total dose levels is critical for the mission, along with meeting the high reliability standards for flagship NASA missions. Reliability of new microelectronic components must be sufficiently understood to meet overall mission requirements.The proposed Jupiter Europa Orbiter (JEO) mission to explore the Jovian moon Europa poses a number of challenges. The spacecraft must operate for about seven years during the transit time to the vicinity of Jupiter, and then endure unusually high radiation levels during exploration and orbiting phases. The ability to withstand usually high total dose levels is critical for the mission, along with meeting the high reliability standards for flagship NASA missions. Reliability of new microelectronic components must be sufficiently understood to meet overall mission requirements.

semiconductor devices↗

Optimized Biasing of Pump Laser Diodes in a Highly Reliable Metrology Source for Long-Duration Space Missions

Optical metrology system reliability during a prolonged space mission is often limited by the reliability of pump laser diodes. We developed a metrology laser pump module architecture that meets NASA SIM Lite instrument optical power and reliability requirements by combining the outputs of multiple single-mode pump diodes in a low-loss, high port count fiber coupler. We describe Monte-Carlo simulations used to calculate the reliability of the laser pump module and introduce a combined laser farm aging parameter that serves as a load-sharing optimization metric. Employing these tools, we select pump module architecture, operating conditions, biasing approach and perform parameter sensitivity studies to investigate the robustness of the obtained solution.

808 mm diode pumps↗

A General Reliability Model for Ni-BaTiO3-Based Multilayer Ceramic Capacitors

The evaluation of multilayer ceramic capacitors (MLCCs) with Ni electrode and BaTiO3 dielectric material for potential space project applications requires an in-depth understanding of their reliability. A general reliability model for Ni-BaTiO3 MLCC is developed and discussed. The model consists of three parts: a statistical distribution; an acceleration function that describes how a capacitor's reliability life responds to the external stresses, and an empirical function that defines contribution of the structural and constructional characteristics of a multilayer capacitor device, such as the number of dielectric layers N, dielectric thickness d, average grain size, and capacitor chip size A. Application examples are also discussed based on the proposed reliability model for Ni-BaTiO3 MLCCs.

statistical modeling↗

A General Reliability Model for Ni-BaTiO3-Based Multilayer Ceramic Capacitors

The evaluation for potential space project applications of multilayer ceramic capacitors (MLCCs) with Ni electrode and BaTiO3 dielectric material requires an in-depth understanding of the MLCCs reliability. A general reliability model for Ni-BaTiO3 MLCCs is developed and discussed in this paper. The model consists of three parts: a statistical distribution; an acceleration function that describes how a capacitors reliability life responds to external stresses; and an empirical function that defines the contribution of the structural and constructional characteristics of a multilayer capacitor device, such as the number of dielectric layers N, dielectric thickness d, average grain size r, and capacitor chip size A. Application examples are also discussed based on the proposed reliability model for Ni-BaTiO3 MLCCs.

statistical modeling↗

Verification of Triple Modular Redundancy (TMR) Insertion for Reliable and Trusted Systems

We propose a method for TMR insertion verification that satisfies the process for reliable and trusted systems. If a system is expected to be protected using TMR, improper insertion can jeopardize the reliability and security of the system. Due to the complexity of the verification process, there are currently no available techniques that can provide complete and reliable confirmation of TMR insertion. This manuscript addresses the challenge of confirming that TMR has been inserted without corruption of functionality and with correct application of the expected TMR topology. The proposed verification method combines the usage of existing formal analysis tools with a novel search-detect-and-verify tool. Field programmable gate array (FPGA),Triple Modular Redundancy (TMR),Verification, Trust, Reliability,

Trust↗

Reliable Design Versus Trust

This presentation focuses on reliability and trust for the users portion of the FPGA design flow. It is assumed that the manufacturer prior to hand-off to the user tests FPGA internal components. The objective is to present the challenges of creating reliable and trusted designs. The following will be addressed: What makes a design vulnerable to functional flaws (reliability) or attackers (trust)? What are the challenges for verifying a reliable design versus a trusted design?

Field Programmable Gate Aray (FPGA)↗

Large Satellite Bus Reliability

NASA is proposing to build a small space station in Cis-lunar orbit called Deep Space Gateway (DSG). At the heart of the DSG is the Power and Propulsion Element (PPE) which is conceptually similar to previously designed and operated satellite buses. A satellite bus is composed of the satellite spacecraft infrastructure minus the payload, and generally includes power, propulsion, avionics, and guidance, navigation and control. In November of 2017, five companies were awarded contracts by NASA to research PPE designs. In order to better understand the reliability of large satellite buses which may be the starting point of the PPE, NASA used Weibull analysis to evaluate spacecraft with similar masses and design life to the PPE. In addition, a subset of the large satellites which had satellite buses manufactured by any one of the five companies was also evaluated. This paper provides the results of the reliability analysis and compares the reliability of the general population of large satellites to the reliability associated with large satellite buses manufactured by the five companies currently studying PPE options.

Bus↗

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗