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At least 253 records · Page 14

All sources NASA NTRS DOE OSTI

NASA NTRS1981

Incorporation of metal related materials into electrically neutral polymers

Developments in the field of metal-containing polymers are reviewed with emphasis on neutral polymers incorporating dissolved metal salts, metal complexes, organometallic compounds, and metals. Polymer systems discussed include: polyamides, polyimides, polyalcohols, polyesters, polyacetylene, polyethylene, and polysiloxane. Most of the studies focus on the modification of polymer properties such as adhesive properties, thermal behavior, electrical conductivity, polymer flammability, and mechanical properties.

St. Clair, A. K.↗

NASA NTRS1982

Moisture dependence of positron annihilation rates in molecular substances

Positron annihilation rates have been studied in polymers and graphite-polymer composites as a function of their moisture content. The annihilation rates have been found to increase linearly with increasing moisture content in epoxies and polyamides, whereas no definite trends have been observed in polyimides. These experimental results have been used as the basis for the calculation of moisture content of several polymeric test specimens. For example, the directly measured moisture content of a Kevlar specimen was 45.5 + or - 5.0% of saturation value, whereas the moisture content on the basis of the decrease in positron lifetime was calculated to be 46.5 + or - 3.5%. Similarly, the directly measured moisture content of a graphite-epoxy composite (55 v/o fiber) was 19.2 + or - 0.6% of saturation value as opposed to a calculated value of 16.0 + or - 5.0%.

Singh, J. J.↗

NASA NTRS1984

Hot melt adhesive pad surface attachment assembly concept for on-orbit operations

The use of a hot melt adhesive concept to develop a Surface Attachment Assembly (SAA) for on-orbit attachment and detachment operations for the Manned Maneuvering Unit (MMU) was investigated. The concept involved impregnation of the hot melt adhesive into a fiberglass covered pad which contained electrical heating and thermoelectric cooling devices. The polyamide hot melt adhesive selected can be repeatedly heated to its melting point in a vacuum and provide good adhesion to various surfaces, i.e., reusable surface insulation tiles, metals, and composites, when cooled. After a series of adhesive screening tests, Jet-Melt 3746 was selected from a group of commercially available thermoplastic adhesive candidates which met or exceeded many of the criteria established for the SAA system. The SAA system was designed and fabricted with the goal of proving the concept with a working model rather than attempting to optimize all facets of the system. This system evolved by investigating alternate attachment concepts, designing and fabricating electronic systems to heat and cool the adhesive, and then fabricating electronic systems to heat and cool the adhesive, and then fabricating and testing two prototype full-size units.

Progar, D. J.↗

NASA NTRS1984

Heat resistant protective hand covering

A heat-resistant aromatic polyamide fiber is described. The outer surface of the shell is coated with a fire-resistant elastomer and liner. Generally conforming and secured to the shell and disposed inwardly of the shell, the liner is made of a felt fabric of temperature-resistant aromatic polymide fiber.

Tschirch, R. P.↗

NASA NTRS1986

Fire-Resistant Belt Panel for Airplane Windows

Window-belt panel for airplanes fire resistant and generates little smoke when exposed to flames. Panel incorporates fire-shield layer adding minimal weight but delays or prevents fire from burning through. Structural core of panel is Nomex or equivalent polyamide paper honeycomb. Fire shield, made of fluororubber sheet, incorporated in multiple-ply facing bonded to core. Outer layers of multiple-ply facing and back face of panel consist of biwoven carbon-cloth impregnated with phenolic resin.

Trabold, E. L.↗

NASA NTRS1986

Tethered constellations, their utilization as microgravity platforms and relevant features

The gravitational, thermal, and dynamic docking effects on tethered platforms were studied. The near-earth environment has gravitational effects such a g-jitters and intermittencies, g-noise, and frequency and amplitude features which may influence life science, materials processing, and fluid processes research and commercial activities. Artificial gravity is produced by minute accelerations imparted by tethers. The magnitudes of gravitational forces produced by tethers 100 and 100,000 m long at various altitudes from 463 to 35,786 km are calculated. Thermal analyses were performed for stainless steel and Kevlar tethers, showing the steel tether could vary 300 m in length and the polyamide 25 m during one orbit. Finally, consideration given to docking with a tethered platform revealed that the center of mass could change, which would produce, however, negligible changes in orbit and therefore gravity.

Napolitano, L. G.↗

NASA NTRS1987

Flexural Properties of Aramid-Reinforced Pultrusions

Four resin systems show improved properties after postcuring. Comparison of flexural properties made of pultrusions reinforced by Kevlar (or equivalent) aromatic polyamide and having constant fiber volume and varied matrices, pretreatments, and postcures. Objective of study to improve flexural properties of pultrusion reinforced with Kevlar (or equivalent). Advantages of using pultrusion process, over conventional hand-layup methods included higher production rates, low facility and labor requirements, and reduced manufacturing costs of advanced composites.

Wilson, M. L.↗

NASA NTRS1977

Process for crosslinking and extending conjugated diene-containing polymers

A process using a Diels-Alder reaction which increases the molecular weight and/or crosslinks polymers by reacting the polymers with bisunsaturated dienophiles is developed. The polymer comprises at least 75% by weight based on the reaction product, has a molecular weight of at least 5000 and a plurality of conjugated 1,3-diene systems incorporated into the molecular structure. A dienophile reaction with the conjugated 1,3-diene of the polymer is at least 1% by weight based on the reaction product. Examples of the polymer include polyesters, polyamides, polyethers, polysulfones and copolymers. The bisunsaturated dienophiles may include bis-maleimides, bis maleic and bis tumaric esters and amides. This method for expanding the molecular weight chains of the polymers, preferable thermoplastics, is advantageous for processing or fabricating thermoplastics. A low molecular weight thermoplastic is converted to a high molecular weight plastic having improved strength and toughness for use in the completed end use article.

Bell, Vernon L.↗

NASA NTRS1988

Developing Crystallinity In Linear Aromatic Polyimides

New technique improves melt flow of polyimide. Uses chemical imidization or cyclodehydration techniques that do not cause significant decrease in molecular weight. Process involves dissolution of polyamide acid in amide solvent or mixture of ether and amide solvent at low percentage of solids followed by treatment of this solution with aprotic organic base, such as triethylamine or pyridine, for period of time prior to treatment with organic dehydrating agent. Latter treatments facilitates formation of polyimide. Useful for production of polyimide molding materials. Expected to have widespread application in preparation of easily processed adhesives, molding powders, and matrix resins.

St. Clair, Terry L.↗

NASA NTRS1988

Hermetically sealable package for hybrid solid-state electronic devices and the like

A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.

Miller, Wilson N.↗

NASA NTRS1989

Fracture toughness of polyimide films

Two aromatic polyimides and an aromatic polyamide-imide were tested in single edge notched tension. Fracture toughnesses, normalized to 25 micron film thickness ranged from 1.65 to 5.4 MPa m sup 1/2. LARC-TPI, a thermoplastic polyimide, showed evidence of crazing ahead of a growing crack whereas the other materials formed a shear yielded zone.

Hinkley, J. A.↗

NASA NTRS1989

LARC-CPI, a new semi-crystalline polyimide

As part of a program on high performance/high temperature structural resins for aerospace applications, work was performed with a new semi-crystalline polyimide (LARC-CPI) to improve the compression moldability while retaining high mechanical properties and thermooxidative stability. Various molecular weight versions of LARC-CPI polyamide acid were prepared, end-capped with different groups, converted to polyimide and evaluated for film properties, thermooxidative stability and melt flow. One controlled molecular weight, end-capped version of LARC-CPI was evaluated more comprehensively in adhesive and composite work and exhibited good compression moldability, reasonable crystallization rates and high mechanical properties.

Hergenrother, P. M.↗

NASA NTRS1991

Advanced thermoplastic resins, phase 2

High temperature structural resins are required for use on advanced aerospace vehicles as adhesives and composite matrices. NASA-Langley developed polyimide resins were evaluated as high temperature structural adhesives for metal to metal bonding and as composite matrices. Adhesive tapes were prepared on glass scrim fabric from solutions of polyamide acids of the semicrystalline polyimide LARC-CPI, developed at the NASA-Langley Research Center. Using 6Al-4V titanium adherends, high lap shear bond strengths were obtained at ambient temperature (45.2 MPa, 6550 psi) and acceptable strengths were obtained at elevated temperature (14.0 MPa, 2030 psi) using the Pasa-Jell 107 conversion coating on the titanium and a bonding pressure of 1.38 MPa (200 psi). Average zero degree composite tensile and compressive strengths of 1290 MPa (187 ksi) and 883 MPa (128 ksi) respectively were obtained at ambient temperature with unsized AS-4 carbon fiber reinforcement.

Brown, A. M.↗

NASA NTRS1993

Polyimides with improved compression moldability

The semicrystalline polyimide prepared by reaction of 3,3',4,4' benzophenonetetracarboxylic (BTDA) and 1,3-bis(4-aminophenoxy 4' benzoyl) benzene (1,3-BABB) is modified so that it can be more readily processed to form adhesive bonds, moldings, and composites. The stoichiometric ratio of the two monomers, BTDA and 1,3-BABB is controlled so that the intermediate polyamide acid is of a calculated molecular weight. A polyimide acid with excess anhydride groups is then reacted with the stoichiometrically required amount of monofunctional aromatic or aliphatic amine required for complete endcapping. The stoichiometrically offset, encapped polyimide is processed at lower temperatures and pressures than the unmodified high molecular weight polyimide with the same repeat unit, and exhibits an improved melt stability.

Hergenrother, Paul M.↗

NASA NTRS1993

Process to prepare 1,3-diamino-5-pentafluorosulfanylbenzene

A process was developed to prepare 1,3-diamino- 5-pentafluoro sulfanylbenzene. This process involved two steps: preparing the dinitro compound, 1,3-dinitro- 5-pentafluoro sulfanylbenzene, and reducing this compound to form the corresponding diamine. This diamine was reacted with various dianhydrides, diacidchlorides, and epoxy resins to form polyimides, polyamides, and cross linked epoxies. These polymers were used to prepare semi-permeable membranes, wire coatings, and films.

St.clair, Terry L.↗

NASA NTRS1994

Polyimides Containing Pendent Ethynyl Groups

Series of novel diamines containing pendent ethynyl groups synthesized and reacted with various dianhydrides to form polyamide acids cyclodehydrated to form polyimides containing pendent ethynyl groups. Copolyimides of these diamines and other diamines also prepared. Upon heating, ethynyl groups in these polymers react with one another to form cross-linked molecular structures. As result of curing reaction, resistance to solvents, glass-transition temperature, and modulus of elasticity of polymer of this type generally increase, accompanied by corresponding decrease in tensile elongation and toughness. Cured polymers used as films, moldings, adhesives, and composite matrices.

Hergenrother, Paul M.↗

NASA NTRS1994

Double-Square-Loop Triband Frequency-Selective Microwave Reflector

Double-square-loop antenna elements arrayed on dielectric panel. Dichroic microwave reflector consisting of planar square array of double-square-loop copper elements on thin sheet of Kapton (or equivalent) polyimide supported by Kevlar (or equivalent) aromatic polyamid honeycomb sandwich panel. Array and panel designed to reflect most of incident electromagnetic radiation of frequencies between 7.2 and 8.4 GHz (in X band) and to transmit most of that at 2.3 GHz (in S Band) and 13.8 GHz {in K(sub u) band}.

Wu, Te-Kao↗

NASA NTRS1994

Metal-Filled Adhesives Amenable To X-Ray Inspection

Adhesive joints between metal parts made amenable to nondestructive radiographic inspection by incorporating radiopaque fillers that increase x-ray contrasts of joints. Adhesives can be epoxies, urethanes, acrylics, phenolics, or silicones, with appropriate curing agents and with such modifiers as polysulfides, polyamides, or butadiene rubbers.

Hermansen, Ralph D.↗