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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14
All sourcesNASA NTRSDOE OSTI
NASA NTRS1975

Design, processing, and testing of LSI arrays for space station

Data for the beam-leaded silicon-on-sapphire (SOS) process using the TA5388 dual-complementary pair plus inverted circuit show the stability of the dc device characteristics through the complete beam-lead processing and packaging steps. A more complex circuit, the TA6567 - a silicon-gate, voltage-sense BL/CMOS/SOS 256-bit RAM, has also been made that was functionally perfect at wafer probe. Efforts to increase the yield of this circuit and to obtain electrically perfect packaged units are discussed.

Schneider, W. C.↗
NASA NTRS1979

An ultraviolet polarimeter for the Solar Maximum Mission

The Solar Maximum Mission experiment contingency will include one instrument originally designed and built for OSO-8. The engineering model of the OSO-8 High Resolution Spectrometer has been rebuilt to make it lightworthy and to encompass several new functions, including solar ultraviolet polarimetry. The rebuilt package is designated as the High Resolution Ultraviolet Spectrometer/Polarimeter. The device that enables polarimetry is a dual channel rotating waveplate system. The waveplates are magnesium fluoride and will allow measurements to be made ranging from the Lyman alpha line to near visible ultraviolet. One wavelength channel will use the polarization characteristics of the spectrometer diffraction grating as the analyzer. The second channel has a built-in four-mirror polarizer. This paper describes the polarimeter design, operation, and calibration.

Calvert, J.↗
NASA NTRS1979

An investigation of optimization techniques for drawing computer graphics displays

Techniques for reducing vector data plotting time are studied. The choice of tolerances in optimization and the application of optimization to plots produced on real time interactive display devices are discussed. All results are developed relative to plotting packages and support hardware so that results are useful in real world situations.

Stocker, F. R.↗
NASA NTRS1979

The MSFC complementary metal oxide semiconductor (including multilevel interconnect metallization) process handbook

The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.

Bouldin, D. L.↗
NASA NTRS1990

Integrating Commercial Off-The-Shelf (COTS) graphics and extended memory packages with CLIPS

This paper addresses the question of how to mix CLIPS with graphics and how to overcome PC's memory limitations by using the extended memory available in the computer. By adding graphics and extended memory capabilities, CLIPS can be converted into a complete and powerful system development tool, on the other most economical and popular computer platform. New models of PCs have amazing processing capabilities and graphic resolutions that cannot be ignored and should be used to the fullest of their resources. CLIPS is a powerful expert system development tool, but it cannot be complete without the support of a graphics package needed to create user interfaces and general purpose graphics, or without enough memory to handle large knowledge bases. Now, a well known limitation on the PC's is the usage of real memory which limits CLIPS to use only 640 Kb of real memory, but now that problem can be solved by developing a version of CLIPS that uses extended memory. The user has access of up to 16 MB of memory on 80286 based computers and, practically, all the available memory (4 GB) on computers that use the 80386 processor. So if we give CLIPS a self-configuring graphics package that will automatically detect the graphics hardware and pointing device present in the computer, and we add the availability of the extended memory that exists in the computer (with no special hardware needed), the user will be able to create more powerful systems at a fraction of the cost and on the most popular, portable, and economic platform available such as the PC platform.

Callegari, Andres C.↗
NASA NTRS2004

Imaging Beyond What Man Can See

Three lightweight, portable hyperspectral sensor systems have been built that capture energy from 200 to 1700 nanometers (ultravio1et to shortwave infrared). The sensors incorporate a line scanning technique that requires no relative movement between the target and the sensor. This unique capability, combined with portability, opens up new uses of hyperspectral imaging for laboratory and field environments. Each system has a GUI-based software package that allows the user to communicate with the imaging device for setting spatial resolution, spectral bands and other parameters. NASA's Space Partnership Development has sponsored these innovative developments and their application to human problems on Earth and in space. Hyperspectral datasets have been captured and analyzed in numerous areas including precision agriculture, food safety, biomedical imaging, and forensics. Discussion on research results will include realtime detection of food contaminants, molds and toxin research on corn, identifying counterfeit documents, non-invasive wound monitoring and aircraft applications. Future research will include development of a thermal infrared hyperspectral sensor that will support natural resource applications on Earth and thermal analyses during long duration space flight. This paper incorporates a variety of disciplines and imaging technologies that have been linked together to allow the expansion of remote sensing across both traditional and non-traditional boundaries.

May, George↗
NASA NTRS2011

Policies and Procedures for Accessing Archived NASA Lunar Data via the Web

The National Space Science Data Center (NSSDC) was established by NASA to provide for the preservation and dissemination of scientific data from NASA missions. This paper describes the policies specifically related to lunar science data. NSSDC presently archives 660 lunar data collections. Most of these data (423 units) are stored offline in analog format. The remainder of this collection consists of magnetic tapes and discs containing approximately 1.7 TB of digital lunar data. The active archive for NASA lunar data is the Planetary Data System (PDS). NSSDC has an agreement with the PDS Lunar Data Node to assist in the restoration and preparation of NSSDC-resident lunar data upon request for access and distribution via the PDS archival system. Though much of NSSDC's digital store also resides in PDS, NSSDC has many analog data collections and some digital lunar data sets that are not in PDS. NSSDC stands ready to make these archived lunar data accessible to both the research community and the general public upon request as resources allow. Newly requested offline lunar data are digitized and moved to near-line storage devices called digital linear tape jukeboxes. The data are then packaged and made network-accessible via FTP for the convenience of a growing segment of the user community. This publication will 1) discuss the NSSDC processes and policies that govern how NASA lunar data is preserved, restored, and made accessible via the web and 2) highlight examples of special lunar data requests.

James, Nathan L.↗
NASA NTRS2012

Dielectric Performance of High Purity HTCC Alumina at High Temperatures - A Comparison Study with Other Polycrystalline Alumina

A very high purity (99.99+) high temperature co-fired ceramic (HTCC) alumina has recently become commercially available. The raw material of this HTCC alumina is very different from conventional HTCC alumina, and more importantly there is no glass additive in this co-fired material. Previously, selected HTCC and LTCC (low temperature co-fired ceramic) alumina materials were evaluated at high temperatures as dielectric and compared to a regularly sintered 96 polycrystalline alumina (96 Al2O3), where 96 alumina was used as the benchmark. A prototype packaging system based on regular 96 alumina with Au thick-film metallization successfully facilitated long term testing of high temperature silicon carbide (SiC) electronic devices for over 10,000 hours at 500C. In order to evaluate this new HTCC alumina for possible high temperature packaging applications, the dielectric properties of this HTCC alumina substrate were measured and compared with those of 96 alumina and a LTCC alumina from room temperature to 550C at frequencies of 120 Hz, 1 KHz, 10 KHz, 100 KHz, and 1 MHz. A parallel-plate capacitive device with dielectric of the HTCC alumina and precious metal electrodes were used for measurements of the dielectric constant and dielectric loss of the co-fired alumina material in the temperature and frequency ranges. The capacitance and AC parallel conductance of the capacitive device were directly measured by an AC impedance meter, and the dielectric constant and parallel AC conductivity of the dielectric were calculated from the capacitance and conductance measurement results. The temperature and frequency dependent dielectric constant, AC conductivity, and dissipation factor of the HTCC alumina substrate are presented and compared to those of 96 alumina. Other technical advantages of this new co-fired material for possible high packaging applications are also discussed.

High temperature↗
NASA NTRS1977

Subsystem design package for the on-site monitor at solar heating and cooling sites

The on-site monitor is a portable device which can be easily connected to a Site Data Acquisition Subsystem to allow readouts of realtime sensor data in voltage or engineering units at instrumented solar heating and cooling sites. The design package consists of the performance specification, performance requirements cross reference, and the acceptance test procedure.

Source record↗
NASA NTRS2014

Dielectric Performance of a High Purity HTCC Alumina at High Temperatures - a Comparison Study with Other Polycrystalline Alumina

A very high purity (99.99+%) high temperature co-fired ceramic (HTCC) alumina has recently become commercially available. The raw material of this HTCC alumina is very different from conventional HTCC alumina, and more importantly there is no glass additive in this alumina material for co-firing processing. Previously, selected HTCC and LTCC (low temperature co-fired ceramic) alumina materials were evaluated at high temperatures as dielectric and compared to a regularly sintered 96% polycrystalline alumina (96% Al2O3), where 96% alumina was used as the benchmark. A prototype packaging system based on regular 96% alumina with Au thickfilm metallization successfully facilitated long term testing of high temperature silicon carbide (SiC) electronic devices for over 10,000 hours at 500 C. In order to evaluate this new high purity HTCC alumina for possible high temperature packaging applications, the dielectric properties of this HTCC alumina substrate were measured and compared with those of 96% alumina and a previously tested LTCC alumina from room temperature to 550 C at frequencies of 120 Hz, 1 KHz, 10 KHz, 100 KHz, and 1 MHz. A parallel-plate capacitive device with dielectric of the HTCC alumina and precious metal electrodes were used for measurements of the dielectric constant and dielectric loss of the co-fired alumina material in the temperature and frequency ranges. The capacitance and AC parallel conductance of the capacitive device were directly measured by an AC impedance meter, and the dielectric constant and parallel AC conductivity of the dielectric were calculated from the capacitance and conductance measurement results. The temperature and frequency dependent dielectric constant, AC conductivity, and dissipation factor of the HTCC alumina substrate are presented and compared to those of 96% alumina and a selected LTCC alumina. Other technical advantages of this new co-fired material for possible high packaging applications are also discussed.

Electronic packaging↗
NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗
NASA NTRS2008

Embedded ESD Protection Proof of Concept

The purpose of this project is to characterize and correlate Electrostatic Discharge (ESD) sensitivity levels of an Integrated Circuit (IC) package using Transmission Line Pulse (TLP) and Human Body Model (HBM) methods. This characterization will be used as a baseline ESD sensitivity level to demonstrate improvement to the ESD sensitivity of the IC package through the use of EPI-FLO(Trade Mark) Polymer Voltage Suppression (PVS) protection devices developed and manufactured by Electronic Polymers, Inc. (EPI).

Human Body Model (HBM) methods↗
NASA NTRS1992

General-Purpose Software For Computer Graphics

NASA Device Independent Graphics Library (NASADIG) is general-purpose computer-graphics package for computer-based engineering and management applications which gives opportunity to translate data into effective graphical displays for presentation. Features include two- and three-dimensional plotting, spline and polynomial interpolation, control of blanking of areas, multiple log and/or linear axes, control of legends and text, control of thicknesses of curves, and multiple text fonts. Included are subroutines for definition of areas and axes of plots; setup and display of text; blanking of areas; setup of style, interpolation, and plotting of lines; control of patterns and of shading of colors; control of legends, blocks of text, and characters; initialization of devices; and setting of mixed alphabets. Written in FORTRAN 77.

Rogers, Joseph E.↗
NASA NTRS1989

Jig Aligns Shadow Mask On CCD

Alignment viewed through microscope. Alignment jig positions shadow mask on charge-coupled device (CCD) so metal film deposited on it precisely. Allows CCD package to be inserted and removed without disturbing alignment of mask. Holds CCD packages securely and isolates it electrostatically while providing electrical contact to each of its pins. When alignment jig assembled with CCD, used to move mask under micrometer control.

Matus, Carlos V.↗
NASA NTRS2014

The Auto-Gopher Deep Drill

Subsurface penetration by coring, drilling or abrading is of great importance for a large number of space and earth applications. An Ultrasonic/Sonic Drill/Corer (USDC) has been in development at JPL's Nondestructive Evaluation and Advanced Actuators (NDEAA) lab as an adaptable tool for many of these applications. The USDC uses a novel drive mechanism to transform the high frequency ultrasonic or sonic vibrations of the tip of a horn into a lower frequency sonic hammering of a drill bit through an intermediate free-flying mass. The USDC device idea has been implemented at various scales from handheld drills to large diameter coring devices. A series of computer programs that model the function and performance of the USDC device were developed and were later integrated into an automated modeling package. The USDC has also evolved from a purely hammering drill to a rotary hammer drill as the design requirements increased form small diameter shallow drilling to large diameter deep coring. A synthesis of the Auto-Gopher development is presented in this paper.

Badescu, Mircea↗
NASA NTRS2018

Graphics Processing Unit (GPU) Devices

This presentation will include information about Graphics Processing Unit (GPU) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.

Single Event Effects (SEE)↗