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We describe the development and progress of the GeoSTAR-II risk reduction activity for the NASA Earth Science Decadal Survey PATH Mission. The activity directly addresses areas of technical risk including the system design, low noise receiver production, sub-array development, signal distribution and digital signal processing.
We present noise temperature and gain measurements of a W-band heterodyne module populated with MMIC LNAs designed and fabricated using 35nm InP HEMT process. The module has a WR-10 waveguide input. GPPO connectors are used for the LO input and the I and and Q IF outputs. The module is tested at both ambient (300 K) and cryogenic (25 K) temperatures. At 25 K physical temperature, the module has a noise temperature in the range of 27-45 K over the frequency band of 75-111 GHz. The module gain varies between 15 dB and 27 dB. The band-averaged module noise temperature of 350 K and 33 K were measured over 80-110 GHz for the physical temperature of 300 K and 25 K, respectively. The resulting cooling factor is 10.6.
We currently achieve 3.4 dB noise figure at 183GHz and 2.1 dB noise figure at 90 GHz with our MMIC low noise amplifiers (LNAs) in room temperature. These amplifiers and the receivers we have built using them made it possible to conduct highly accurate airborne measurement campaigns from the Global Hawk unmanned aerial vehicle, develop millimeter wave internally calibrated radiometers for altimeter radar path delay correction, and build prototypes of large arrays of millimeter receivers for a geostationary interferometric sounder. We use the developed millimeter wave receivers to measure temperature and humidity profiles in the atmosphere and in hurricanes as well as to characterize the path delay error in ocean topography altimetry.
The National Resource Council’s Earth Science Decadal Survey” (NRCDS) has identified the Aerosol/Climate/Ecosystems (ACE) Mission as a priority mission for NASA Earth science. The NRC recommended the inclusion of "a cross-track scanning cloud radar with channels at 94 GHz and possibly 34 GHz for measurement of cloud droplet size, glaciation height, and cloud height". Several radar concepts have been proposed that meet some of the requirements of the proposed ACE mission but none have provided scanning capability at both 34 and 94 GHz due to the challenge of constructing scanning antennas at 94 GHz. In this paper, we will describe a radar design that leverages new developments in microwave monolithic integrated circuits (MMICs) and micro-machining to enable an electronically-scanned radar with both Ka-band (35 GHz) and W-band (94-GHz) channels. This system uses a dual-frequency linear active electronically-steered array (AESA) combined with a parabolic cylindrical reflector. This configuration provides a large aperture (3m x 5m) with electronic-steering but is much simpler than a two-dimension AESA of similar size. Still, the W-band frequency requires element spacing of approximately 2.5 mm, presenting significant challenges for signal routing and incorporation of MMICs. By combining (Gallium Nitride) GaN MMIC technology with micro-machined radiators and interconnects and silicon-germanium (SiGe) beamforming MMICs, we are able to meet all the performance and packaging requirements of the linear array feed and enable simultaneous scanning of Ka-band and W-band radars over swath of up to 100 km.
This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.
This paper describes a millimeter wave low noise amplifier with extraordinary low noise, low power consumption, and wide frequency range.
This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.
An active–passive microwave retrieval algorithm for simultaneous determination of soil surface roughness parameters [vertical root-mean-square (RMS) height ( s ) and horizontal correlation length ( l )] is presented for bare soils. The algorithm is based on active–passive microwave covariation, including the improved Integral Equation Method (I(exp 2) EM), and is tested with global soil moisture active passive (SMAP) observations. The estimated retrieval results for s and l are overall consistent with values in the literature, indicating the validity of the proposed algorithm. Sensitivity analyses showed that the developed roughness retrieval algorithm is independent of permittivity for E(sub s) > 10 [-]. Furthermore, the physical model basis of this approach (I(exp 2) EM) allows the application of different autocorrelation functions (ACF), such as Gaussian and exponential ACFs. Global roughness retrieval results confirm bare areas in deserts such as Sahara or Gobi. However, the type of ACF used within roughness parameter estimation is important. Retrieval results for the Gaussian ACF describe a rougher surface than retrieval results for the exponential ACF. No correlations were found between roughness results and the amount of precipitation or the soil texture, which could be due to the coarse spatial resolution of the SMAP data. The extension of this approach to vegetated soils is planned as an add-on study.
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It has been found that the Discrete Integral Equation (DSI)technique is a highly effective technique for the analysis of microwave circuits and devices [1,2]. The DSI is much more robust than the traditional Finite Difference Time Domain (FDTD) method in a number of ways.
The potential for interference between solar power satellites (SPS) and other Earth satellite operations was examined along with interference problems involving specific electronic devices. Conclusions indicate that interference is likely in the 2500 MHz to 2690 MHz direct broadcast satellite band adjacent to SPS. Estimates of the adjacent channel noise from SPS in this band are as high as -124 dBc/4 kHz and -100 dBc/MHz, where dBc represents decibels relative to the total power in the fundamental. A second potential problem is the 7350 MHz, 3d harmonic from SPS that falls within the 7300 MHz to 7450 MHz space to Earth, government, satellite assignment. Catastrophic failures can be produced in integrated circuits when the microwave power levels coupled into inputs and power leads reach 1 to 100 watts. The failures are typically due to bonding wire melting, metallization failures, and junction shorting. Nondestructive interaction or interference, however, generally occurs with coupled power levels of the order of 10 milliwatts. This integration is due to the rectification of microwave energy by the numerous pn junctions within these circuits.
System-on-chip (SoC) millimeter wave integrated circuit technology has been developed and employed in chip heterodyne radiometers in Electron Cyclotron Emission Imaging (ECEI) and Microwave Imaging Reflectometer (MIR) on the DIII-D tokamak for 2D electron temperature and density fluctuation diagnostics. The W-band (75-110 GHz) ECEI system has been employed with 20 poloidal horn receiver modules with customized monolithic integrated circuit chips and internal local oscillator coupling path. The new SoC approach demonstrates > 30 dB additional gain on the receiver and 95% electronics noise suppression compared to the previous Schottky diode mixer array . An F-band (110-140 GHz) receiver chip has been developed to measure MHD and turbulence behavior on the DIII-D high-field side, such as Alfven eigenmodes. Furthermore, it can image pedestal structure evolution on fusion facilities with stronger magnetic fields, such as ASDEX-U, EAST, HL-2M, and LHD. The F-band chip performance has been tested in the laboratory. Also, V-band (55-75 GHz) transmitter and receiver modules (55-75 GHz) have been developed for DIII-D and NSTX-U Furthermore, microwave Imaging Reflectometer (MIR) application suitability for 2D density fluctuation imaging on the pedestal region.
A closed loop thermoelectric temperature control system is developed for stabilizing sensitive RF integrated circuits within a microwave radiometer to an accuracy of + or - 0.1 C over a range of ambient conditions from -20 C to +45 C. The dual mode (heating and cooling) control concept utilizes partial thermal isolation of the RF units from an instrument deck which is thermally controlled by thermoelectric coolers and thin film heaters. The temperature control concept is simulated with a thermal analyzer program (MITAS) which consists of 37 nodes and 61 conductors. A full scale thermal mockup is tested in the laboratory at temperatures of 0 C, 21 C, and 45 C to confirm the validity of the control concept. A flight radiometer and temperature control system is successfully flight tested on the NASA Skyvan aircraft.
Gallium arsenide integrated-circuit chip switches any of three microwave input signals to any of three output ports. Measuring 4.9 mm on side, chip contains nine field-effect transistor (FET) crosspoint switches. Housed in custom-designed package with standard connectors for easy integration into system. FET's on chip operated as passive switches and consume no static power and insignificant amounts of switching power. Chip module cascades with similar modules into large arrays handling as many as 100 inputs and 100 outputs. Applications include switching and routing vast amounts of data between computers at extremely high speed. On communications satellite, chip switches microwave signals to and from Earth stations and other satellites.
Very compact novel planar broadband baluns are described. Each balun consists of two Lange couplers. Less than 0.3 dB and 2.5 deg for the amplitude and phase balances, respectively, have been measured over the 1.0-2.2 GHz bandwidth for a microstrip balun. As compared with other reported baluns, these baluns are simpler, more compact, easier to design, and fabricated on only one side of the substrate. They are thus very attractive for microwave integrated and monolithic integrated circuit applications.
In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,
This work presents an overview of a hyperspectral microwave-photonic spectrometer and demonstrates the system end-to-end noise equivalent delta temperature (NEDT) performance. The system aims at augmenting the remote sensing capability from space, with a focus on the Earth’s planetary boundary layer (PBL) thermal microwave (MW) spectral region (0-200 GHz). Combining a Photonic Integrated Circuit (PIC) channelizer and an application-specific integrated circuit (ASIC) spectrometer, the PIC & ASIC (PICASIC) module is capable of processing 40 GHz spectra at hyperspectral (4 MHz) resolution. The photonic technology is agnostic to the spectral region and multiple photonic modules can cover the entire 200 GHz spectrum. Measured results of the end-to-end system NEDT agree with predicted values confirming that the NEDT is primarily dominated by the noise figure of the MW front-end, with the optical link adding no significant noise. The data also demonstrate that a single module enables simultaneous super- and hyper-spectral resolution channel analysis across a 40 GHz range.
Abstract Electrons on helium form a unique two-dimensional system on the interface of liquid helium and vacuum. A small number of trapped electrons on helium exhibits strong interactions in the absence of disorder, and can be used as a qubit. Trapped electrons typically have orbital frequencies in the microwave regime and can therefore be integrated with circuit quantum electrodynamics (cQED), which studies light–matter interactions using microwave photons. Here, we experimentally realize a cQED platform with the orbitals of single electrons on helium. We deterministically trap one to four electrons in a dot integrated with a microwave resonator, allowing us to study the electrons’ response to microwaves. Furthermore, we find a single-electron-photon coupling strength of $$g/2\pi =4.8\pm 0.3$$ g ∕ 2 π = 4.8 ± 0.3 MHz, greatly exceeding the resonator linewidth $$\kappa /2\pi =0.5$$ κ ∕ 2 π = 0.5 MHz. These results pave the way towards microwave studies of Wigner molecules and coherent control of the orbital and spin state of a single electron on helium.