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At least 253 records · Page 14

III–V Solar Cells Grown on Unpolished and Reusable Spalled Ge Substrates

Substrate reuse offers a promising route toward enabling high-efficiency III-V solar cells to become cost-competitive for one-sun terrestrial applications. In this study, Ge films were spalled using an electroplated Ni stressor layer, and the fracture surface was characterized. Initial heteroepitaxial GaAs films grown on spalled Ge substrates by hydride vapor phase epitaxy were found to be single crystal with nearly equivalent growth rates between growth on epi-ready and unpolished spalled Ge substrates. We show the first demonstration of III-V solar cells (GaInAsP, E g ~ 1.7 eV) grown on unpolished spalled Ge substrates to assess the viability of substrate reuse. We demonstrate equivalent performance for a solar cell grown on spalled Ge and on a coloaded epi-ready Ge substrate, despite the residual roughness on the spalled Ge substrate and the lack of any substrate surface preparation. This initial demonstration of combining substrate reuse with the ability to grow III-V solar cells using a high growth rate and high throughput deposition process is a promising step toward low-cost III-V photovoltaics.

14 SOLAR ENERGY↗

Spray-Coated Silver as Backside Metal for III–V Photovoltaic Devices on GaAs and Ge Substrates

The accelerated increase in demand for III-V space photovoltaics on GaAs and Ge substrates, as well as growing interests in terrestrial applications, motivate the development of cost-effective, high-throughput processing routes of these materials. Here, in this study, we assess spray-coated silver (Ag) back contact metallization as a substitute for electron-beam-evaporated metals currently used in industry. We find that the spray-coated Ag films are dense and continuous. By means of quantum efficiency, dark current-voltage, and illuminated current-voltage characterizations, we show that spray-coated GaAs and Ge solar cells perform similarly to baseline devices with electroplated Au, including under high current densities. We estimate that the thresholds for specific contact resistance below which back contacts do not significantly contribute to resistive loss are 2.1 x 10 -1 Ω•cm 2 for GaAs and 4.7 x 10 -2 Ω•cm 2 for Ge. We experimentally confirm that our spray-coated samples meet these requirements. Peel tests show that the adhesion of plain spray-coated Ag films to the back of p-type Ge substrates used in III-V solar cells is currently insufficient, whereas adhesion to p-type GaAs substrates is outstanding and requires no further optimization.

14 SOLAR ENERGY↗

Tutorial on forming through-silicon vias

Through-silicon vias (TSVs) are a critical technology for three-dimensional integrated circuit technology. These through-substrate interconnects allow electronic devices to be stacked vertically for a broad range of applications and performance improvements such as increased bandwidth, reduced signal delay, improved power management, and smaller form-factors. There are many interdependent processing steps involved in the successful integration of TSVs. This article provides a tutorial style review of the following semiconductor fabrication process steps that are commonly used in forming TSVs: deep etching of silicon to form the via, thin film deposition to provide insulation, barrier, and seed layers, electroplating of copper for the conductive metal, and wafer thinning to reveal the TSVs. Recent work in copper electrochemical deposition is highlighted, analyzing the effect of accelerator and suppressor additives in the electrolyte to enable void-free bottom-up filling from a conformally lined seed metal.

42 ENGINEERING↗

Application of templated vapor-liquid-solid growth to heteroepitaxy of InP on Si

Direct growth of III–V semiconductors on Si promises to combine the superior optoelectronic properties of III–Vs with the existing large-scale fabrication capabilities for Si. Vapor-liquid-solid-based growth techniques have previously been used to grow optoelectronic-quality III–Vs in polycrystalline films and various photolithography-defined features. We show that templated vapor-liquid-solid growth can produce epitaxial material when performed on crystalline substrates. In templated vapor-liquid-solid growth, the metal group-III precursor is evaporated along with a capping SiO 2 layer on the crystalline substrate, then melted and converted with exposure to a vapor-phase group-V precursor. We demonstrate homoepitaxial growth of InP on InP wafers using two forms of the SiO x capping layer to confine the liquid metal: evaporated SiO 2 and solgel SiO x , the latter of which is necessary for growth on Si. We then demonstrate heteroepitaxial growth of InP islands on Si substrates from both evaporated and electroplated In metals. The templated vapor-liquid-solid process provides better material utilization and growth rates than common vapor-phase techniques, with similar control and convenience, providing a path toward the large-scale fabrication of integrated optoelectronic components.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Editors’ Choice—Rapid Deactivation Convolutes Electrochemical CO 2 Reduction Selectivity Measurements on Gold Rotating Ring Disk Electrodes

Voltammetric measurements of electrochemical CO 2 reduction reaction (CO 2 RR) selectivity on rotating ring disk electrodes (RRDE) are a rapid and sensitive method for quantifying an electrocatalyst’s selectivity, i.e. faradaic efficiency (FE). This method has been applied to polycrystalline Au electrocatalysts where a Au disk electrode catalyzes both the CO 2 RR and hydrogen evolution reaction while the concentric Au ring electrode selectively senses CO by oxidizing CO back to CO 2 . Such measurements enabled fundamental mechanistic studies but suffer from poor inter-laboratory reproducibility. This work identifies causes of variability in RRDE selectivity measurements by comparing protocols with different electrochemical methods, reagent purities, and glassware cleaning procedures. We observed FE CO decrease by 56% during 5 min chronoamperometry measurements, a phenomenon that is not readily apparent in voltammetric scans due to their dynamic nature. Electroplating of electrolyte impurities onto the disk and ring surfaces were identified as a major contributor to Au deactivation. Additionally, the oxygen reduction reaction may lead to higher disk currents in inadequately purged electrolytes, causing an apparent underestimation of FE CO at low overpotentials. Lastly, we propose operational bounds for CO 2 RR selectivity measurements on Au using the RRDE method and provide suggestions on steps for improving the accuracy of this technique.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Enhanced Raman Scattering from NCM523 Cathodes Coated with Electrochemically Deposited Gold

Materials with the general composition LiMO2, where M is a mix of nickel, cobalt, and manganese, have been studied extensively as cathodes for lithium-based electrochemical cells. Some compositions, like LiNi0.5Co0.2Mn0.3O2 (NCM523), have already found application in commercial lithium-ion batteries. Pre-test and post-test analyses of these types of cathodes have benefited greatly from the use of Raman spectroscopy. Specifically, Raman spectroscopy can be used to investigate the phonons of the LiMO2 lattice. This is particularly useful for studies of the LiMO2 after it has been formed into the type of polymer-bonded laminate from which typical battery cathodes are cut. One of the problems that occurs in such studies is that the scattering from the LiMO2 phase gets progressively weaker as the nickel content increases. NCM523 poses one example of this behavior owing to the fact that half of the transition metal content is nickel. In this study we show that the intensity of the Raman scattering from the NCM523 phonons can be significantly increased by electroplating clusters of sub-micron gold particles on NCM523-containing laminate structures. The gold appears to plate somewhat selectively on the NCM523 particles in randomly sized clusters. These clusters stimulate the Raman scattering from the NCM523 to varying extents that can reach nearly 100 times the scattering intensity from uncoated pristine laminates.

cathode↗

Communication—Light-Induced Plating of Aluminum on Silicon in a Lewis Acidic Chloroaluminate Ionic Liquid

Conventional electroplating of aluminum on silicon often requires a seed layer to overcome the high resistivity of the substrate. In this paper, light-induced plating of aluminum directly on a silicon substrate in an ionic liquid is reported. Without any seed layer, the deposited aluminum has good adhesion to the silicon surface. The resistivity of the aluminum deposits is as low as 4 × 10 -6 Ω-cm, which is only about 1.5 times that of bulk aluminum. The suitable wavelength for the light source is 600 nm to 1,000 nm. The effect of plating temperature on morphology of the aluminum deposits is analyzed.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Light-Induced Al Plating on Si for Fabrication of an Ag-Free All-Al Solar Cell

Light-induced electroplating of Al as the front electrode on the n-type emitter of Si solar cells is proposed as a substitute for screen-printed Ag. The advantages and disadvantages of Al over Cu as the front electrode are discussed. The power of a green laser used for patterning of the SiN x antireflection coating is optimized. Conditions for removal of laser damage and contamination on the laser-patterned surface are identified. The effect of plating temperature and post-annealing temperature on Al morphology and resistivity are investigated. Several plating additives are explored to improve the morphology and resistivity of the Al film. Nicotinic acid produces the lowest resistivity of 3.1 μ Ω-cm. However, the lowest contact resistivity between light-induced Al and Si is 69 mΩ-cm 2 due to laser-induced damage to the emitter. The Al film spikes through the thin n-type emitter when annealed at 500 °C causing cell failure. The process reproducibility is also poor due to atmospheric moisture.

14 SOLAR ENERGY↗

Concentrated radiative cooling and its constraint from reciprocity

Concentrated radiative cooling, an analogous concept of the concentrated solar power technology, has the potential of amplifying both the cooling power and the temperature reduction. However, concentrators have not yet been systematically optimized. Moreover, a widely used theoretical approach to analyze such systems has neglected a fundamental constraint from reciprocity, which can lead to an overestimate of cooling performance and unclarified limits of amplification factors. Here we develop a theoretical framework addressing these shortcomings. Modeling suggests the optimized shape and geometric dimensions of concentrators, as well as the limiting cooling power and temperature reduction. Using an electroplated Al 2 O 3 emitter and an optimized conical concentrator, we experimentally amplify the nighttime radiative cooling by 26%.

Dong, Minghao↗

Pulsed Electrodeposition of Tin Electrocatalysts onto Gas Diffusion Layers for Carbon Dioxide Reduction to Formate

In this paper, we discuss a pulse electroplating method for developing tin (Sn)-decorated gas diffusion electrodes (GDEs) for the electrochemical conversion of carbon dioxide (CO 2 ) to formate. The pulse-plated Sn electrodes achieved current densities up to 388 mA/cm 2 , more than two-fold greater than conventionally prepared electrodes (150 mA/cm 2 ), both at a formate selectivity of 80%. Optical and microscopic analyses indicate improvements in deposition parameters could further enhance performance by reducing the catalyst particle size.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Fabrication and testing of high-performance all-metal neutron guides and axisymmetric mirrors by electrochemical replication

Neutron scattering is one of the most useful methods of studying the structure of matter, with applications to biomedical, structural, magnetic and energy-related materials. Neutron-scattering instruments are installed around research reactors or accelerator-based neutron sources, and neutron guides are critical components of these facilities. They are neutron-transport optical devices consisting of state-of-the-art mirrors often tens of meters long. Here we demonstrate a novel fabrication method of all-metallic neutron guides and axisymmetric mirrors by electroplating from precision mandrels. The process allows for the fabrication of single-piece all-metal guides of prismatic and axisymmetric shapes. We also demonstrate supermirror guides and axisymmetric focusing supermirrors produced with the same technology. We present the fabrication and tests of the multilayer-coated replicated guides and optic and show that the mandrel is reproduced with high fidelity and reliability. Furthermore, such supermirror optics will provide game-changing improvements in neutron techniques.

36 MATERIALS SCIENCE↗

Room temperature stress relaxation in nanocrystalline Ni measured by micropillar compression and miniature tension

In this report, we report a micropillar stress relaxation technique employing a stable displacement-controlled, in-situ scanning electron microscope indenter, and unusually large micropillars to precisely measure stress relaxation in electroplated nanocrystalline Ni thin films. The observed stress relaxation is significant under constant displacement: even well below the 0.2% offset yield strength, the stresses relax by ~4% within a minute; in the work hardening regime, stress relaxes by ~9% in 1 min. A logarithmic fit of the relaxation curves is consistent with an Arrhenius thermal activation of plasticity and suggests an activation volume in the vicinity of ~10 b 3 . The apparent and effective activation volumes diverge at lower strains, particularly in the “elastic” regime. These measurements are compared to similar measurements performed on free-standing thin film tensile coupons. Both methods yield similar results, thereby validating the applicability of pillar compression to capture time-dependent plasticity. To our knowledge, these are the first micropillar stress relaxation experiments on metals ever reported.

36 MATERIALS SCIENCE↗

Microbial potentiometric sensor technology for real-time detecting and monitoring of toxic metals in aquatic matrices

Considering that toxic metals can affect metabolic processes in microorganisms adversely, it can be hypothesized that these metals in water matrices would induce a decrease in metabolic activity of the biofilm microorganisms populating the surface of a sensing electrode, which could be registered as a change in the open-circuit potential (OCP) generated by the biofilm microorganisms. The goal of this study was to test this hypothesis and demonstrate the underlying principle that microbial potentiometric sensor (MPS) technology could be used for long-term and real-time monitoring and detection of rapid changes in metal concentrations in realistic aquatic environments. To address the goal, four objective were addressed: (1) a batch reactor with three graphite-based MPS electrodes was fabricated; (2) a set of single-ion solutions and one multiple ion solution were prepared reflecting realistic concentrations of metals found in electroplating wastewaters; (3) the responses of the MPS to the simultaneous presence of multiple toxic metal ions in a single solution were measured; and (4) the changes of the MPS signals to the presence of individual metal ion solutions were examined. While the hypothesis was validated, the study also revealed that the MPS was sufficiently sensitive to not only detect, but also quantify, toxic metal ion concentrations in aqueous solutions. The coefficients of determination, which were R 2 > 0.995, and responsiveness of <1 μmol/L for some toxic metal cations, strongly support the performance of MPS technology in the echelons of expensive analytical tools capable detecting and measuring trace elements.The magnitude of the MPS response was toxic metal specific. When the molar concertation normalizes the inhibition portion of the signal area, the assessed sensitivity order was: Se>Cd>Pb>Ag>Ni> Zn. The study provides valuable information for enforcement agents, environmental professionals, and wastewater treatment operators, so toxic metal pollution and its detrimental impacts can be prevented and mitigated.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Characterizing Enzymatic Deposition for Microelectrode Neurotransmitter Detection

The enzyme immobilization process, one step in creating an enzymatic biosensor, was characterized and analyzed as a function of its physical properties. The neural glutamic biosensor is a flexible device, effectively minimizing trauma to the area of implantation. The Multielectrode Array (MEA) is composed primarily of a proprietary polymer which has been successfully implanted into human subjects in recent years. This polymer allows the device the pliability that other devices normally lack, though this poses some challenges to implantation. The electrodes are made of Platinum (Pt), and can range in number from eight to thirty two electrodes per device. These electrodes are electroplated with a semipermeable polymer layer to improve selectivity of the electrode to the neurotransmitter of interest, in this case glutamate. A signal is created from the interaction of glutamate in the brain with the glutamate oxidase (GluOx) which is immobilized on the surface of the electrode by using crosslinking chemistry in conjunction with glutaraldehyde and Bovine Serum Albumin (BSA). The glutamate is oxidized by glutamate oxidase, producing α-ketoglutarate and hydrogen peroxide (H 2 O 2 ) as a by-product. The production of H 2 O 2 is crucial for detection of the presence of the glutamate within the enzymatic coating, as it diffuses through the enzyme layer and oxidizes at the surface of the electrode. This oxidation is detectable by measurable change in the current using amperometry. Hence, the MEA allows for in vivo monitoring of neurotransmitter activity in real time. The sensitivity of the sensor to these neurotransmitters is dependent on the thickness of the layer, which is investigated in these experiments in order to optimize the efficacy of the device to detecting the substrate, once implanted.

59 BASIC BIOLOGICAL SCIENCES↗

MagMicro with Ultra-High Energy Resolution (FY19 Q3 Progress Report)

The fabrication of the MMC detector arrays involves two photolithographic procedures. The first is to fabricate the Nb magnetization coil and pick-up coils, the SQUID preamplifiers and the associated wiring. This is done on a full 4” Si wafer, which is subsequently diced into ~0.5 cm2 SQUID chips and ~1 cm2 detector chips. The detector chips are then processed separately by depositing and patterning the paramagnetic Ag:Er sensor and support structures and then electroplating the Au absorber. In Q3, we have successfully completed the full wafer processing for the 32-pixel MMC detector arrays, diced the 4” wafer into the smaller chips and tested the individual components. The coils have the required critical current, the heat switches have a critical temperature in the desired range, and the SQUIDs have the required low noise. Unfortunately, the sputter deposition of the paramagnetic Ag:Er sensor failed several times. We spent considerable time to trace the problem to contaminations of the purifier for the Ar sputtering gas that had been exposed to atmosphere for an extended time during an earlier clean room upgrade. We then determined that the purifier is not essential for high-quality Ag:Er sensor films (Fig. 1), and successfully deposited the Ag:Er sensor film on the ~1 cm 2 detector chip.

42 ENGINEERING↗

MagMicro with Ultra-High Energy Resolution (FY19 Q4 Progress Report)

In Q4, we have completed the fabrication of the first set of four 32-pixel MMC gamma detector arrays (Figure 1.) After we had finally identified and corrected the problems with the deposition of the paramagnetic Ag:Er sensor in Q3, we deposited and patterned the insulators and adhesion layers and electroplated the Au absorber to complete the device.

42 ENGINEERING↗

Manufacturing of low-background copper electrical components for rare-event detection. Final report

This SBIR Phase I project developed the manufacturing capability for the production of ultra-low-background copper and lead for use in electronic interconnects and support architecture. Copper is an attractive electronic and support material because of its favorable conductivity and mechanical properties. Fortuitously, the material can also be electroplated with high radiopurity, particularly if the electroforming is performed in shielded, buried facilities within which the cosmogenic background is minimized. The machining of the electroformed copper into wires, feedthroughs, and support hardware can potentially introduce impurities through the shop environment or through the dies used in wire-drawing and part formation. During Phase I, we demonstrated an alternative low-cost solution-based approach in which copper nanoparticles are colloidally-grown and self-assembled into solids that can serve as thermal structures- such as cold-fingers, mechanical structures- such as the inner shielding lining, and electronic devices. We demonstrated ultrastrong, high-conductivity free-standing copper conductors during Phase I suitable for battery electrodes, interconnects, and cabling, all components that enable next-generation flexible electronics. In nanoparticle form, copper forms in a crystalline lattice with very low impurity content, but its self-assembly is facilitated by organic capping ligands that can serve as impurity sources. Upon the formation of a colloidal solid, the copper particles can be fused and the organic components evaporated through vacuum annealing. The study of ultra-pure copper was expanded during Phase I to include nanostructured lead, which is an important radiation-shielding material. By growing lead particles in a water-based solution the resulting solution can be poured into the desired form-factor mold, within which it will self-assemble and harden upon evaporation of the water and any organics. The effort during Phase II is designed to complete the development of the manufacturing process and to use that process to deliver high radio-purity copper and lead components to the rare-event detection community so that the noise-floor contribution from the surrounding materials is substantially eliminated.

36 MATERIALS SCIENCE↗

A Novel Low-Cost Method of Manufacturing Nb3Sn Superconductors with Multiple-Tin-Tube Sources (CRADA FRA-2008-0001 Final Report)

In order to successfully sustain a fusion reaction, peak magnetic fields on the order of 12-13 Tesla will be required. Magnetic fields of this magnitude can only be accomplished by advanced superconductors such as Nb3Sn. However, the economic success of a fusion machine will depend on further improvements in the cost-performance of the Nb3Sn conductor. This project will develop a novel, low-cost, multiple-tin-tube process as a new manufacturing approach for large-scale Nb3Sn-conductor production. The process will be suitable for the efficient production of larger strands (0.83 mm), consistent with ITER (International Thermonuclear Experimental Reactor) specifications. In Phase I, Cu/Nb composites were manufactured and shaped into sub-elements. These sub-elements were tin-coated by electroplating, assembled into a precise-fit restack billet tube, and drawn to 0.83 mm diameter. In Phase II, the process will be scaled-up to full production levels. The improved Nb3Sn conductor should have an immediate benefit for high-field magnet applications. A prototype fusion machine, based on a cost effective Nb3Sn conductor, would have enormous economic and social benefits. In addition, the conductor should be applicable to nuclear magnetic resonance (NMR), which has requirements for use in chemical research, biochemistry, pharmaceutical chemistry, polymer science, petroleum research, agricultural chemistry, and medicine. Leszek Motowidlo, Principal Investigator, will be responsible for the overall coordination of the effort. He and others of SupraMagnetics staff will design and fabricate protoype PIT Nb3Sn conductors for evaluation at Fermilab. Emanuela Barzi will be responsible for the Fermilab subcontract and will coordinate and supervise critical current testing Nb3Sn strands and cable fabrication and evaluation.

43 PARTICLE ACCELERATORS↗