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At least 253 records · Page 14

Electrical Capacitance Volume Tomography with High-Contrast Dielectrics

The Electrical Capacitance Volume Tomography (ECVT) system has been designed to complement the tools created to sense the presence of water in nonconductive spacecraft materials, by helping to not only find the approximate location of moisture but also its quantity and depth. The ECVT system has been created for use with a new image reconstruction algorithm capable of imaging high-contrast dielectric distributions. Rather than relying solely on mutual capacitance readings as is done in traditional electrical capacitance tomography applications, this method reconstructs high-resolution images using only the self-capacitance measurements. The image reconstruction method assumes that the material under inspection consists of a binary dielectric distribution, with either a high relative dielectric value representing the water or a low dielectric value for the background material. By constraining the unknown dielectric material to one of two values, the inverse math problem that must be solved to generate the image is no longer ill-determined. The image resolution becomes limited only by the accuracy and resolution of the measurement circuitry. Images were reconstructed using this method with both synthetic and real data acquired using an aluminum structure inserted at different positions within the sensing region. The cuboid geometry of the system has two parallel planes of 16 conductors arranged in a 4 4 pattern. The electrode geometry consists of parallel planes of copper conductors, connected through custom-built switch electronics, to a commercially available capacitance to digital converter. The figure shows two 4 4 arrays of electrodes milled from square sections of copper-clad circuit-board material and mounted on two pieces of glass-filled plastic backing, which were cut to approximately square shapes, 10 cm on a side. Each electrode is placed on 2.0-cm centers. The parallel arrays were mounted with the electrode arrays approximately 3 cm apart. The open ends were surrounded by a metal guard to reduce the sensitivity of the electrodes to outside interference and to help maintain the spacing between the arrays. Other uses for this innovation potentially include quantifying the amount of commodity remaining in the fuel and oxidizer tanks while on-orbit without having to fire spacecraft engines. Another orbit application is moisture sensing in plant-growth experiments because microgravity causes moisture in soil to distribute itself in unusual ways. At the moment, the hardware and image reconstruction technique may only be of interest to people involved in nondestructive evaluation. The reconstructed image takes almost a full week to reproduce with existing computer power. However, because computer power and speeds follows Moore s Law, execution times are likely to become acceptable within the next five to eight years. The code was written in Mathematica for dedicated use with the ECVT system. In its present form, it is not suitable to be used directly as a consumer product. However, the code could be likely improved by rewriting it in a compiled language such as C or Fortran.

Nurge, Mark↗

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗

Making & Breaking the Rules for DED Design

Design for Additive Manufacturing (DfAM) is widely used to describe design activities and guidelines employed in the creation of Additively Manufactured (AM) parts. Basic design rules for widely adopted processes like Powder Bed Fusion (PBF) are relatively understood including material performance, part size constraints, self-supporting angles, overhangs, wall thicknesses, and feature resolution. Complexity is often inherent with PBF using organically inspired solutions through generative design and topology optimization software to create designs that often cannot be realized via traditional manufacturing processes. The design rules for Directed Energy Deposition (DED) are less well known, and, in some cases, the lack of understanding is likely inhibiting broader application of the various DED processes. This presentation covers key design rules for DED fusion processes and elucidates opportunities like multi-material deposition and build approaches ranging from basic features to complex large-scale parts. Complementary to the opportunistic characteristics of DfAM for DED, Manufacture for AM (MfAM) encompasses the restrictive aspects of the manufacturing lifecycle with limitations due to bead width and wall thickness, self-supporting angles, surface texture, microstructural evolution, and residual stresses. AM enabled part design must always consider the entire value chain starting with incoming feedstock (e.g. plate, wire, or powder) and progressing through the printing process, post-processing (e.g. machining, inspection), and final system assembly. Key considerations, like the tradeoffs between feature resolution and build rate, for process and part selection and economic assessments will be discussed as DED is often traded against other AM processes. After highlighting typical DED design rules, we will also show how some of those rules can be broken via use cases and part designs that span the full spectrum of DED processes with examples of various DED part designs.

Additive Manufacturing↗

Characterization of Structural Vibration and Acoustic Radiation with a Beam-Array Doppler Vibrometer

This paper discusses the operational principles of an assembly of two opto-electronic modules with their configurations based on a Laser-Array Doppler Vibrometer (LADV) and a Shack-Hartmann Wavefront Sensor (SHWFS). Both sensors can operate concurrently providing complementary data. While the SHWFS is a well-established system that enables low-bandwidth spatio-temporal characterization of aerodynamic turbulence, the LADV technology allows real-time detection of structural vibrations and associated acoustic radiation fields. Practical examples are shown of the instruments’ capabilities, focusing on the ability to simultaneously capture, visualize and quantitatively characterize full-field non-stationary structural dynamics and unsteady sound fields or transient flow fields around ground test facility airframe models or other structures of interest. The parallel multi-channel architecture of the LADV system enables synchronous detection and temporal correlation of indicators related to the spatio-temporal vibration of the structure under inspection. This unique feature is essential for real time detection and categorization of the structural and acoustic dynamics of transient events. For the present study, the LADV data have been successfully compared with measurements obtained with the SHWFS in the wake of a subsonic scale-model airfoil. The ability of the LADV-SHWFS coupled measurements to perform real time non-intrusive evaluation and characterization of dynamic processes at operationally relevant bandwidths should provide a deeper insight into the complex structural dynamics that contribute to radiated sound fields.

Vladimir B Markov↗

NASA Tech Briefs, February 2004

Topics include: Simulation Testing of Embedded Flight Software; Improved Indentation Test for Measuring Nonlinear Elasticity; Ultraviolet-Absorption Spectroscopic Biofilm Monitor; Electronic Tongue for Quantitation of Contaminants in Water; Radar for Measuring Soil Moisture Under Vegetation; Modular Wireless Data-Acquisition and Control System; Microwave System for Detecting Ice on Aircraft; Routing Algorithm Exploits Spatial Relations; Two-Finger EKG Method of Detecting Evasive Responses; Updated System-Availability and Resource-Allocation Program; Routines for Computing Pressure Drops in Venturis; Software for Fault-Tolerant Matrix Multiplication; Reproducible Growth of High-Quality Cubic-SiC Layers; Nonlinear Thermoelastic Model for SMAs and SMA Hybrid Composites; Liquid-Crystal Thermosets, a New Generation of High-Performance Liquid-Crystal Polymers; Formulations for Stronger Solid Oxide Fuel-Cell Electrolytes; Simulation of Hazards and Poses for a Rocker-Bogie Rover; Autonomous Formation Flight; Expandable Purge Chambers Would Protect Cryogenic Fittings; Wavy-Planform Helicopter Blades Make Less Noise; Miniature Robotic Spacecraft for Inspecting Other Spacecraft; Miniature Ring-Shaped Peristaltic Pump; Compact Plasma Accelerator; Improved Electrohydraulic Linear Actuators; A Software Architecture for Semiautonomous Robot Control; Fabrication of Channels for Nanobiotechnological Devices; Improved Thin, Flexible Heat Pipes; Miniature Radioisotope Thermoelectric Power Cubes; Permanent Sequestration of Emitted Gases in the Form of Clathrate Hydrates; Electrochemical, H2O2-Boosted Catalytic Oxidation System; Electrokinetic In Situ Treatment of Metal-Contaminated Soil; Pumping Liquid Oxygen by Use of Pulsed Magnetic Fields; Magnetocaloric Pumping of Liquid Oxygen; Tailoring Ion-Thruster Grid Apertures for Greater Efficiency; and Lidar for Guidance of a Spacecraft or Exploratory Robot.

Source record↗

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

plastic ball grid array (PBGA)↗

Automated Counting of Particles To Quantify Cleanliness

A machine vision system, similar to systems used in microbiological laboratories to count cultured microbes, has been proposed for quantifying the cleanliness of nominally precisely cleaned hardware by counting residual contaminant particles. The system would include a microscope equipped with an electronic camera and circuitry to digitize the camera output, a personal computer programmed with machine-vision and interface software, and digital storage media. A filter pad, through which had been aspirated solvent from rinsing the hardware in question, would be placed on the microscope stage. A high-resolution image of the filter pad would be recorded. The computer would analyze the image and present a histogram of sizes of particles on the filter. On the basis of the histogram and a measure of the desired level of cleanliness, the hardware would be accepted or rejected. If the hardware were accepted, the image would be saved, along with other information, as a quality record. If the hardware were rejected, the histogram and ancillary information would be recorded for analysis of trends. The software would perceive particles that are too large or too numerous to meet a specified particle-distribution profile. Anomalous particles or fibrous material would be flagged for inspection.

Rhode, James↗

Second International Airborne Remote Sensing Conference and Exhibition

The conference provided four days of displays and scientific presentations on applications, technology, a science of sub-orbital data gathering and analysis. The twelve displayed aircraft equipped with sophisticated instrumentation represented a wide range of environmental and reconnaissance missions,including marine pollution control, fire detection, Open Skies Treaty verification, thermal mapping, hydrographical measurements, military research, ecological and agricultural observations, geophysical research, atmospheric and meterological observations, and aerial photography. The U.S. Air Force and the On-Site Inspection Agency displayed the new Open Skies Treaty verification Boeing OC 135B that promotes international monitoring of military forces and activities. SRl's Jetstream uses foliage and ground penetrating SAR for forest inventories, toxic waste delineation, and concealed target and buried unexploded ordnance detection. Earth Search Sciences's Gulfstream 1 with prototype miniaturized airborne hyperspectral imaging equipment specializes in accurate mineral differentiation, low-cost hydrocarbon exploration, and nonproliferation applications. John E. Chance and the U.S. Army Corps of Engineers displayed the Bell 2 helicopter with SHOALS that performs hydrographic surveying of navigation projects, coastal environment assessment, and nautical charting surveys. Bechtel Nevada and U.S. DOE displayed both the Beech King AIR B-200 platform equipped to provide first response to nuclear accidents and routine environmental surveillance, and the MBB BO-105 helicopter used in spectral analysis for environmental assessment and military appraisal. NASA Ames Research Center's high-altitude Lockheed ER-2 assists in earth resources monitoring research in atmospheric chemistry, oceanography, and electronic sensors; ozone and greenhouse studies and satellite calibration and data validation. Ames also showcased the Learjet 24 Airborne Observatory that completed missions in Venus cloud cover analysis, Quadantid meteor shower studies, extra-solar far infrared ionic structure lines measurement, Cape Kennedy launch support, and studies in air pollution, The Products and Services Exhibit showcased new sensor and image processing technologies, aircraft data collection services, unmanned vehicle technology, platform equipment, turn-key services, software a workstations, GPS services, publications, and processing and integration systems by 58 exhibitors. The participation of aircraft users and crews provided unique dialogue between those who plan data collection a operate the remote sensing technology, and those who supply the data processing and integration equipment. Research results using hyperspectral imagery, radar and optical sensors, lidar, digital aerial photography, a integrated systems were presented. Major research and development programs and campaigns we reviewed, including CNR's LARA Project and European Space Agency's 1991-1995 Airborne Campaign. The pre-conference short courses addressed airborne video, photogrammetry, hyperspectral data analysis, digital orthophotography, imagery and GIS integration, IFSAR, GPS, and spectrometer calibration.

Source record↗

Handheld White Light Interferometer for Measuring Defect Depth in Windows

Accurate quantification of defects (scratches and impacts) is vital to the certification of flight hardware and other critical components. The amount of damage to a particular component contributes to the performance, reliability, and safety of a system, which ultimately affects the success or failure of a mission or test. The launch-commit criteria on a Space Shuttle Orbiter window are governed by the depth of the defects that are identified by a visual inspection. This measurement of a defect is not easy to obtain given the environment, size of the defect, and location of the window(s). The determination of depth has typically been performed by taking a mold impression and measuring the impression with an optical profiling instrument. Another method of obtaining an estimate of the depth is by using a refocus microscope. To use a refocus microscope, the surface of the glass and bottom of the defect are, in turn, brought into focus by the operator. The amount of movement between the two points corresponds to the depth of the defect. The refocus microscope requires a skilled operator and has been proven to be unreliable when used on Orbiter windows. White light interferometry was chosen as a candidate to replace the refocus microscope. The White Light Interferometer (WLI) was developed to replace the refocus microscope as the instrument used for measuring the depth of defects in Orbiter windows. The WLI consists of a broadband illumination source, interferometer, detector, motion control, displacement sensor, mechanical housing, and support electronics. The illumination source for the WLI is typically a visible light emitting diode (LED) or a near-infrared superluminescent diode (SLD) with power levels of less than a milliwatt. The interferometer is a Michelson configuration consisting of a 1-in. (2.5-cm) cube beam splitter, a 0.5-in. (1.3-cm) optical window as a movable leg (used to closely match the return intensity of the fixed leg from the window), and a mirrored prism to fold the optics into the mechanical housing. The detector may be one of many C-mount CCD (charge-coupled device) cameras. Motion is provided by a commercial nanostepping motor with a serial interface. The displacement sensor is a custom device specifically designed for this application. The mechanical housing and support electronics were designed to integrate the various components into an instrument that could be physically handled by a technician and easily transported.

Youngquist, Robert↗

The Assurance Challenges of Advanced Packaging Technologies for Electronics

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Sampson, Michael J.↗

XRF Characterization of MMOD Impact Damage

Introduction The Hypervelocity Impact Technology (HVIT) Group at the NASA Johnson Space Center (JSC) has performed over 150 post flight MMOD inspections on returned space-ex-posed hardware and collected over 1,600 samples. Determination of the impactor source typically requires an analysis of the projectile residue in the damage feature. At this time, about 20% of the samples have been processed. Types of Samples Samples in the HVIT group collection can be classified into two types. Indirect (non-destructive) samples are produced when a pliable material (e.g., adhesive tape or dental mold) is inserted into an impact feature. With this type of sampling technique, crater material and (hopefully) projectile residue material is embedded in the sample media and can detected using further chemical characterizing techniques. Direct (destructive) sampling involves the in-tact extraction of material from the spacecraft and is done in a manner that the entire impact feature can be excised intact. This technique provides the greatest chance of successfully determining impactor source due to the entirety of the projectile remnants being present within the collected sample. Updated Projectile Residue Detection Techniques Previous assessments of projectile provenance have involved the use of samples that are first mounted in epoxy, sectioned to expose the crater interior, imaged with a scanning electron microscope (SEM), then any observed impactor residue was then analyzed using an energy dispersive spectrometer (EDS). This technique, while proven, may be supplemented with other types of elemental analysis techniques that can observe major element chemistry, in order to improve throughput of sample analysis. The Astromaterials Research and Exploration Science (ARES) Division at JSC, for example, operates a Bruker M4 Tornado micro-X-Ray fluorescence (XRF) spectrometer, capable of creating elemental maps of areas around these small impact features in a couple of hours, with a spot size <20 μm. The potential advantage with this technique lies in sample preparation, as no polishing or conductive coatings are needed. Early trials attempted to deter-mine impactor composition by collecting spectra from intact samples by aiming the X-Rays directly into the impact feature, but the signal:noise ratio was too low for confident material identification. Sample preparation for XRF then relies on sectioning the samples parallel to the impactor trajectory in order to expose the largest area of subsurface damage possible, thus maximizing the signal from any small impactor remnants. Complementary to the use of XRF for sample analysis, ARES also houses a Nikon XTH 320 micro-X-Ray computed tomography (XCT). This instrument can be used to create 3D visualizations of impact damage for the determination of crater volumes and dimensions, as well as for the determination of the best place to section each sample for the subsequent XRF analysis.

J L Hyde↗

IR DirectFET Extreme Environments Evaluation Final Report

In 2007, International Rectifier (IR) introduced a new version of its DirectFET metal oxide semiconductor field effect transistor (MOSFET) packaging. The new version (referred to as 'Version 2') enhances device moisture resistance, makes surface mount (SMT) assembly of these devices to printed wiring boards (PWBs) more repeatable, and subsequent assembly inspection simpler. In the present study, the National Aeronautics Space Administration (NASA) Jet Propulsion Laboratory (JPL), in collaboration with Stellar Microelectronics (Stellar), continued an evaluation of the DirectFET that they started together in 2006. The present study focused on comparing the two versions of the DirectFET and examining the suitability of the DirectFET devices for space applications. This study evaluated both versions of two DirectFET packaged devices that had both been shown in the 2006 study to have the best electrical and thermal properties: the IRF6635 and IRF6644. The present study evaluated (1) the relative electrical and thermal performance of both versions of each device, (2) the performance through high reliability testing, and (3) the performance of these devices in combination with a range of alternate solder alloys in the extreme thermal environments of deep space....

electronic parts packaging↗

Investigating Laser Beam Welding as an In-Space Joining Technique via Thermal Vacuum and Microgravity and Vacuum Experiments

In-space joining technologies are crucial for stimulating an in-space economy and for enabling sustained space exploration by in-space manufacturing and repair of metallic structures. Compared to brazing or soldering, in-space welding (ISW) can provide highly hermetic, strong, and complex joints, potentially without introducing additional material. However, the influence of extreme temperatures, reduced pressure, and reduced gravity on ISW is not yet fully elucidated. Several efforts at NASA are investigating laser beam welding (LBW) as a joining and repair method in both thermal vacuum (TVAC) and combined vacuum & reduced gravity environments. NASA Marshall Space Flight Center (MSFC) shepherded several ISW projects in its past, including the 1973 electron beam welding on Skylab, the 1989 low-power LBW on parabolic flights, and the unflown 1990s-era In-Space Welding Experiment. Recent parabolic flights and 3 degree-of-freedom ground testing build upon this heritage. A collaboration with the Ohio State University using NASA Langley Research Center (LaRC) hardware retrofitted for LBW achieved the first high-powered laser welds under vacuum and low gravity and developed a workforce capable developing such experimental hardware. A ground testing campaign at the MSFC Flat Floor simulated fit-up and welding representative of ISW in 3 degrees of freedom to emulate microgravity effects on inertial systems. One ongoing effort is a NASA Early Career Initiative project – Lunar Assembly and Servicing by Autonomous Robotics (LASAR). Ruggedized LBW components were developed by an external partner for use in TVAC. A TVAC-rated robotic arm was procured by MSFC and used in the first known robotic laser weld where all components save the laser generator were under vacuum. NASA Johnson Space Center (JSC) is advancing supervised autonomy of ISW. NASA LaRC continues to adapt their unique snowflake joint geometry, suitable for connecting segments in trusses and other structures, to LBW. Upcoming TVAC campaigns will focus on testing extreme temperatures, proving out autonomous operations, and demonstrating weld repair. Weld inspection will occur via a non-contact nondestructive evaluation (NDE) technique – electromagnetic acoustic transduction (EMAT). Another ongoing effort based at MSFC is the DISCMAN -- DIsk-Shaped Configurable and Modular vAcuum uNit – which seeks to development a compact, modular payload that can provide a vacuum environment while in a reduced gravity condition. This payload could support multiple in-space manufacturing developmental efforts, with the first demonstration technology being LBW. Currently, the design is targeting operations in the pressurized volume of a space station, but the payload could readily be adapted to other flight platforms such as parabolic or even suborbital vehicles. LASAR elucidates the effects of temperature and vacuum on LBW while DISCMAN probes those of vacuum and gravity. Through these complementary efforts, NASA is addressing the primary challenges of ISW across the space environment while simultaneously developing and maturing technologies including robotic systems and inspection methodologies for future practical implementation on the Moon and beyond. This approach is timely, as upcoming missions requiring sustained human presence in space will depend on reliable ISW capabilities to create robust metallic joints currently unproven in the space environment and to perform repairs in situ .

hypogravity↗

Environmental Exposure Conditions for Teflon FEP on the Hubble Space Telescope Investigated

The Hubble Space Telescope (HST) was launched into low Earth orbit on April 24,1990. During the first servicing mission in December 1993 (3.6 years after launch), multilayer insulation (MLI) blankets were retrieved from the two magnetic sensing systems located on the light shield. Retrieval of one of the solar arrays during this mission also provided MLI blanket material from the solar array drive arm. These MLI materials were analyzed in ground-based facilities, and results indicate that the space-facing outer layer of the MLI, aluminized Teflon FEP (DuPont; fluorinated ethylene propylene), was beginning to degrade. Close inspection of the FEP revealed through-the-thickness cracks in areas with the highest solar exposure and stress concentration. During the second servicing mission in February 1997 (6.8 years after launch), astronauts observed and documented severe cracking in the outer layer of the MLI blankets on both the solar-facing and anti-solar-facing surfaces. During this second mission, some material from the outer layer of the light shield MLI was retrieved and subsequently analyzed in ground-based facilities. After the second servicing mission, a Failure Review Board was convened by NASA Goddard Space Flight Center to address the MLI degradation problem on HST. Members of the Electro-Physics Branch of the NASA Glenn Research Center at Lewis Field participated on this board. To determine possible degradation mechanisms, board researchers needed to consider all environmental constituents to which the FEP MLI surfaces were exposed. On the basis of measurements, models, and predictions, environmental exposure conditions for FEP surfaces on HST were estimated for various time periods from launch in 1990 through 2010, the planned end-of-life for HST. The table summarizes these data including the number and temperature ranges of thermal cycles; equivalent Sun hours; fluence and absorbed radiation dose from solar event x rays; fluence and absorbed dose from solar wind protons and electrons trapped in Earth s magnetic field; fluence of plasma electrons and protons; and atomic oxygen fluence.

Dever, Joyce A.↗

Space Shuttle Main Engine Joint Data List Applying Today's Desktop Technologies to Facilitate Engine Processing

Boeing-Rocketdyne's Space Shuttle Main Engine (SSME) is the world's first large reusable liquid rocket engine. The space shuttle propulsion system has three SSMEs, each weighing 7,400 lbs and providing 470,000 lbs of thrust at 100% rated power level. To ensure required safety and reliability levels are achieved with the reusable engines, each SSME is partially disassembled, inspected, reassembled, and retested at Kennedy Space Center between each flight. Maintenance processing must be performed very carefully to replace any suspect components, maintain proper engine configuration, and avoid introduction of contaminants that could affect performance and safety. The long service life, and number, complexity, and pedigree of SSME components makes logistics functions extremely critical. One SSME logistics challenge is documenting the assembly and disassembly of the complex joint configurations. This data (joint nomenclature, seal and fastener identification and orientation, assembly sequence, fastener torques, etc.) must be available to technicians and engineers during processing. Various assembly drawings and procedures contain this information, but in this format the required (practical) joint data can be hard to find, due to the continued use of archaic engineering drawings and microfilm for field site use. Additionally, the release system must traverse 2,500 miles between design center and field site, across three time zones, which adds communication challenges and time lags for critical engine configuration data. To aid in information accessibility, a Joint Data List (JDL) was developed that allows efficient access to practical joint data. The published JDL has been a very useful logistics product, providing illustrations and information on the latest SSME configuration. The JDL identifies over 3,350 unique parts across seven fluid systems, over 300 joints, times two distinct engine configurations. The JDL system was recently converted to a web-based, navigable electronic manual that contains all the required data and illustrations in expanded view format using standard PC products (Word, Excel, PDF, Photoshop). The logistics of accurately releasing this information to field personnel was greatly enhanced via the utilization of common office products to produce a more user-friendly format than was originally developed under contract to NASA. This was done without reinventing the system, which would be cost prohibitive on a program of this maturity. The brunt of the joint part tracking is done within the logistics organization and disseminated to all field sites, without duplicating effort at each site. The JDL is easily accessible across the country via the NASA intranet directly at the SSME workstand. The advent of this logistics data product has greatly enhanced the reliability of tracking dynamic changes to the SSME and greatly reduces engineering change turnaround time and potential for errors. Since the inception of the JDL system in 1997, no discrepant parts have propagated to engine assembly operations. This presentation focuses on the challenges overcome and the techniques used to apply today's desktop technologies to an existing logistics data source.

Jacobs, Kenneth↗

Detection of Intergranular Corrosion in Cold Plate Face Sheets

Cold plates are critical for cooling electronic systems in the shuttle. As a result of the environmental conditions in which they operate, water can condense between them and a support shelf. In some cases, this water results in intergranular corrosion in the face sheet. If the intergranular corrosion sufficiently penetrates the face sheet, a coolant leak could occur and jeopardize cold plate operation. This paper examines techniques for detecting and characterizing the intergranular corrosion, to enable recertification of cold plates that have been in operation for 15 plus years. Intergranular corrosion was artificially induced in the face sheets of a series of cold plate specimens using an electrochemical process. Some of the cold plate specimens were separated for destructive characterization of the extent of corrosion produced by the electrochemical process and to insure the induced corrosion was intergranular. The rest of the specimens were characterized nondestructively using several techniques. X-ray tomography and ultrasonic techniques provided the best indication of corrosion in these specimens and will be the focus of this paper. An x-ray tomography technique was shown to be the most effective technique for characterizing depth of the intergranular corrosion. From these measurements, corrosion profile maps were developed that were consistent with subsequent destructive evaluations of the specimens. This enabled the assessment of NDE (ondestructive evaluation) standards to evaluate the viability of other NDE techniques. Due to system constraints, a different technique must be used to inspect an entire cold plate. An ultrasonic technique was shown to be very reliable for detection of corrosion in the unbacked regions of the face sheet. The ultrasonic technique was performed in an alcohol bath to avoid additional corrosion during the NDE evaluation. A pulse echo technique that focuses on the RMS value of the signal is shown to be very sensitive to the presence of intergranular corrosion.

Winfree, William P.↗

NASA-DoD Lead-Free Electronics Project: Vibration Test

Vibration testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is a follow-on to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project which was the first group to test the reliability of lead-free solder joints against the requirements of the aerospace/miLItary community. Twenty seven test vehicles were subjected to the vibration test conditions (in two batches). The random vibration Power Spectral Density (PSD) input was increased during the test every 60 minutes in an effort to fail as many components as possible within the time allotted for the test. The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The number of test minutes required to fail a given component attached with SnPb solder was then compared to the number of test minutes required to fail the same component attached with lead-free solder. A complete modal analysis was conducted on one test vehicle using a laser vibrometer system which measured velocities, accelerations, and displacements at one . hundred points. The laser vibrometer data was used to determine the frequencies of the major modes of the test vehicle and the shapes of the modes. In addition, laser vibrometer data collected during the vibration test was used to calculate the strains generated by the first mode (using custom software). After completion of the testing, all of the test vehicles were visually inspected and cross sections were made. Broken component leads and other unwanted failure modes were documented.

Woodrow, Thomas A.↗

Investigation of MMOD Impact on STS-115 Shuttle Payload Bay Door Radiator

The Orbiter radiator system consists of eight individual 4.6 m x 3.2 m panels located with four on each payload bay door. Forward panels #1 and #2 are 2.3 cm thick while the aft panels #3 and #4 have a smaller overall thickness of 1.3 cm. The honeycomb radiator panels consist of 0.028 cm thick Aluminum 2024-T81 facesheets and Al5056-H39 cores. The face-sheets are topped with 0.005 in. (0.127 mm) silver-Teflon tape. The radiators are located on the inside of the shuttle payload bay doors, which are closed during ascent and reentry, limiting damage to the on-orbit portion of the mission. Post-flight inspections at the Kennedy Space Center (KSC) following the STS-115 mission revealed a large micrometeoroid/orbital debris (MMOD) impact near the hinge line on the #4 starboard payload bay door radiator panel. The features of this impact make it the largest ever recorded on an orbiter payload bay door radiator. The general location of the damage site and the adjacent radiator panels can be seen in Figure 2. Initial measurements of the defect indicated that the hole in the facesheet was 0.108 in. (2.74 mm) in diameter. Figure 3 shows an image of the front side damage. Subsequent observations revealed exit damage on the rear facesheet. Impact damage features on the rear facesheet included a 0.03 in. diameter hole (0.76 mm), a approx.0.05 in. tall bulge (approx.1.3 mm), and a larger approx.0.2 in. tall bulge (approx.5.1 mm) that exhibited a crack over 0.27 in. (6.8 mm) long. A large approx.1 in. (25 mm) diameter region of the honeycomb core was also damaged. Refer to Figure 4 for an image of the backside damage to the panel. No damage was found on thermal blankets or payload bay door structure under the radiator panel. Figure 5 shows the front facesheet with the thermal tape removed. Ultrasound examination indicated a maximum facesheet debond extent of approximately 1 in. (25 mm) from the entry hole. X-ray examinations revealed damage to an estimated 31 honeycomb cells with an extent of 0.85 in. x 1.1 in. (21.6 x 27.9 mm). Pieces of the radiator at and surrounding the impact site were recovered during the repair procedures at KSC. They included the thermal tape, front facesheet, honeycomb core, and rear facesheet. These articles were examined at JSC using a scanning electron microscope (SEM) with an energy dispersive x-ray spectrometer (EDS). Figure 6 shows SEM images of the entry hole in the facesheet. The asymmetric height of the lip may be attributed to projectile shape and impact angle. Numerous instances of a glass-fiber organic matrix composite were observed in the facesheet tape sample. The fibers were approximately 10 micrometers in diameter and variable lengths. EDS analysis indicated a composition of Mg, Ca, Al, Si, and O. Figures 7 and 8 present images of the fiber bundles, which were believed to be circuit board material based on similarity in fiber diameter, orientation, consistency, and composition. A test program was initiated in an attempt to simulate the observed damage to the radiator facesheet and honeycomb. Twelve test shots were performed using projectiles cut from a 1.6 mm thick fiberglass circuit board substrate panel. Results from test HITF07017, shown in figures 9 and 10, correlates with the observed impact features reasonably well. The test was performed at 4.14 km/sec with an impact angle of 45 degrees using a cylindrical projectile with a diameter and length of 1.25 mm. The fiberglass circuit board material had a density of 1.65 g/cu cm, giving a projectile mass of 2.53 mg. An analysis was performed using the Bumper code to estimate the probability of impact to the shuttle from a 1.25 mm diameter particle. Table 1 shows a 1.6% chance (impact odds = 1 in 62) of a 1.25 mm or larger MMOD impact on the radiators of the vehicle during a typical ISS mission. There is a 0.4% chance (impact odds = 1 in 260) that a 1.25 mm or larger MMOD particle would impact the RCC wing leading edge and nose cap during a typical miion. Figure 11 illustrates the vulnerable areas of the wing leading edge reinforced carbon-carbon (RCC), an area of the vehicle that is very sensitive to impact damage. The highlighted red, orange, yellow, and light green areas would be expected to experience critical damage if impacted by an OD particle such as the one that hit the RH4 radiator panel on STS-115.

Hyde, J.↗