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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

An 8-PSK TDMA uplink modulation and coding system

The combination of 8-phase shift keying (8PSK) modulation and greater than 2 bits/sec/Hz drove the design of the Nyquist filter to one specified to have a rolloff factor of 0.2. This filter when built and tested was found to produce too much intersymbol interference and was abandoned for a design with a rolloff factor of 0.4. The preamble is limited to 100 bit periods of the uncoded bit period of 5 ns for a maximum preamble length of 500 ns or 40 8PSK symbol times at 12.5 ns per symbol. For 8PSK modulation, the required maximum degradation of 1 dB in -20 dB cochannel interference (CCI) drove the requirement for forward error correction coding. In this contract, the funding was not sufficient to develop the proposed codec so the codec was limited to a paper design during the preliminary design phase. The mechanization of the demodulator is digital, starting from the output of the analog to digital converters which quantize the outputs of the quadrature phase detectors. This approach is amenable to an application specific integrated circuit (ASIC) replacement in the next phase of development.

Ames, S. A.↗
DOE OSTI2019

FASPAX ASIC revision 1.b first articles testing and support

Fermi National Accelerator Laboratory (Fermilab) and Field Viewers Ltd. Inc. (FV) will work together for a period of two weeks to bring up the FASPAX_V1.0b. During this period, Fermilab will help FV come up to speed with the ASIC functionality testing and train in the usage of the FASPAX test setup at Fermilab that uses the NIPXIe architecture with FleXRIO modules. This setup will be initially used for testing of chips to ensure the basic functionality and design parameters. The NIPXIe setup was developed by the Fermilab team, but it is has not yet been verified to be capable of fully testing the FASPAX_V1.0 chip. Fermilab will offer the developed software and hardware to FV for the on-site use at Fermilab. No guarantee is given by Fermilab for the setup to be able to fully cover the scope of the necessary tests. FV will be responsible for using and modifying of the setup to achieve the DOE-BES Phase-I targets.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
NASA NTRS2005

CdZnTe Image Detectors for Hard-X-Ray Telescopes

Arrays of CdZnTe photodetectors and associated electronic circuitry have been built and tested in a continuing effort to develop focal-plane image sensor systems for hard-x-ray telescopes. Each array contains 24 by 44 pixels at a pitch of 498 m. The detector designs are optimized to obtain low power demand with high spectral resolution in the photon- energy range of 5 to 100 keV. More precisely, each detector array is a hybrid of a CdZnTe photodetector array and an application-specific integrated circuit (ASIC) containing an array of amplifiers in the same pixel pattern as that of the detectors. The array is fabricated on a single crystal of CdZnTe having dimensions of 23.6 by 12.9 by 2 mm. The detector-array cathode is a monolithic platinum contact. On the anode plane, the contact metal is patterned into the aforementioned pixel array, surrounded by a guard ring that is 1 mm wide on three sides and is 0.1 mm wide on the fourth side so that two such detector arrays can be placed side-by-side to form a roughly square sensor area with minimal dead area between them. Figure 1 shows two anode patterns. One pattern features larger pixel anode contacts, with a 30-m gap between them. The other pattern features smaller pixel anode contacts plus a contact for a shaping electrode in the form of a grid that separates all the pixels. In operation, the grid is held at a potential intermediate between the cathode and anode potentials to steer electric charges toward the anode in order to reduce the loss of charges in the inter-anode gaps. The CdZnTe photodetector array is mechanically and electrically connected to the ASIC (see Figure 2), either by use of indium bump bonds or by use of conductive epoxy bumps on the CdZnTe array joined to gold bumps on the ASIC. Hence, the output of each pixel detector is fed to its own amplifier chain.

Chen, C. M. Hubert↗
NASA NTRS2016

An Integrated Circuit for Radio Astronomy Correlators Supporting Large Arrays of Antennas

Radio telescopes that employ arrays of many antennas are in operation, and ever larger ones are being designed and proposed. Signals from the antennas are combined by cross-correlation. While the cost of most components of the telescope is proportional to the number of antennas N, the cost and power consumption of cross-correlationare proportional to N2 and dominate at sufficiently large N. Here we report the design of an integrated circuit (IC) that performs digital cross-correlations for arbitrarily many antennas in a power-efficient way. It uses an intrinsically low-power architecture in which the movement of data between devices is minimized. In a large system, each IC performs correlations for all pairs of antennas but for a portion of the telescope's bandwidth (the so-called "FX" structure). In our design, the correlations are performed in an array of 4096 complex multiply-accumulate (CMAC) units. This is sufficient to perform all correlations in parallel for 64 signals (N=32 antennas with 2 opposite-polarization signals per antenna). When N is larger, the input data are buffered in an on-chipmemory and the CMACs are re-used as many times as needed to compute all correlations. The design has been synthesized and simulated so as to obtain accurate estimates of the IC's size and power consumption. It isintended for fabrication in a 32 nm silicon-on-insulator process, where it will require less than 12mm2 of silicon area and achieve an energy efficiency of 1.76 to 3.3 pJ per CMAC operation, depending on the number of antennas. Operation has been analyzed in detail up to N = 4096. The system-level energy efficiency, including board-levelI/O, power supplies, and controls, is expected to be 5 to 7 pJ per CMAC operation. Existing correlators for the JVLA (N = 32) and ALMA (N = 64) telescopes achieve about 5000 pJ and 1000 pJ respectively usingapplication-specific ICs in older technologies. To our knowledge, the largest-N existing correlator is LEDA atN = 256; it uses GPUs built in 28 nm technology and achieves about 1000 pJ. Correlators being designed for the SKA telescopes (N = 128 and N = 512) using FPGAs in 16nm technology are predicted to achieve about 100 pJ.

ASIC↗
NASA NTRS2012

Flexible Architecture for FPGAs in Embedded Systems

Commonly, field-programmable gate arrays (FPGAs) being developed in cPCI embedded systems include the bus interface in the FPGA. This complicates the development because the interface is complicated and requires a lot of development time and FPGA resources. In addition, flight qualification requires a substantial amount of time be devoted to just this interface. Another complication of putting the cPCI interface into the FPGA being developed is that configuration information loaded into the device by the cPCI microprocessor is lost when a new bit file is loaded, requiring cumbersome operations to return the system to an operational state. Finally, SRAM-based FPGAs are typically programmed via specialized cables and software, with programming files being loaded either directly into the FPGA, or into PROM devices. This can be cumbersome when doing FPGA development in an embedded environment, and does not have an easy path to flight. Currently, FPGAs used in space applications are usually programmed via multiple space-qualified PROM devices that are physically large and require extra circuitry (typically including a separate one-time programmable FPGA) to enable them to be used for this application. This technology adds a cPCI interface device with a simple, flexible, high-performance backend interface supporting multiple backend FPGAs. It includes a mechanism for programming the FPGAs directly via the microprocessor in the embedded system, eliminating specialized hardware, software, and PROM devices and their associated circuitry. It has a direct path to flight, and no extra hardware and minimal software are required to support reprogramming in flight. The device added is currently a small FPGA, but an advantage of this technology is that the design of the device does not change, regardless of the application in which it is being used. This means that it needs to be qualified for flight only once, and is suitable for one-time programmable devices or an application specific integrated circuit (ASIC). An application programming interface (API) further reduces the development time needed to use the interface device in a system.

Clark, Duane I.↗
DOE OSTI2018

Multi-petascale highly efficient parallel supercomputer

A Multi-Petascale Highly Efficient Parallel Supercomputer of 100 petaflop-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC). The ASIC nodes are interconnected by a five dimensional torus network that optimally maximize the throughput of packet communications between nodes and minimize latency. The network implements collective network and a global asynchronous network that provides global barrier and notification functions. Integrated in the node design include a list-based prefetcher. The memory system implements transaction memory, thread level speculation, and multiversioning cache that improves soft error rate at the same time and supports DMA functionality allowing for parallel processing message-passing.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2022

The VMM3a ASIC

The VMM3a is a custom low-noise Application Specific Integrated Circuit. It is intended to be used in the front end readout electronics of both the Micromegas and sTGC detectors of the ATLAS New Small Wheels upgrade project at CERN. It is fabricated in the 130 nm GlobalFoundries 8RF-DM process. Here, the 64 channels with highly configurable parameters, although designed for a specific project, can meet the processing needs of signals from various detector types in several other applications. In this note, the VMM3a, which is the production version of the VMM family, will be presented along with the features incorporated and its performance.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2018

Test beam measurement of ams H35 HV-CMOS capacitively coupled pixel sensor prototypes with high-resistivity substrate

In the context of the studies of the ATLAS High Luminosity LHC programme, radiation tolerant pixel detectors in CMOS technologies are investigated. To evaluate the effects of substrate resistivity on CMOS sensor performance, the H35DEMO demonstrator, containing different diode and amplifier designs, was produced in ams H35 HV-CMOS technology using four different substrate resistivities spanning from 80 cm to 1000 cm. A glueing process using a high-precision flip-chip machine was developed in order to capacitively couple the sensors to FE-I4 Readout ASIC using a thin layer of epoxy glue with good uniformity over a large surface. The resulting assemblies were measured in beam test at the Fermilab Test Beam Facilities with 120 GeV protons and CERN SPS H8 beamline using 180 GeV pions. Furthermore, the in-time efficiency and tracking properties measured for the different sensor types are shown to be compatible with the ATLAS ITk requirements for its pixel sensors.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
NASA NTRS2006

Single Event Effects Test Results for Advanced Field Programmable Gate Arrays

Reconfigurable Field Programmable Gate Arrays (FPGAs) from Altera and Actel and an FPGA-based quick-turnApplication Specific Integrated Circuit (ASIC) from Altera were subjected to single-event testing using heavy ions. Both Altera devices (Stratix II and HardCopy II) exhibited a low latchup threshold (below an LET of 3 MeV-cm2/mg) and thus are not recommended for applications in the space radiation environment. The flash-based Actel ProASIC Plus device did not exhibit latchup to an effective LET of 75 MeV-cm2/mg at room temperature. In addition, these tests did not show flash cell charge loss (upset) or retention damage. Upset characterization of the design-level flip-flops yielded an LET threshold below 10 MeV-cm2/mg and a high LET cross section of about lxlO-6 cm2/bit for storing ones and about lxl0-7 cm2/bit for storing zeros . Thus, the ProASIC device may be suitable for critical flight applications with appropriate triple modular redundancy mitigation techniques.

Field Programmable Gate Arrays↗
NASA NTRS2004

Thermal Vacuum/Balance Test Results of Swift BAT with Loop Heat Pipe Thermal System

The Swift Burst Alert Telescope (BAT) Detector Array is thermally well coupled to eight constant conductance heat pipes (CCHPs) embedded in the Detector Array Plate PAP), and two loop heat pipes (LHPs) transport heat from the CCHPs to a radiator. The CCHPs have ammonia as the working fluid and the LHPs have propylene as the working fluid. Precision heater controllers, which have adjustable set points in flight, are used to control the LHP compensation chamber and Detector Array xA1 ASIC temperatures. The radiator has AZ-Tek's AZW-LA-II low solar absorptance white paint as the thermal coating, and is located on the anti-sun side of the spacecraft. A thermal balance (T/B) test on the BAT was successfully completed. It validated that the thermal design satisfies the temperature requirements of the BAT in the flight thermal environments. Instrument level and observatory level thermal vacuum (TN) cycling tests of the BAT Detector Array by using the LHP thermal system were successfully completed. This paper presents the results of the T/B test and T N cycling tests.

Choi, Michael K.↗
DOE OSTI2020

Beam test performance of prototype silicon detectors for the Outer Tracker for the Phase-2 Upgrade of CMS

A new CMS tracker detector will be installed for operation at the High Luminosity LHC (HL-LHC). This detector comprises modules with two closely spaced parallel sensor plates and front-end ASICs capable of transmitting tracking information to the CMS Level-1 (L1) trigger at the 40 MHz beam crossing rate. The inclusion of tracking information in the L1 trigger decision will be essential for selecting events of interest efficiently at the HL-LHC. The CMS Binary Chip (CBC)has been designed to read out and correlate hits from pairs of tracker sensors, forming so called track stubs. For the first time, a prototype irradiated module and a full-sized module, both equipped with the version 2 of the CBC, have been operated in test beam facilities. The efficiency of the stub finding logic of the modules for various angles of incidence has been studied. The ability of the modules to reject tracks with transverse momentum less than 2 GeV has been demonstrated. For modules built with irradiated sensors, no significant drop in the stub finding performance has been observed. Results from the beam tests are described in this paper.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2024

Assembly of CMS Endcap MIP Timing Detector Module at FNAL

The High-Luminosity LHC (HL-LHC) will enable a more detailed exploration of new phenomena thanks to an anticipated increase in collisions where pileup is expected to reach approximately 200 simultaneous interactions. Many CMS systems will be significantly upgraded to prepare for this new era, including the MIP Timing Detector (MTD) project. The MTD is designed to mitigate the effect of pileup and is set to provide a timestamp accurate to 30 ~ 40 picoseconds for every event, ensuring sustained detector performance at HL-LHC. The MTD is divided into two sections, Barrel Timing Layer (BTL) and Endcap Timing Layer (ETL) which utilize different sensor and ASIC technologies due to the difference in active surfaces, irradiation conditions, and installation schedules. The ETL, composed of two double-sided disks, employs the Low Gain Avalanche Detector (LGAD) sensor and the Endcap Timing Readout Chip (ETROC). More than 8,000 modules, each consisting of four LGAD sensors and ETROCs are required for the ETL detector. These modules will be assembled using an automated robotic gantry that guarantees precise placement at a level of 10 micrometers. In addition, the full assembly of ETL modules includes film application with the jig, wire-bonding, encapsulation with the automated dispensing robot for protecting the wire-bonding, and film curing with a vacuum oven. This talk reports on the successfully completed throughput test with mockup components using the gantry and the successful assembly of real functional modules for beam tests at CERN and FNAL, including the first official ETL module.

Apresyan, Artur↗
DOE OSTI2020

Integrated Circuit Design for Radiation-Hardened Charge-Sensitive Amplifier Survived up to 2 Mrad

According to the continuous development of metal-oxide semiconductor (MOS) fabrication technology, transistors have naturally become more radiation-tolerant through steadily decreasing gate-oxide thickness, increasing the tunneling probability between gate-oxide and channel. Unfortunately, despite this radiation-hardened property of developed transistors, the field of nuclear power plants (NPPs) requires even higher radiation hardness levels. Particularly, total ionizing dose (TID) of approximately 1 Mrad could be required for readout circuitry under severe accident conditions with 100 Mrad around a reactor in-core required. In harsh radiating environments such as NPPs, sensors such as micro-pocket-fission detectors (MPFD) would be a promising technology to be operated for detecting neutrons in reactor cores. For those sensors, readout circuits should be fundamentally placed close to sensing devices for minimizing signal interferences and white noise. Therefore, radiation hardening ability is necessary for the circuits under high radiation environments. This paper presents various integrated circuit designs for a radiation hardened charge-sensitive amplifier (CSA) by using SiGe 130 nm and Si 180 nm fabrication processes with different channel widths and transistor types of complementary metal-oxide-semiconductor (CMOS) and bipolar CMOS (BiCMOS). These circuits were tested under γ–ray environment with Cobalt-60 of high level activity: 490 kCi. The experiment results indicate amplitude degradation of 2.85%–34.3%, fall time increase of 201–1730 ns, as well as a signal-to-noise ratio (SNR) of 0.07–11.6 dB decrease with irradiation dose increase. These results can provide design guidelines for radiation hardening operational amplifiers in terms of transistor sizes and structures.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
NASA NTRS2013

An Offload NIC for NASA, NLR, and Grid Computing

This work addresses distributed data management and access dynamically configurable high-speed access to data distributed and shared over wide-area high-speed network environments. An offload engine NIC (network interface card) is proposed that scales at nX10-Gbps increments through 100-Gbps full duplex. The Globus de facto standard was used in projects requiring secure, robust, high-speed bulk data transport. Novel extension mechanisms were derived that will combine these technologies for use by GridFTP, bandwidth management resources, and host CPU (central processing unit) acceleration. The result will be wire-rate encrypted Globus grid data transactions through offload for splintering, encryption, and compression. As the need for greater network bandwidth increases, there is an inherent need for faster CPUs. The best way to accelerate CPUs is through a network acceleration engine. Grid computing data transfers for the Globus tool set did not have wire-rate encryption or compression. Existing technology cannot keep pace with the greater bandwidths of backplane and network connections. Present offload engines with ports to Ethernet are 32 to 40 Gbps f-d at best. The best of ultra-high-speed offload engines use expensive ASICs (application specific integrated circuits) or NPUs (network processing units). The present state of the art also includes bonding and the use of multiple NICs that are also in the planning stages for future portability to ASICs and software to accommodate data rates at 100 Gbps. The remaining industry solutions are for carrier-grade equipment manufacturers, with costly line cards having multiples of 10-Gbps ports, or 100-Gbps ports such as CFP modules that interface to costly ASICs and related circuitry. All of the existing solutions vary in configuration based on requirements of the host, motherboard, or carriergrade equipment. The purpose of the innovation is to eliminate data bottlenecks within cluster, grid, and cloud computing systems, and to add several more capabilities while reducing space consumption and cost. Provisions were designed for interoperability with systems used in the NASA HEC (High-End Computing) program. The new acceleration engine consists of state-ofthe- art FPGA (field-programmable gate array) core IP, C, and Verilog code; novel communication protocol; and extensions to the Globus structure. The engine provides the functions of network acceleration, encryption, compression, packet-ordering, and security added to Globus grid or for cloud data transfer. This system is scalable in nX10-Gbps increments through 100-Gbps f-d. It can be interfaced to industry-standard system-side or network-side devices or core IP in increments of 10 GigE, scaling to provide IEEE 40/100 GigE compliance.

Awrach, James↗
DOE OSTI2019

The ETROC Project: Precision Timing ASIC Development for LGAD-based CMS Endcap Timing Layer (ETL) Upgrade

The ETROC (Endcap Timing Readout Chip) is being developed for the LGAD-based CMS Endcap Timing Layer (ETL) at HL-LHC. The ETL on each side of the interaction region will be instrumented with a two-disk system of MIP-sensitive LGAD silicon devices to be read out by ETROCs for precision timing measurement with down to 30 ps timing resolution. The ETROC is designed to handle a 16 x 16 pixel cell matrix, with each pixel cell being 1.3 mm x 1.3 mm to match the LGAD sensor pixel size. Approximately 15% of the sensors near the highest eta region will experience hadron fluence above 1e15 neq/cm² towards end of operation of HL-LHC, resulting in small signal amplitude with LGAD gain reduced to around 10. For this reason, the front-end design for preamplifier and discriminator has been specifically optimized for the reduced LGAD signals, with enough flexibilities to meet the ETL specific needs for time resolution, power budget and radiation profile.

97 MATHEMATICS AND COMPUTING↗