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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Thermal Insulation Performance of Textile Structures for Spacesuit Applications at Martian Pressure and Temperature

Protection of astronauts from the extreme temperatures in the space environment has been provided in the past using multi-layer insulation in ultra-high vacuum environments of low earth orbit and the lunar surface. For planetary environments with residual gas atmospheres such as Mars with ambient pressures between 8 to 14 hPa (8 to 14 mbar), new protection techniques are required because of the dominating effect of the ambient gas on heat loss through the insulation. At Mars ambient pressure levels, the heat loss can be excessive at expected suit external temperatures of 172 K with state-of-the-art suit insulation, requiring an active heat source and its accompanying weight and volume penalties. Micro-fibers have been identified as one potential structure to reduce the heat losses, but existing fundamental data on fiber heat transfer at low pressure is lacking for integrated fabric structures. This baseline study presents insulation performance test data at different pressures and fabric loads for selected polyesters and aramids as a function of fiber density, fiber diameter, fabric density, and fabric construction. A set of trend data of thermal conductivity versus ambient pressure is presented for each fiber and fabric construction design to identify the design effects on thermal conductivity at various ambient pressures, and to select a fiber and fabric design for further development as a suit insulation. The trend data also shows the pressure level at which thermal conductivity approaches a minimum, below which no further improvement is possible for a given fiber and fabric design. The pressure levels and resulting thermal conductivities from the trend data can then be compared to the ambient pressure at a planetary surface, Mars for example, to determine if a particular fiber and fabric design has potential as a suit insulation.

Orndoff, Evelyne↗
NASA NTRS2011

Reliability of Solder Materials (Sn-Pb and Pb-Free) for Deep Space Missions

The purpose of this study is to assess the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead (Sn-Pb) and lead-free (Pb-Free) solder alloys under extreme temperature deep space environments.

extreme temperatures↗
NASA NTRS2023

Chapter Fourteen - Space Photovoltaics for Extreme High-Temperature Missions

Solar arrays in space are subjected to a daunting set of environmental hazards, including extreme temperature cycles, particulate and ultraviolet radiation in space, micrometeoroid damage, and exposure to a flux of atomic oxygen in low-Earth orbit. Over the years since the first solar cells were sent into space on Vanguard 1 in 1958, space solar array technology has advanced to develop photovoltaic materials, cells, and arrays resistant to these degradation mechanisms. This chapter highlights approaches to solar array design for near-Sun missions including thermal management at the systems level, to optimize efficiency at elevated temperature, or the use of novel device design to reduce the incident solar energy to limit operating temperature. Several of these have been successfully demonstrated to enable solar-powered spacecraft to explore the near-Sun planets such as Mercury and Venus as well as the Sun itself.

Space photooltaics↗
NASA NTRS2008

Extreme High and Low Temperature Operation of the Silicon-On-Insulator Type CHT-OPA Operational Amplifier

A new operational amplifier chip based on silicon-on-insulator technology was evaluated for potential use in extreme temperature environments. The CHT-OPA device is a low power, precision operational amplifier with rail-to-rail output swing capability, and it is rated for operation between -55 C and +225 C. A unity gain inverting circuit was constructed utilizing the CHT-OPA chip and a few passive components. The circuit was evaluated in the temperature range from -190 C to +200 C in terms of signal gain and phase shift, and supply current. The investigations were carried out to determine suitability of this device for use in space exploration missions and aeronautic applications under wide temperature incursion. Re-restart capability at extreme temperatures, i.e. power switched on while the device was soaked at extreme temperatures, was also investigated. In addition, the effects of thermal cycling under a wide temperature range on the operation of this high performance amplifier were determined. The results from this work indicate that this silicon-on-insulator amplifier chip maintained very good operation between +200 C and -190 C. The limited thermal cycling had no effect on the performance of the amplifier, and it was able to re-start at both -190 C and +200 C. In addition, no physical degradation or packaging damage was introduced due to either extreme temperature exposure or thermal cycling. The good performance demonstrated by this silicon-on-insulator operational amplifier renders it a potential candidate for use in space exploration missions or other environments under extreme temperatures. Additional and more comprehensive characterization is, however, required to establish the reliability and suitability of such devices for long term use in extreme temperature applications.

Patterson, Richard↗
NASA NTRS2024

Bridgeport Urban Development: Leveraging NASA Earth Observations and Sociodemographic Data to Assess Urban Heat Vulnerability and Inform Cool Corridors in Bridgeport, Connecticut

Urban environments face hotter temperatures than suburban and rural areas due to higher concentrations of impervious surfaces, heat-retaining buildings, and lack of green space. Bridgeport, Connecticut, which was formerly a national manufacturing hub, is now the densest and most populous city in the state. Bridgeport experiences hotter temperatures, exposing its residents to more extreme temperatures than the surrounding affluent suburbs. Extreme heat affects the health of those exposed to it and intensifies energy demands. Understanding temperature differences is the first step in effectively directing mitigation efforts. Our partner, Groundwork Bridgeport, along with the Yale Urban Design Workshop, are planning a “cool corridors” project, implementing cooling infrastructure to combat urban heat. We used Landsat 8 Thermal Infrared Sensor and Landsat 9 Thermal Infrared Sensor-2 data to conduct a Land Surface Temperature analysis in Google Earth Engine for the county of Fairfield. A Principal Component Analysis was performed to identify indicators of social vulnerability in Bridgeport. We used the SOlar and LongWave Environmental Irradiance Geometry model to identify felt heat on the block level to inform where the partner should locate their cooling interventions to ensure they are most effective and equitable. We focused on the East Side of Bridgeport, which we found was 10 degrees hotter than other areas of Bridgeport and the neighboring town of Fairfield. We integrated our findings using Earth observations and additional sociodemographic and climate data into final communication products for our partners which will facilitate their selection of candidate locations for their Cool Corridors project.

Silas Kirsch↗
NASA NTRS2017

The Impacts of Rising Temperatures on Aircraft Takeoff Performance

Steadily rising mean and extreme temperatures as a result of climate change will likely impact the air transportation system over the coming decades. As air temperatures rise at constant pressure, air density declines, resulting in less lift generation by an aircraft wing at a given airspeed and potentially imposing a weight restriction on departing aircraft. This study presents a general model to project future weight restrictions across a fleet of aircraft with different takeoff weights operating at a variety of airports. We construct performance models for five common commercial aircraft and 19 major airports around the world and use projections of daily temperatures from the CMIP5 model suite under the RCP 4.5 and RCP 8.5 emissions scenarios to calculate required hourly weight restriction. We find that on average, 10 - 30% of annual flights departing at the time of daily maximum temperature may require some weight restriction below their maximum takeoff weights, with mean restrictions ranging from 0.5 to 4% of total aircraft payload and fuel capacity by mid- to late century. Both mid-sized and large aircraft are affected, and airports with short runways and high temperatures, or those at high elevations, will see the largest impacts. Our results suggest that weight restriction may impose a non-trivial cost on airlines and impact aviation operations around the world and that adaptation may be required in aircraft design, airline schedules, and/or runway lengths.

air transportation system↗
DOE OSTI2024

Explained: Causes of Three Recent Major Blackouts and What Is Being Done in Response

While the power grid is designed to have an adequate supply of electricity generating capacity under hot and cold conditions well above or below average, weather in recent years has approached the bounds of anticipated conditions, in both magnitude and duration. Extreme weather can result in unanticipated levels of electricity demand and correlated power plant outages driven by extreme temperatures. How power system planners account for the changing role of wind and solar also plays an important role in the power grid's ability to supply enough electricity during extreme weather. In response to recent significant outages, power system planners have been focusing on ensuring methods to evaluate reliability during periods of "net peak demand" consider availability of renewable resources and capture the impact of extreme weather on power plants of all types. In particular, there is significant emphasis on the ability of natural gas-fueled power plants to operate during periods of extreme cold temperatures. The impact of extreme weather on the need to change planning processes is demonstrated in this fact sheet that discusses three significant outages that occurred in recent years.

power grid↗
DOE OSTI2026

Performance evaluation of CMIP6 models on the Arctic-Siberian Plain teleconnection affecting the East Asian heat waves

The frequency and intensity of summer heat waves in East Asia have increased sharply in recent decades, significantly impacting public health and the economy. The Arctic-Siberian Plain (ASP) teleconnection pattern has been identified as a key driver, with ASP warming amplifying atmospheric circulation patterns conducive to extreme temperatures. This study evaluates the ability of Coupled Model Inter-comparison Project phase 6 models to simulate the ASP pattern across interannual variability (IAV) and intra-seasonal variability (ISV) timescales using the Common Basis Function method. The multi-model mean shows statistically significant pattern correlations with ERA5 reanalysis, with correlation coefficients of 0.90 and 0.99 for IAV and ISV, respectively. While the ASP pattern is generally well captured, models exhibit substantial inter-model diversity in the intensity and position of anticyclonic anomalies over the ASP and East Asia. Models with ASP pattern variability similar to reanalysis better reproduce extreme East Asian temperatures, whereas those over- or underestimating ASP variability exhibit lower skill. These performance differences are related to differences in simulating key variables associated with the development of the ASP pattern. Our findings highlight the role of the ASP pattern in modulating extreme heat events, as models with improved ASP simulations align more closely with observed temperature extremes. Refining ASP representations in models could enhance seasonal heat wave predictions, improving climate adaptation strategies.

Arctic-Siberian Plain (ASP)↗
DOE OSTI2021

Scaling plant responses to high temperature from cell to ecosystem

Plant survival and productivity decrease with exposure to less favourable environments. The negative effects of environmental factors such as water-deficit and salinity stress on vegetation are relatively well studied, primarily due to the large losses in crop yield and forest biomass caused by these stresses. Although the impact of combined heat and drought on plants has received considerable interest in recent years due to climate change, there has been less focus on ascertaining the impact of heat stress alone at a range of temporal and spatial scales. The steady increase in global mean temperatures and (more importantly) variability in extreme temperatures is translating into more frequent and extreme heat stress episodes, which in turn reduce plant productivity. Further, projected increases in both day and night temperatures and the predicted impact of these changes on agricultural and forest productivity have drawn attention to the need to better address the direct effects of heat on plants. In particular, there has been tremendous interest in understanding the short- and long-term effects of heat at the cellular and whole-plant levels, including work on crops of agricultural importance and species from less managed ecosystems. Hence, we made a concerted effort in this Special Issue to capture recent progress in our ability to quantify the impact of heat stress, and identify new tools and approaches that have been developed and implemented to capture a wide range of responses in plants. The series of reviews and research articles presented here captures our current understanding of plant physiological and molecular responses to heat stress, as well as covering phenotyping methods, genetic diversity and potential routes through which plants can acclimate and adapt to warming climates.

54 ENVIRONMENTAL SCIENCES↗
NASA NTRS2003

Room-temperature continuous operation of InAsSb quantum-dot lasers near 2 mu m based on (100) InP substrate

Single-stack InAsSb self-assembled quantum-dot lasers based on (001) InP substrate have been grown by metalorganic vapor-phase epitaxy. The narrow ridge waveguide lasers lased at wavelengths near 2 mu m up to 25 degrees C in continuous-wave operation. At room temperature, a differential quantum efficiency of 13 percent is obtained and the maximum output optical power reaches 3 mW per facet with a threshold current density of 730 A/cm(sup 2). With increasing temperature the emission wavelength is extremely temperature stable, and a very low wavelength temperature sensitivity of 0.05 nm/degrees C is measured, which is even lower than that caused by the refractive index change.

Semiconductor lasers quantum dots↗
NASA NTRS2015

High Temperature Joining and Characterization of Joint Properties in Silicon Carbide-Based Composite Materials

Advanced silicon carbide-based ceramics and composites are being developed for a wide variety of high temperature extreme environment applications. Robust high temperature joining and integration technologies are enabling for the fabrication and manufacturing of large and complex shaped components. The development of a new joining approach called SET (Single-step Elevated Temperature) joining will be described along with the overview of previously developed joining approaches including high temperature brazing, ARCJoinT (Affordable, Robust Ceramic Joining Technology), diffusion bonding, and REABOND (Refractory Eutectic Assisted Bonding). Unlike other approaches, SET joining does not have any lower temperature phases and will therefore have a use temperature above 1315C. Optimization of the composition for full conversion to silicon carbide will be discussed. The goal is to find a composition with no remaining carbon or free silicon. Green tape interlayers were developed for joining. Microstructural analysis and preliminary mechanical tests of the joints will be presented.

Joining↗
NASA NTRS2016

Experimental Durability Testing of 4H SiC JFET Integrated Circuit Technology at 727 C

We have reported SiC integrated circuits (IC's) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 C [1, 2]. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 C [3]. However, this thermal ramp was not ended until a peak temperature of 880 C (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology. Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 C. In one test, the temperature was ramped and then held at 727 C, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 C before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 C (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 C.

JFET↗
NASA NTRS2016

Experimental Durability Testing of 4H SiC JFET Integrated Circuit Technology at 727 Degrees Centigrade

We have reported SiC integrated circuits (ICs) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 degrees Centigrade. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 degrees Centigrade. However, this thermal ramp was not ended until a peak temperature of 880 degrees Centigrade (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology.Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 degrees Centigrade. In one test, the temperature was ramped and then held at 727 degrees Centigrade, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 degrees Centigrade before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 degrees Centigrade (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 degrees Centigrade.

Silicon Carbide↗
NASA NTRS2006

Temperature-Adaptive Circuits on Reconfigurable Analog Arrays

Demonstration of a self-reconfigurable Integrated Circuit (IC) that would operate under extreme temperature (-180 C and 120 C) and radiation (300krad), without the protection of thermal controls and radiation shields. Self-Reconfigurable Electronics platform: a) Evolutionary Processor (EP) to run reconfiguration mechanism; b) Reconfigurable chip (FPGA, FPAA, etc).

self-recovery↗
NASA NTRS1979

Inflight fuel tank temperature survey data

Statistical summaries of the fuel and air temperature data for twelve different routes and for different aircraft models (B747, B707, DC-10 and DC-8), are given. The minimum fuel, total air and static air temperature expected for a 0.3% probability were summarized in table form. Minimum fuel temperature extremes agreed with calculated predictions and the minimum fuel temperature did not necessarily equal the minimum total air temperature even for extreme weather, long range flights.

Pasion, A. J.↗
NASA NTRSDate not supplied

The Challenges with Material Interfaces in a Nuclear Thermal Propulsion Engine Heat Exchanger

Nuclear Thermal Propulsion (NTP) technology is an enabling technology to send humans to Mars and for agile cis-lunar mobility. NTP systems operate by flowing a propellent through a nuclear reactor. The resulting heated propellent is expulsed through a nozzle to create thrust. A key component in an NTP engine is the heat exchange tubes located within the nuclear reactor. The heat exchange tubes must be able to operate structurally at temperatures up to 2900 K. Carbon-Carbon is a potential material choice for the heat exchange tubes as the material maintains structural integrity at high temperatures. To achieve desired propulsion performance, NTP engines operate at extreme temperatures. In the extreme environment, differences in material coefficients of thermal expansion must be taken into account to avoid potential reduction of engine performance or system failure. Identified potential problems and proposed solutions to material interface challenges in the material interfaces of the heat exchange tubes are discussed, along with lessons learned for future work on NTP engine designs.

Nuclear Thermal Propulsion↗
NASA NTRSDate not supplied

The Challenges with Material Interfaces in a Nuclear Thermal Propulsion Engine Heat Exchanger

Nuclear Thermal Propulsion (NTP) technology is an enabling technology to send humans to Mars and for agile cis-lunar mobility. NTP systems operate by flowing a propellent through a nuclear reactor. The resulting heated propellent is expulsed through a nozzle to create thrust. A key component in an NTP engine is the heat exchange tubes located within the nuclear reactor. The heat exchange tubes must be able to operate structurally at temperatures up to 2900 K. Carbon-Carbon is a potential material choice for the heat exchange tubes as the material maintains structural integrity at high temperatures. To achieve desired propulsion performance, NTP engines operate at extreme temperatures. In the extreme environment, differences in material coefficients of thermal expansion must be taken into account to avoid potential reduction of engine performance or system failure. Identified potential problems and proposed solutions to material interface challenges in the material interfaces of the heat exchange tubes are discussed, along with lessons learned for future work on NTP engine designs.

Nuclear Thermal Propulsion↗
NASA NTRS2011

Stability of a Crystal Oscillator, Type Si530, Inside and Beyond its Specified Operating Temperature Range

Data acquisition and control systems depend on timing signals for proper operation and required accuracy. These clocked signals are typically provided by some form of an oscillator set to produce a repetitive, defined signal at a given frequency. Crystal oscillators are commonly used because they are less expensive, smaller, and more reliable than other types of oscillators. Because of the inherent characteristics of the crystal, the oscillators exhibit excellent frequency stability within the specified range of operational temperature. In some cases, however, some compensation techniques are adopted to further improve the thermal stability of a crystal oscillator. Very limited data exist on the performance and reliability of commercial-off-the-shelf (COTS) crystal oscillators at temperatures beyond the manufacturer's specified operating temperature range. This information is very crucial if any of these parts were to be used in circuits designed for use in space exploration missions where extreme temperature swings and thermal cycling are encountered. This report presents the results of the work obtained on the operation of Silicon Laboratories crystal oscillator, type Si530, under specified and extreme ambient temperatures.

Patterson, Richard L.↗