Microelectronics on the Lunar Orbiter.
Lunar Orbiter flight programmer, electronic design, development, application and performance
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Lunar Orbiter flight programmer, electronic design, development, application and performance
Integrated push-pull power amplifier fabricated on a chip of silicon has interdigitated power transistors and is hermetically encapsulated in a beryllia flat package. It provides current output greater than the nominal 10 amperes from an input current drive of 1 ampere.
Monte Carlo computer analysis method for yield and reliability predictions of integrated circuits
Reliability assurance of microminiaturized electronic devices
Gallium arsenide n-p-n transistors using different crystal materials and fabrication technologies
Integrated S band parametric amplifier design and fabrication using microstrip techniques, describing times four multiplier
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Handbook provides general guidance to the technology of integrated circuits for readers with little or no experience. It does not supply solutions to specific design problems, but is heavily footnoted to the original sources.
Ion implantation process for fabricating active devices in high bandgap semiconductor materials for high temperature operation
Laminar flow benches for particulate contamination control in air flow
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Heat treating insulating crystals in gaseous hydrogen atmosphere produce resistive device which is temperature-independent from 77 to 295 degrees K. Increasing the concentration of hydrogen within the crystal yields semiconductor, hybrid, and metallic conduction characteristics which are combined with a depletion layer at the surface.
Qualification test program for digital monolithic integrated circuit devices
Ion implantation techniques for p-n junction diodes of silicon carbide and gallium arsenide
Microbonding techniques used in hybrid microcircuit production
Ion implantation forming of conducting layers and p-n junctions in gallium arsenide and silicon carbide
Negative-resistance circuits with possible space flight applications are discussed. The basic design approach is to use impedance rotation, i.e., the conversion from capacitance to negative resistance, and from resistance to inductance by the phase shift of the transistor current gain at high frequencies. The subjects discussed in detail are the following: hybrid fabrication of VHF and UHF negative-resistance stages with lumped passive elements; formulation of measurement techniques to characterize transistors and to extend the frequency of negative-resistance transistor amplifiers to higher microwave frequencies; and derivation of transistor characteristics required to increase the frequency range of negative-resistance transistor stages.
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