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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Selective etching technique removes portions of glassivation on a semi-conductor die for failure analysis or repairs. A periodontal needle attached to a plastic syringe is moved by a microprobe. Syringe is filled with a glass etch. A drop of hexane and vacuum pump oil is placed on microcircuit die and hexane is allowed to evaporate leaving a thin film of oil. Microprobe brings needle into contact with area of die to be etched.
Single event upset phenomena are discussed, taking into account cosmic ray induced errors in IIL microprocessors and logic devices, single event upsets in NMOS microprocessors, a prediction model for bipolar RAMs in a high energy ion/proton environment, the search for neutron-induced hard errors in VLSI structures, soft errors due to protons in the radiation belt, and the use of an ion microbeam to study single event upsets in microcircuits. Basic mechanisms in materials and devices are examined, giving attention to gamma induced noise in CCD's, the annealing of MOS capacitors, an analysis of photobleaching techniques for the radiation hardening of fiber optic data links, a hardened field insulator, the simulation of radiation damage in solids, and the manufacturing of radiation resistant optical fibers. Energy deposition and dosimetry is considered along with SGEMP/IEMP, radiation effects in devices, space radiation effects and spacecraft charging, EMP/SREMP, and aspects of fabrication, testing, and hardness assurance.
Improved qualification standards and test procedures for epoxy adhesives used in assembly of high-reliability hybrid microcircuits listed in new report. Objective of standards to resolve problems in areas of outgassing, bond shear strength, corrosivity, volume resistivity, ionic impurities, electrical stability, and frequency of qualification testing. pp
Array of tiny probes tests complex printed circuit boards prior to mounting of microcircuit chips and other active and passive components. Insertion and alignment of board, performance of entire computer-controlled test, and printing of results requires about a minute; performed manually same tests require as much as 30 hours.
The results of research concerning the effects of nuclear and space radiation are presented. Topics discussed include the basic mechanisms of nuclear and space radiation effects, radiation effects in devices, and radiation effects in microcircuits, including studies of radiation-induced paramagnetic defects in MOS structures, silicon solar cell damage from electrical overstress, radiation-induced charge dynamics in dielectrics, and the enhanced radiation effects on submicron narrow-channel NMOS. Also examined are topics in SGEMP/IEMP phenomena, hardness assurance and testing, energy deposition, desometry, and radiation transport, and single event phenomena. Among others, studies are presented concerning the limits to hardening electronic boxes to IEMP coupling, transient radiation screening of silicon devices using backside laser irradiation, the damage equivalence of electrons, protons, and gamma rays in MOS devices, and the single event upset sensitivity of low power Schottky devices.
Useful charge integration has been achieved in high quality photovoltaic InSb diodes when combined with a FET multiplexing (MUX) scheme. An experimental detector assembly with a linear array of 128 InSb diodes coupled to a FEX MUX has been developed. The first stage J-FET preamp, pixel reset switch, MUX, and the InSb array are contained in a hybrid microcircuit of compact dimensions. A low noise preamplifier topology which capitalizes on the low video line capacitance inherent with hybrid fabrication techniques is also utilized. Measurements indicate a signal-to-noise ratio of over 1000:1 and response uniformity of + or - 2 percent. Sample images show subtle detail which supports the estimated radiometric sensitivity of 0.01 K.
The present investigation is concerned with the impact of integrated flight, inlet, and engine control system architectures on system effectiveness and life cycle cost (LCC). The aircraft employed in the investigation is a modified YF-12 with a cruise Mach number of 2.5. The aircraft has two advanced technology aircraft JT-69 afterburning, low-bypass turbofan engines. Advanced technologies suitable for use in future flight/propulsion control systems are related to distributed computer networks, fault tolerant computers and software, analytical redundancy, self-checking microprocessor pairs, advanced direct drive actuators, fiber optic data buses, VLSI microcircuits, and skewed sensors. The integrated architectures were found to have fewer sensors, actuators, and power sources than the nonintegrated architectures.
Standardized methods are established for screening of JAN B microcircuits and JANTXV semiconductor components for space mission or other critical applications when JAN S devices are not available. General specifications are provided which outline the DPA (destructive physical analysis), environmental, electrical, and data requirements for screening of various component technologies. This standard was developed for Air Force Space Division, and is available for use by other DOD agencies, NASA, and space systems contractors for establishing common screening methods for electronic components.
It is noted that complementary metal oxide semiconductor (CMOS) microcircuits are inherently latchup prone. The four-layer n-p-n-p structures formed from the parasitic pnp and npn transistors make up a silicon controlled rectifier. If properly biased, this rectifier may be triggered 'ON' by electrical transients, ionizing radiation, or a single heavy ion. This latchup phenomenon might lead to a loss of functionality or device burnout. Results are presented from tests on 19 different device types from six manufacturers which investigate their latchup sensitivity with argon and krypton beams. The parasitic npnp paths are identified in general, and a qualitative rationale is given for latchup susceptibility, along with a latchup cross section for each type of device. Also presented is the correlation between bit-flip sensitivity and latchup susceptibility.
A computer aided design (CAD) system that is being used at the Jet Propulsion Laboratory for the design of custom and semicustom very large scale integrated (VLSI) chips is described. The system consists of a Digital Equipment Corporation VAX computer with the UNIX operating system and a collection of software tools for the layout, simulation, and verification of microcircuits. Most of these tools were written by the academic community and are, therefore, available to JPL at little or no cost. Some small pieces of software have been written in-house in order to make all the tools interact with each other with a minimal amount of effort on the part of the designer.
A system for the functional testing and simulation of custom and semicustom very large scale integrated (VLSI) chips that are designed using the integrated UNIX-based computer-aided design (CAD) system is described. The testing and simulation system consists of two parts. One of these is a special purpose hardware device that is capable of controlling the digital imputs and outputs on a custom chip. This device, the Digital Microcircuit Functionality Tester (DMFT) system, can be operated by itself or in conjunction with the VAX host computer on the CAD system. The DMFT is integrated into a microprobe station so that these signals can be injected or read from nodes inside the chip, as well as at the pins. The second part of the system is a software package that is installed on the VAX. This software package, logic, includes a full-screen editor for developing chip test sequences and drivers for both the DMFT and the esim logic simulator.
Mark III Hypercube concept applied in development of series of increasingly powerful computers. Processor of each node of Mark III Hypercube ensemble is specialized computer containing three subprocessors and shared main memory. Solves problem quickly by simultaneously processing part of problem at each such node and passing combined results to host computer. Disciplines benefitting from speed and memory capacity include astrophysics, geophysics, chemistry, weather, high-energy physics, applied mechanics, image processing, oil exploration, aircraft design, and microcircuit design.
Proposed random-access-memory (RAM) addressing system, in which memory linked optically to read/write logic circuits, greatly increases computer operating speed. System - comprises addressing circuits including numerous lasers as signal sources, numerous optical gates including optical detectors associated with memory cells, and holographic element to direct light signals to desired memory-cell locations - applied to high-capacity digital systems, supercomputers, and complex microcircuits.
Holographic reticle proposed for use in nondestructive evaluation of surface irregularities. Extends inspection capability to include measurements of depth. Surfaces inspected without contamination, damage, or costly disassembly. Provides valuable information difficult to obtain. For example, surface defects as corrosion and porosity, as well as propagation of cracks, measured accurately. Roughness, wear, and plating thickness also measured. Also used to determine quality of microcircuits.
Various papers on nuclear science are presented. The general topics addressed are: basic mechanisms of radiation effects, dosimetry and energy-dependent effects, isolation technologies, device radiation response and hardening, microcircuit radiation response and hardening, single-event phenomena, hardness assurance and testing techniques, spacecraft charging, space environments and effects.
A laser diode current driver has been developed for free space laser communications. The driver provides 300 mA peak modulation current and exhibits an optical risetime of less than 400 ps. The current and optical pulses are well behaved and show minimal ringing. The driver is well suited for QPPM modulation at data rates up to 440 Mbit/s. Much previous work has championed current steering circuits; in contrast, the present driver is a single-ended on/off switch. This results in twice the power efficiency as a current steering driver. The driver electrical efficiency for QPPM data is 34 percent. The high speed switch is realized with a Ku-band GaAsFET transistor, with a suitable pre-drive circuit, on a hybrid microcircuit adjacent to the laser diode.
Subcritical crack growth under mixed-mode loading was studied in soda-lime glass. Pure mode I, combined mode I and mode II, and pure mode II loadings were achieved in precracked disk specimens by loading in diametral compression at selected angles with respect to the symmetric radial crack. Crack growth was monitored by measuring the resistance changes in a microcircuit grid consisting of parallel, electrically conducting grid lines deposited on the surface of the disk specimens by photolithography. Subcritical crack growth rates in pure mode I, pure mode II, and combined mode I and mode II loading could be described by an exponential relationship between crack growth rate and an effective crack driving force derived from a mode I-mode II fracture toughness envelope. The effective crack driving force was based on an empirical representation of the noncoplanar strain energy release rate. Stress intensities for kinked cracks were assessed using the method of caustics and an initial decrease and a subsequent increase in the subcritical crack growth rates of kinked cracks were shown to correlate with the variations of the mode I and the mode II stress intensities.
A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.