Loss of hydrogen atoms in H{sub 2} plasma on the surfaces of materials used in EUV lithography
Low-pressure hydrogen is an important component of the working medium in extreme ultraviolet (EUV) projection lithography. Under the action of EUV photons and fast secondary electrons on the gas medium, plasma and atomic hydrogen, actively interacting with the surface, are produced. This interaction is very important, because it largely determines the lifetime of the multilayered EUV optics. In this study, the loss of atomic hydrogen under the conditions of a low pressure (<10 Torr) RF plasma discharge on the surfaces of materials used in EUV lithography is investigated. The surface loss probabilities of H atoms on these materials are measured. It is shown that surface recombination of atomic hydrogen goes according to the Eley-Rideal mechanism via direct recombination of H atoms from the gas phase with chemically and physically adsorbed atoms. In this case, the surface recombination probability is mainly determined by the density of chemical adsorption sites. The density of adsorption sites and the desorption energy of H atoms are estimated. The desorption energy of physically adsorbed H atoms on pure metal surfaces (or surfaces exposed to plasma) is about 0.5 eV, and the density of sorption sites is close to the surface density of atoms. This results in a high loss probability of H atoms on metals ({approx}0.1). Therefore, to provide efficient transportation of hydrogen atoms, it is necessary to use materials with the lowest loss probability of H atoms, i.e., dielectrics.