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At least 235 records · Page 13

Copper and nickel partitioning in iron meteorites

Trace element analyses using proton induced X-ray emission and synchrotron X-ray fluorescence have been made on metal and troilite from nine iron meteorites representing five geochemical groups. Nickel and copper distribution coefficients D (troilite/metal) vary by factors of 600 and 20, respectively, correlate positively with kamacite bandwidth and correlate negatively with bulk nickel content. Meteorites with bulk Ni of less than 10 percent have Cu-enriched troilite while those with Ni greater than 10 percent have Cu-depleted troilite. Since magmatic evolution and partial melting will produce Cu-enriched troilite only, the observation of Cu-depleted troilite in Ni-rich meteorites is evidence for subsolidus reequilibration, a process which reduces D(Cu) by transfer of Cu to exsolving metal. Elemental redistribution may have played an important role in establishing the present chemical trends in iron meteorites.

Sutton, S. R.↗

Laser-initiated combustion studies of selected aluminum, copper, iron, and nickel alloys

The results of combustion studies at atmospheric pressure on ten metal alloys are presented. The alloys studied were aluminum alloys 1100, 2219, 6061, and tensile-50; 304, 347 and 21-6-9 stainless steel; inconel 600; beryllium copper and a bronze. It was found that once ignition was achieved all alloys would generally burn to completion. The overall combustion process appears to obey a first order rate process. Preliminary conclusions are presented along with recommendations for future work.

Bransford, J. W.↗

Unique material requirements in the Space Shuttle Main Engines

Components operating in staged-combustion cycle liquid fuel rocket engines such as the Space Shuttle Main Engines (SSMEs) are subjected to severe temperature changes during start/stop transients, together with extremely high pressures, corrosive gases, high fluid velocities, demanding weight-control criteria, etc. Attention is given to the selection and application of metallic and nonmetallic materials for high temperature resistance, cryogenic properties, and hydrogen and oxygen compatibility. The materials in question include polyimides, Kel-F, Armalon, and Teflon among plastics, and gold and copper platings, weld-overlays and heat treatment modifications among metals and metallic processing techniques. The polymeric materials are oxygen-resistant, and the metallic ones hydrogen-resistant.

Fulton, D. L.↗

Development of an all-metal thick-film cost-effective metallization system for solar cells

Screened electrodes made from fluorocarbon activated copper paste and silver fluoride activated copper paste, tape adhesion and scratch tests were studied. Experiments were conducted with variations in past parameters, firing conditions, including gas ambients, furnace furniture, silicon surface and others. A liquid medium intended to provide transport during the carbon fluoride decomposition, is incorporated in the paste.

Ross, B.↗

Shear strength of metal - SiO2 contacts

The strength of the bond between metals and SiO2 was studied by measuring the static coefficient of friction of metals contacting alpha-quartz in ultrahigh vacuum. It was found that copper with either chemisorbed oxygen, nitrogen, or sulphur exhibited higher contact strength on stoichiometric SiO2 than did clean copper. Since the surface density of states induced by these species on copper is similar, it appears that the strength of the interfacial bond can be related to the density of states on the metal surface.

Pepper, S. V.↗

Shear strength of metal - SiO2 contacts

The strength of the bond between metals and SiO2 is studied by measuring the static coefficient of friction of metals contacting alpha-quartz in ultrahigh vacuum. It was found that copper with either chemisorbed oxygen, nitrogen or sulphur exhibited higher contact strength on stoichiometric SiO2 than did clean copper. Since the surface density of states induced by these species on copper is similar, it appears that the strength of the interfacial bond can be related to the density of states on the metal surface.

Pepper, S. V.↗

Investigation of nickel-silicon metallization process

The metallization of silicon solar cells passivated with silicon nitride coating was investigated by using commercial Ni pastes #5517 from Thick Film Systems, #7028-5 from Cermalloy, experimental formulation # X-A by Sollos, Inc. and evaporated Ti-Ni film. Comparative and reference tests were done with the Dupont Ag paste #7095 and with a mixture of Ni paste #5517 with Ag paste #7095 in the respective ratio of 9 to 1 by weight. The evaluation criteria for the metallization was the mechanical bond strength of the contact, solderability, copper plating ability and electrical characteristics in terms of Voc, Isc values and shape of the V-I curve. The results revealed that the Dupont Ag paste #7095 mt all required criteria, while the quality of the cells metalized with the commercial Ni paste #5517 from Thick Film Systems, #7028-5 from Cermalloy as well as the experimental paste # X-A from Sollos, Inc. was below the acceptable standards. A significant improvement was obtained with the mixture of Ni paste #5517 from Thick Film Systems with 10% addition of Dupont paste # 7095.

Macha, M.↗

Energy pulse bonding

To eliminate many of the present termination problems a technique called energy pulse bonding (EPB) was developed. The process demonstrated the capability of: (1) joining conductors without prior removal of insulations, (2) joining conductors without danger of brittle intermetallics, (3) increased joint temperature capability, (4) simultaneous formation of several bonds, (5) capability of higher joint density, and (6) a production oriented process. The following metals were successfully bonded in the solid state: copper, beryllium copper, phosphor bronze, aluminum, brass, and Kovar.

Smith, G. C.↗

Thrust chamber life prediction. Volume 1: Mechanical and physical properties of high performance rocket nozzle materials

Pertinent mechanical and physical properties of six high conductivity metals were determined. The metals included Amzirc, NARloy Z, oxygen free pure copper, electroformed copper, fine silver, and electroformed nickel. Selection of these materials was based on their possible use in high performance reusable rocket nozzles. The typical room temperature properties determined for each material included tensile ultimate strength, tensile yield strength, elongation, reduction of area, modulus of elasticity, Poisson's ratio, density, specific heat, thermal conductivity, and coefficient of thermal expansion. Typical static tensile stress-strain curves, cyclic stress-strain curves, and low-cycle fatigue life curves are shown. Properties versus temperature are presented in graphical form for temperatures from 27.6K (-410 F) to 810.9K (1000 F).

Esposito, J. J.↗

Method for shaping polyethylene tubing

Method forms polyethylene plastic tubing into configurations previously only possible with metal tubing. By using polyethylene in place of copper or stain less steel tubing inlow pressure systems, fabrication costs are significantly reduced. Polyethylene tubing can be used whenever low pressure tubing is needed in oil operations, aircraft and space applications, powerplants, and testing laboratories.

Kramer, R. C.↗

Method of making macrocrystalline or single crystal semiconductor material

A macrocrystalline or single crystal semiconductive material is formed from a primary substrate including a single crystal or several very large crystals of a relatively low melting material. This primary substrate is deposited on a base such as steel or ceramic, and it may be formed from such metals as zinc, cadmium, germanium, aluminum, tin, lead, copper, brass, magnesium silicide, or magnesium stannide. These materials generally have a melting point below about 1000 C and form on the base crystals the size of fingernails or greater. The primary substrate has an epitaxial relationship with a subsequently applied layer of material, and because of this epitaxial relationship, the material deposited on the primary substrate will have essentially the same crystal size as the crystals in the primary substrate. If required, successive layers are formed, each of a material which has an epitaxial relationship with the previously deposited layer, until a layer is formed which has an epitaxial relationship with the semiconductive material. This layer is referred to as the epitaxial substrate, and its crystals serve as sites for the growth of large crystals of semiconductive material. The primary substrate is passivated to remove or otherwise convert it into a stable or nonreactive state prior to deposition of the seconductive material.

Shlichta, P. J.↗

Cryogenic Electric Motor Tested

Technology for pollution-free "electric flight" is being evaluated in a number of NASA Glenn Research Center programs. One approach is to drive propulsive fans or propellers with electric motors powered by fuel cells running on hydrogen. For large transport aircraft, conventional electric motors are far too heavy to be feasible. However, since hydrogen fuel would almost surely be carried as liquid, a propulsive electric motor could be cooled to near liquid hydrogen temperature (-423 F) by using the fuel for cooling before it goes to the fuel cells. Motor windings could be either superconducting or high purity normal copper or aluminum. The electrical resistance of pure metals can drop to 1/100th or less of their room-temperature resistance at liquid hydrogen temperature. In either case, super or normal, much higher current density is possible in motor windings. This leads to more compact motors that are projected to produce 20 hp/lb or more in large sizes, in comparison to on the order of 2 hp/lb for large conventional motors. High power density is the major goal. To support cryogenic motor development, we have designed and built in-house a small motor (7-in. outside diameter) for operation in liquid nitrogen.

Brown, Gerald V.↗

Zipper Connectors for Flexible Electronic Circuits

Devices that look and function much like conventional zippers on clothing have been proposed as connectors for flexible electronic circuits. Heretofore, flexible electronic circuits have commonly included rigid connectors like those of conventional rigid electronic circuits. The proposed zipper connectors would make it possible to connect and disconnect flexible circuits quickly and easily. Moreover, the flexibility of zipper connectors would make them more (relative to rigid connectors) compatible with flexible circuits, so that the advantages of flexible circuitry could be realized more fully. Like a conventional zipper, a zipper according to the proposal would include teeth anchored on flexible tapes, a slider with a loosely attached clasp, a box at one end of the rows of mating teeth, and stops at the opposite ends. The tapes would be made of a plastic or other dielectric material. On each of the two mating sides of the zipper, metal teeth would alternate with dielectric (plastic) teeth, there being two metal teeth for each plastic one. When the zipper was closed, each metal tooth from one side would be in mechanical and electrical contact with a designated metal tooth from the other side, and these mating metal teeth would be electrically insulated from the next pair of mating metal teeth by an intervening plastic tooth. The metal teeth would be soldered or crimped to copper tabs. Wires or other conductors connected to electronic circuits would be soldered or crimped to the ends of the tabs opposite the teeth.

Barnes, Kevin N.↗

Shields for Enhanced Protection Against High-Speed Debris

A report describes improvements over the conventional Whipple shield (two thin, spaced aluminum walls) for protecting spacecraft against high-speed impacts of orbiting debris. The debris in question arises mainly from breakup of older spacecraft. The improved shields include exterior "bumper" layers composed of hybrid fabrics woven from combinations of ceramic fibers and high-density metallic wires or, alternatively, completely metallic outer layers composed of high-strength steel or copper wires. These shields are designed to be light in weight, yet capable of protecting against orbital debris with mass densities up to about 9 g/cubic cm, without generating damaging secondary debris particles. As yet another design option, improved shields can include sparsely distributed wires made of shape memory metals that can be thermally activated from compact storage containers to form shields of predetermined shape upon arrival in orbit. The improved shields could also be used to augment shields installed previously.

Christiansen, Eric L.↗