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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13

All sources NASA NTRS DOE OSTI

NASA NTRS1985

Progress in knowledge representation research

Brief descriptions are given of research being carried out in the field of knowledge representation. Dynamic simulation and modelling of planning systems with real-time sensor inputs; development of domain-independent knowledge representation tools which can be used in the development of application-specific expert and planning systems; and development of a space-borne very high speed integrated circuit processor are among the projects discussed.

Lum, Henry↗

NASA NTRS2010

Configurable Multi-Purpose Processor

Advancements in technology have allowed the miniaturization of systems used in aerospace vehicles. This technology is driven by the need for next-generation systems that provide reliable, responsive, and cost-effective range operations while providing increased capabilities such as simultaneous mission support, increased launch trajectories, improved launch, and landing opportunities, etc. Leveraging the newest technologies, the command and telemetry processor (CTP) concept provides for a compact, flexible, and integrated solution for flight command and telemetry systems and range systems. The CTP is a relatively small circuit board that serves as a processing platform for high dynamic, high vibration environments. The CTP can be reconfigured and reprogrammed, allowing it to be adapted for many different applications. The design is centered around a configurable field-programmable gate array (FPGA) device that contains numerous logic cells that can be used to implement traditional integrated circuits. The FPGA contains two PowerPC processors running the Vx-Works real-time operating system and are used to execute software programs specific to each application. The CTP was designed and developed specifically to provide telemetry functions; namely, the command processing, telemetry processing, and GPS metric tracking of a flight vehicle. However, it can be used as a general-purpose processor board to perform numerous functions implemented in either hardware or software using the FPGA s processors and/or logic cells. Functionally, the CTP was designed for range safety applications where it would ultimately become part of a vehicle s flight termination system. Consequently, the major functions of the CTP are to perform the forward link command processing, GPS metric tracking, return link telemetry data processing, error detection and correction, data encryption/ decryption, and initiate flight termination action commands. Also, the CTP had to be designed to survive and operate in a launch environment. Additionally, the CTP was designed to interface with the WFF (Wallops Flight Facility) custom-designed transceiver board which is used in the Low Cost TDRSS Transceiver (LCT2) also developed by WFF. The LCT2 s transceiver board demodulates commands received from the ground via the forward link and sends them to the CTP, where they are processed. The CTP inputs and processes data from the inertial measurement unit (IMU) and the GPS receiver board, generates status data, and then sends the data to the transceiver board where it is modulated and sent to the ground via the return link. Overall, the CTP has combined processing with the ability to interface to a GPS receiver, an IMU, and a pulse code modulation (PCM) communication link, while providing the capability to support common interfaces including Ethernet and serial interfaces boarding a relatively small-sized, lightweight package.

Valencia, J. Emilio↗

NASA NTRS2009

Advanced Embedded Active Assemblies for Extreme Space Applications

This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.

lead bonding↗

NASA NTRS2003

164-GHz MMIC HEMT Frequency Doubler

A monolithic microwave integrated circuit (MMIC) that includes a high-electron-mobility transistor (HEMT) has been developed as a prototype of improved frequency doublers for generating signals at frequencies greater than 100 GHz. Signal sources that operate in this frequency range are needed for a variety of applications, notably including general radiometry and, more specifically, radiometric remote sensing of the atmosphere. Heretofore, it has been common practice to use passive (diode-based) frequency multipliers to obtain frequencies greater than 100 GHz. Unfortunately, diode-based frequency multipliers are plagued by high DC power consumption and low conversion efficiency. Moreover, multiplier diodes are not easily integrated with such other multiplier-circuit components as amplifiers and oscillators. The goals of developing the present MMIC HEMT frequency doubler were (1) to utilize the HEMT as an amplifier to increase conversion efficiency (more precisely, to reduce conversion loss), thereby increasing the output power for a given DC power consumption or, equivalently, reducing the DC power consumption for a given output power; and (2) to provide for the integration of amplifier and oscillator components on the same chip. The MMIC frequency doubler (see Figure 1) contains an AlInAs/GaInAs/InP HEMT biased at pinch-off to make it function as a class-B amplifier (meaning that it conducts in half-cycle pulses). Grounded coplanar waveguides (GCPWs) are used as impedance-matching transmission lines. Air bridges are placed at discontinuities to suppress undesired slot electromagnetic modes. Another combination of GCPWs also serves both as a low-pass filter to suppress undesired oscillations at frequencies below 60 GHz and as a DC blocker. Large decoupling capacitors and epitaxial resistors are added in the drain and gate lines to suppress bias oscillations. At the output terminal, the fundamental frequency is suppressed by a quarter-wave open stub, which presents a short circuit at the fundamental frequency and an open circuit at the second harmonic. At an input power of 7 mW, the output power and conversion loss at an output frequency of 164 GHz were found to be 5 dBm (approximately equal to 3.2 mW) and 2 dB, respectively, with a 3-dB output-power bandwidth of 14 GHz. This is the best performance reported to date for an MMIC HEMT frequency doubler above 100 GHz.

Samoska, Lorene↗

NASA NTRS1983

Microwave monolithic integrated circuit development for future spaceborne phased array antennas

The development of fully monolithic gallium arsenide (GaAs) receive and transmit modules suitable for phased array antenna applications in the 30/20 gigahertz bands is presented. Specifications and various design approaches to achieve the design goals are described. Initial design and performance of submodules and associated active and passive components are presented. A tradeoff study summary is presented highlighting the advantages of distributed amplifier approach compared to the conventional single power source designs.

Anzic, G.↗

NASA NTRS1984

Microwave monolithic integrated circuit development for future spaceborne phased array antennas

The development of fully monolithic gallium arsenide (GaAs) receive and transmit modules suitable for phased array antenna applications in the 30/20 gigahertz bands is presented. Specifications and various design approaches to achieve the design goals are described. Initial design and performance of submodules and associated active and passive components are presented. A tradeoff study summary is presented, highlighting the advantages of a distributed amplifier approach compared to the conventional single power source designs. Previously announced in STAR as N84-13399

Anzic, G.↗

NASA NTRS1977

Report on phase 1 of the Microprocessor Seminar

Proceedings of a seminar on microprocessors and associated large scale integrated (LSI) circuits are presented. The potential for commonality of device requirements, candidate processes and mechanisms for qualifying candidate LSI technologies for high reliability applications, and specifications for testing and testability were among the topics discussed. Various programs and tentative plans of the participating organizations in the development of high reliability LSI circuits are given.

Source record↗

NASA NTRS1980

Photomask and pattern programs

Package of computer programs helps designers with layout and graphics of photomasks. Photomasks are specifically useful to applications involving fine reproducibility, repetition, and fabrication on planar surfaces of materials, items fabricated from photomasks include circuit boards, magnetic bubble devices and integrated optic circuits.

Kirschman, R. K.↗

DOE OSTI2024

On-PIC Light Source Integration & Micro-dispensing of Solder Paste for Flip Chip Application

To reach the next level benefits of photonic integrated circuits (PICs), the Integrated Photonic Systems Roadmap-International describes the necessity of either heterogeneous or hybrid integration of light sources [1]. A new approach for hybrid integration is Photonic Wire Bonding where 3D nanolithography is used to pattern a polymer waveguide that connects light sources to PIC waveguides. The waveguides resemble electrical wire bonds and essentially do the same as their electrical counterpart for packaging photonic chips together. In order to reap the full benefits of a photonic wire bonds, the light source must be carefully packaged. In this work I seek to expand RIT’s photonic packaging capability by establishing a packaging process to integrate light sources, specifically an Indium Phosphide distributed feedback lasers and a reflective semiconductor optical amplifiers, directly onto a photonic integrated circuits. Another necessary requirement for PIC packaging is densely integrated electrical connectivity. In this thesis I developed a fine pitch flip chip interconnect technique demonstrated using gold stud bumps in conjunction with micro-dispensed solder paste. This work opens the door to high density photonic flip chip applications. The micro-dispensed solder paste dots having diameters 50-125 µm are currently being tested at a pitch of 150 µm . The gold stud bumps are formed with 1mil gold wire creating bumps with a diameter of 40-60 µm depending on specific parameter values. These capabilities will allow RIT to assemble and test novel photonic integrated devices, cutting down on the time and cost associated with third party assembly and tests facilities. Thereby keeping RIT at the forefront of photonic research.

Wongk, Nicole↗

NASA NTRSDate not supplied

Signal and Power Integrity Design Methodology for High-Performance Flight Computing Systems

Computing capabilities of space systems have in-creased onboard performance by orders of magnitude with the use of radiation-tolerant field-programmable gate arrays (FPGA)and processors. The incorporation of signal and power integrity analysis with printed circuit board (PCB) design in reliable computing architectures for space systems has become critical to enable future mission capabilities. Developers launch high-performance processors into a breadth of orbits and missions, running varying applications that create challenges for designing reliable computing hardware. Specifically, for these designs, academic and industry research has focused on component radiation performance, fault mitigation, and reliable architectures. How-ever, other design parameters including electromagnetic interference (EMI), PCB stackup, signal integrity (SI), voltage regulator module (VRM) design, and power distribution network (PDN)are often deprioritized or disregarded as the design matures. Since these characteristics are becoming more significant in high-performance processor designs, this research presents a hardware design and analysis methodology for high-performance, space-computing systems that focuses on a holistic design approach and PDN reliability. While these challenges exist across all space hardware, the reduced PCB dimensions imposed by SmallSats and CubeSats introduce additional hurdles, specifically to VRM and decoupling design. By examining the relationship between the PDN and radiation performance, an analytical relationship is developed that incorporates Total Ionizing Dose and Single-Event Transients to ensure reliability throughout the mission duration. The presented design methodology is applied to the SpaceCube v3.0 Mini, an FPGA-based on-board science data processing system developed at NASA Goddard Space Flight Center.

Advanced avionics↗

NASA NTRS1977

Microprocessor Seminar, phase 2

Workshop sessions and papers were devoted to various aspects of microprocessor and large scale integrated circuit technology. Presentations were made on advanced LSI developments for high reliability military and NASA applications. Microprocessor testing techniques were discussed, and test data were presented. High reliability procurement specifications were also discussed.

Scott, W. R.↗

NASA NTRS1990

Using advanced microelectronic test chips to qualify ASIC's for space

Qualification procedures for complex integrated circuits are being developed under a U.S. government program known as Qualified Manufacturing Lines (QML). This effort is focused on circuits designed by IC manufacturers and has not addressed application specific IC's (ASIC's) designed at system houses. The qualification procedures described here are intended to be responsive to the needs of system houses who design their own ASIC's and have them fabricated at Silicon foundries. A particular focus of this presentation will be the use of the TID (total Ionizing Dose) Chip to evaluate CMOS foundry processes and to provide parameters for circuit simulators. This chip is under development as a standard chip for qualifying the total dose aspects of ASIC's. The benefits of standardization are that the results will be well understood and easy to interpret. Data is presented and compared for 1.6 micron and 3.0 micron CMOS. The data shows that 1.6 micron CMOS is significantly harder than 3.0 micron CMOS. Two failure modes are explored: (1) the radiation-induced degradation of timing delays; and (2) radiation-induced leakage currents.

Buehler, M. G.↗

NASA NTRS1993

Solid-state Isotopic Power Source for Computer Memory Chips

Recent developments in materials technology now make it possible to fabricate nonthermal thin-film radioisotopic energy converters (REC) with a specific power of 24 W/kg and a 10 year working life at 5 to 10 watts. This creates applications never before possible, such as placing the power supply directly on integrated circuit chips. The efficiency of the REC is about 25 percent which is two to three times greater than the 6 to 8 percent capabilities of current thermoelectric systems. Radio isotopic energy converters have the potential to meet many future space power requirements for a wide variety of applications with less mass, better efficiency, and less total area than other power conversion options. These benefits result in significant dollar savings over the projected mission lifetime.

Brown, Paul M.↗

DOE OSTI2023

A Comparative Evaluation and Selection of High-Temperature Heat Exchangers for Application to Integrated Energy Systems

The following report aims to create a refined and well-structured method for comparatively evaluating heat exchanger technologies for integrated energy systems that caters customers’ specific needs while meeting engineering requirements. For the evaluation, this study elevates previous evaluation metrics, enhances the knowledge base via literature and market surveys, and identifies the figures of merit with robust rationales to enhance the quality of decisions made throughout the proposed heat exchanger evaluation process. The heat exchanger designs evaluated as part of the case study are shell and tube heat exchangers, printed circuit heat exchangers, plate heat exchangers, spiral heat exchangers, and heat pipe heat exchangers. The information presented in this report is meant for industries interested in making a preliminary screening process to identify the most suitable heat exchanger design for their application of interest.

42 ENGINEERING↗

DOE OSTI2023

A Comparative Evaluation and Selection of High-Temperature Heat Exchangers for Application to Integrated Energy Systems

42 - ENGINEERING↗

NASA NTRS2016

Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects

Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability.

Body of Knowledge (BOK)↗

NASA NTRS1995

The Impact on Space Radiation Requirements and Effects on ASIMS

The evolution of highly miniaturized electronic and mechanical systems will be accompanied by new problems and issues regarding the radiation response of these systems in the space environment. In this paper we discuss some of the more prominent radiation problems brought about by miniaturization. For example, autonomous micro-spacecraft will require large amounts of high density memory, most likely in the form of stacked, multichip modules of DRAM's, that must tolerate the radiation environment. However, advanced DRAM's (16 to 256 Mbit) are quite susceptible to radiation, particularly single event effects, and even exhibit new radiation phenomena that were not a problem for older, less dense memory chips. Another important trend in micro-spacecraft electronics is toward the use of low-voltage microelectronic systems that consume less power. However, the reduction in operating voltage also caries with it an increased susceptibility to radiation. In the case of application specific integrated microcircuits (ASIM's), advanced devices of this type, such as high density field programmable gate arrays (FPGA's) exhibit new single event effects (SEE), such as single particle reprogramming of anti-fuse links. New advanced bipolar circuits have been shown recently to degrade more rapidly in the low dose rate space environment than in the typical laboratory total dose radiation test used to qualify such devices. Thus total dose testing of these parts is no longer an appropriately conservative measure to be used for hardness assurance. We also note that the functionality of micromechanical Si-based devices may be altered due to the radiation-induced deposition of charge in the oxide passivation layers.

Barnes, C.↗

NASA NTRS1982

Application of MMIC modules in future multiple beam satellite antenna systems

Multiple beam antenna systems for advanced communication satellites operating in the 30/20 GHz frequency bands (30 GHz uplink, 20 GHz downlink) were developed. Up to twenty 0.3 deg HPBW fixed spot beams and six 0.3 deg HPBW scanning spot beams will be required. Array-fed dual reflector antenna systems in which monolithic microwave integrated circuit (MMIC) phase shift and amplifier modules are used with each radiating element of the feed array for beam pointing and power gain were developed. The feasibility of distributed power amplification and beam pointing with MMIC modules in the elements of an array and to develop a data base for future development were demonstrated. The technical discussion centers around the potential advantages of ""monolithic'' antennas for specific applications as compared to systems using high powered TWT's. These include: reduced losses in the beam forming network; advantage of space combining and graceful degradation; dynamic control of beam pointing and illumination contour; and possibilities for cost and weight reduction.

Smetana, J.↗