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At least 235 records · Page 13

Fiber Optic Sensors for Health Monitoring of Morphing Airframes: Bragg Grating Strain and Temperature Sensor - Part 1

Fiber optic sensors are being developed for health monitoring of future aircraft. Aircraft health monitoring involves the use of strain, temperature, vibration and chemical sensors to infer integrity of the aircraft structure. Part 1 of this two part series describes sensors that will measure load and temperature signatures of these structures. In some cases a single fiber may be used for measuring these parameters. Part 2 will describe techniques for using optical fibers to monitor composite cure in real time during manufacture and to monitor in-service integrity of composite structures using a single fiber optic sensor capable of measuring multiple chemical and physical parameters. The facilities for fabricating optical fiber and associated sensors and the methods of demodulating Bragg gratings for strain measurement will be described.

Wood, Karen↗

On-chip Broadband Load Calibrators for Characterizing Transition-Edge Sensor Bolometers

We describe the design and fabrication of on-chip broadband load calibrators for element-by- element and full circuit characterization of transition-edge sensor (TES) bolometers for cosmic microwave background (CMB) polarimetry. Fabricated in a 4 X 4 grid on a 100 mm silicon wafer, the chips allow systematic testing of individual detector circuit elements without the need for an external blackbody source. This in-situ testing approach provides rapid and efficient characterization of various pixel designs in order to optimize the optical efficiency and control of systematic effects of the detectors. In this work, we demonstrate the on-chip calibrators on the Cosmology Large Angular Scale Surveyor (CLASS) W-band pixels. In particular, we investigate the loss on microstrip transmission lines and measure the performance of various designs of TESs, magic-tees, via-less crossovers, and signal terminations. We also test a filter-bank spectrometer with eight resonators spanning 80 – 105 GHz to characterize the spectral response of circuit elements across the detector bandwidth.

Sumit Dahal↗

Fabrication of Extremely Short Length Fiber Bragg Gratings for Sensor Applications

A new technique and a physical model for writing extremely short length Bragg gratings in optical fibers have been developed. The model describes the effects of diffraction on the spatial spectra and therefore, the wavelength spectra of the Bragg gratings. Using an interferometric technique and a variable aperture, short gratings of various lengths and center wavelengths were written in optical fibers. By selecting the related parameters, the Bragg gratings with typical length of several hundred microns and bandwidth of several nanometers can be obtained. These short gratings can be apodized with selected diffraction patterns and hence their broadband spectra have a well-defined bell shape. They are suitable for use as miniaturized distributed strain sensors, which have broad applications to aerospace research and industry as well.

Wu, Meng-Chou↗

Development and Application of Wide Bandwidth Magneto-Resistive Sensor Based Eddy Current Probe

The integration of magneto-resistive sensors into eddy current probes can significantly expand the capabilities of conventional eddy current nondestructive evaluation techniques. The room temperature solid-state sensors have typical bandwidths in the megahertz range and resolutions of tens of microgauss. The low frequency sensitivity of magneto-resistive sensors has been capitalized upon in previous research to fabricate very low frequency eddy current sensors for deep flaw detection in multilayer conductors. In this work a modified probe design is presented to expand the capabilities of the device. The new probe design incorporates a dual induction source enabling operation from low frequency deep flaw detection to high frequency high resolution near surface material characterization. Applications of the probe for the detection of localized near surface conductivity anomalies are presented. Finite element modeling of the probe is shown to be in good agreement with experimental measurements.

Wincheski, Russell A.↗

Fabrication of Microstripline Wiring for Large Format Transition Edge Sensor Arrays

We have developed a process to integrate microstripline wiring with transition edge sensors (TES). The process includes additional layers for metal-etch stop and dielectric adhesion to enable recovery of parameters achieved in non-microstrip pixel designs. We report on device parameters in close-packed TES arrays achieved with the microstrip process including R(sub n), G, and T(sub c) uniformity. Further, we investigate limits of this method of producing high-density, microstrip wiring including critical current to determine the ultimate scalability of TES arrays with two layers of wiring.

Chervenak, James A.↗

Fiber Optic Sensor Components and Systems for Smart Materials and Structures

The general objective of the funded research effort has been the development of discrete and distributed fiber sensors and fiber optic centered opto-electronic networks for the intelligent monitoring of phenomena in various aerospace structures related to NASA Marshall specific applications. In particular, we have proposed and have been developing technologies that we believe to be readily transferrable and which involve new fabrication techniques. The associated sensors developed can be incorporated into the matrix or on the surfaces of structures for the purpose of sensing stress, strain, temperature-both low and high, pressure field variations, phase changes, and the presence of various chemical constituents.

Lyons, R.↗

(abstract) Transmission Electron Microscopy of Al(sub x)Ga(sub 1-x)N/SiC Multilayer Structures

The potential of wide-band-gap III-V nitrides as solar-blind ultraviolet sensors and light emitters has prompted an increasing amount of work recently, including the fabrication of the first UV sensors from as-deposited single crystal GaN. We have used high resolution transmission electron microscopy (TEM) to study the microstructure of two novel developments of wide-band-gap III-V nitrides: the growth of ultra-short period GaN/AlN super lattices (digital alloys); and the incorporation of SiC layers into Al(sub x)Ga(sub 1-x)N structures. By varying the relative periods in a GaN/AlN superlattice, it should be possible to tailor the band gap of the composite to lie between the elemental values of 365 nm for GaN and 200 nm for AlN. The group IV semiconductor, SiC, has a close lattice match (< 3%) to Al(sub x)Ga(sub 1-x)N for growth on the basal plane. Demonstration of epitaxial growth for Al(sub x)Ga(sub 1-x)N/SiC multilayers could enable an extension of direct band-gap material towards the visible.

microscopy GaN AlN semiconductor SiC↗

Communications and control for electric power systems

The first section of the report describes the AbNET system, a hardware and software communications system designed for distribution automation (it can also find application in substation monitoring and control). The topology of the power system fixes the topology of the communications network, which can therefore be expected to include a larger number of branch points, tap points, and interconnections. These features make this communications network unlike any other. The network operating software has to solve the problem of communicating to all the nodes of a very complex network in as reliable a way as possible even if the network is damaged, and it has to do so with minimum transmission delays and at minimum cost. The design of the operating protocols is described within the framework of the seven-layer Open System Interconnection hierarchy of the International Standards Organization. Section 2 of the report describes the development and testing of a high voltage sensor based on an electro-optic polymer. The theory of operation is reviewed. Bulk fabrication of the polymer is discussed, as well as results of testing of the electro-optic coefficient of the material. Fabrication of a complete prototype sensor suitable for use in the range 1-20 kV is described. The electro-optic polymer is shown to be an important material for fiber optic sensing applications. Appendix A is theoretical support for this work. The third section of the report presents the application of an artificial neural network, Kohonen's self-organizing feature map, for the classification of power system states. This classifier maps vectors of an N-dimensional space to a 2-dimensional neural net in a nonlinear way preserving the topological order of the input vectors. These mappings are studied using a nonlinear power system model.

Kirkham, H.↗

Diamond thin film temperature and heat-flux sensors

Diamond film temperature and heat-flux sensors are developed using a technology compatible with silicon integrated circuit processing. The technology involves diamond nucleation, patterning, doping, and metallization. Multi-sensor test chips were designed and fabricated to study the thermistor behavior. The minimum feature size (device width) for 1st and 2nd generation chips are 160 and 5 micron, respectively. The p-type diamond thermistors on the 1st generation test chip show temperature and response time ranges of 80-1270 K and 0.29-25 microseconds, respectively. An array of diamond thermistors, acting as heat flux sensors, was successfully fabricated on an oxidized Si rod with a diameter of 1 cm. Some problems were encountered in the patterning of the Pt/Ti ohmic contacts on the rod, due mainly to the surface roughness of the diamond film. The use of thermistors with a minimum width of 5 micron (to improve the spatial resolution of measurement) resulted in lithographic problems related to surface roughness of diamond films. We improved the mean surface roughness from 124 nm to 30 nm by using an ultra high nucleation density of 10(exp 11)/sq cm. To deposit thermistors with such small dimensions on a curved surface, a new 3-D diamond patterning technique is currently under development. This involves writing a diamond seed pattern directly on the curved surface by a computer-controlled nozzle.

Aslam, M.↗

The Development of Metal Oxide Chemical Sensing Nanostructures

This paper discusses sensor development based on metal oxide nanostructures and microsystems technology. While nanostructures such as nanowires show significant potential as enabling materials for chemical sensors, a number of significant technical challenges remain. This paper discusses development to address each of these technical barriers: 1) Improved contact and integration of the nanostructured materials with microsystems in a sensor structure; 2) Control of nanostructure crystallinity to allow control of the detection mechanism; and 3) Widening the range of gases that can be detected by fabricating multiple nanostructured materials. A sensor structure composed of three nanostructured oxides aligned on a single microsensor has been fabricated and tested. Results of this testing are discussed and future development approaches are suggested. It is concluded that while this work lays the foundation for further development, these are the beginning steps towards realization of repeatable, controlled sensor systems using oxide based nanostructures.

Hunter, G. W.↗

Design of Fiber Optic Sensors for Measuring Hydrodynamic Parameters

The science of optical hydrodynamics involves relating the optical properties to the fluid dynamic properties of a hydrodynamic system. Fiber-optic sensors are being designed for measuring the hydrodynamic parameters of various systems. As a flowing fluid makes an encounter with a flat surface, it forms a boundary layer near this surface. The region between the boundary layer and the flat plate contains information about parameters such as viscosity, compressibility, pressure, density, and velocity. An analytical model has been developed for examining the hydrodynamic parameters near the surface of a fiber-optic sensor. An analysis of the conservation of momentum, the continuity equation and the Navier-Stokes equation for compressible flow were used to develop expressions for the velocity and the density as a function of the distance along the flow and above the surface. When examining the flow near the surface, these expressions are used to estimate the sensitivity required to perform direct optical measurements and to derive the shear force for indirect optical measurements. The derivation of this result permits the incorporation of better design parameters for other fiber-based sensors. Future work includes analyzing the optical parametric designs of fiber-optic sensors, modeling sensors to utilize the parameters for hydrodynamics and applying different mixtures of hydrodynamic flow. Finally, the fabrication of fiber-optic sensors for hydrodynamic flow applications of the type described in this presentation could enhance aerospace, submarine, and medical technology.

Lyons, Donald R.↗

High-Temperature Gas Sensor Array (Electronic Nose) Demonstrated

The ability to measure emissions from aeronautic engines and in commercial applications such as automotive emission control and chemical process monitoring is a necessary first step if one is going to actively control those emissions. One single sensor will not give all the information necessary to determine the chemical composition of a high-temperature, harsh environment. Rather, an array of gas sensor arrays--in effect, a high-temperature electronic "nose"--is necessary to characterize the chemical constituents of a diverse, high-temperature environment, such as an emissions stream. The signals produced by this nose could be analyzed to determine the constituents of the emission stream. Although commercial electronic noses for near-room temperature applications exist, they often depend significantly on lower temperature materials or only one sensor type. A separate development effort necessary for a high-temperature electronic nose is being undertaken by the NASA Glenn Research Center, Case Western Reserve University, Ohio State University, and Makel Engineering, Inc. The sensors are specially designed for hightemperature environments. A first-generation high-temperature electronic nose has been demonstrated on a modified automotive engine. This nose sensor array was composed of sensors designed for hightemperature environments fabricated using microelectromechanical-systems- (MEMS-) based technology. The array included a tin-oxide-based sensor doped for nitrogen oxide (NOx) sensitivity, a SiC-based hydrocarbon (CxHy) sensor, and an oxygen sensor (O2). These sensors operate on different principles--resistor, diode, and electrochemical cell, respectively--and each sensor has very different responses to the individual gases in the environment. A picture showing the sensor head for the array is shown in the photograph on the left and the sensors installed in the engine are shown in the photograph on the right. Electronics are interfaced with the sensors for temperature control and signal conditioning, and packaging designed for high temperatures is necessary for the array to survive the engine environment.

Hunter, Gary W.↗

Foam Sensor Structures Would be Self-Deployable and Survive Hard Landings

A document proposes systems of sensors encased in cold hibernated elastic memory (CHEM) structures for exploring remote planets. Lightweight structures that can be compressed for storage and later expanded, then rigidified for use are made from foams of shape-memory polymers (SMPs). According to the instant proposal, a CHEM sensor structure would be fabricated at full size from SMP foam at a temperature below its glass-transition temperature (Tg). It would then be heated above Tg and compacted to a small volume, then cooled below Tg and kept below Tg during launch, flight, and landing. At landing, the inelastic yielding of the rigid compacted foam would absorb impact energy, thereby enabling the structure to survive the landing. The structure would then be solar heated above Tg, causing it to revert to its original size and shape. Finally, the structure would be rigidified by cooling it below Tg by the cold planetary or space environment. Besides surviving hard landing, this sensor system will provide a soft, stick-at-the-impact-site landing to access scientifically and commercially interesting sites, including difficult and hard-to-reach areas.

Sokolowski, Witold↗

Carbon Nanotube Gas Sensor Using Neural Networks

The need to identify the presence and quantify the concentrations of gases and vapors is ubiquitous in NASA missions and societal applications. Sensors for air quality monitoring in crew cabins and ISS have been actively under development (Ref. 1). In particular, measuring the concentration of CO2 and NH3 is important because high concentrations of these gases pose a risk to ISS crew health. Detection of fuel and oxidant leaks in crew vehicles is critical for ensuring mission safety. Accurate gas and vapor concentrations can be measured, but this typically requires bulky and expensive instrumentation. Recently, inexpensive sensors with low power demands have been fabricated for use on the International Space Station (ISS). Carbon Nanotube (CNT) based chemical sensors are one type of these sensors. CNT sensors meet the requirements for low cost and ease of fabrication for deployment on the ISS. However, converting the measured signal from the sensors to human readable indicators of atmospheric air quality and safety is challenging. This is because it is difficult to develop an analytical model that maps the CNT sensor output signal to gas concentration. Training a neural network on CNT sensor data to predict gas concentration is more effective than developing an analytic approach to calculate the concentration from the same data set. With this in mind a neural network was created to tackle this challenge of converting the measured signal into CO2 and NH3 concentration values.

Norman, Thaddeus J.↗

A Microseismometer for Terrestrial and Extraterrestrial Applications

The scientific and technical requirements of extraterrestrial seismology place severe demands on instrumentation. Performance in terms of sensitivity, stability, and frequency band must match that of the best terrestrial instruments, at a fraction of the size, mass, and power. In addition, this performance must be realized without operator intervention in harsh temperature, shock, and radiation environments. These constraints have forced us to examine some fundamental limits of accelerometer design in order to produce a small, rugged, sensitive seismometer. Silicon micromachined sensor technology offers techniques for the fabrication of monolithic, robust, compact, low-power and -mass accelerometers. However, currently available sensors offer inadequate sensitivity and bandwidth. Our implementation of an advanced silicon micro machined seismometer is based on principles developed at JPL for high-sensitivity position sensor technology. The use of silicon micro machining technology with these new principles should enable the fabrication of a 10(exp -11) g sensitivity seismometer with a bandwidth of at least 0.01 to 20 Hz. The low Q properties of pure single-crystal silicon are essential in order to minimize the Brownian thermal noise limitations generally characteristic of seismometers with small proof masses. A seismometer consists of a spring-supported proof mass and a transducer for measuring its motion. For long period motion a position sensor is generally used, for which the displacement is proportional to the ground acceleration. The mechanical sensitivity can be increased either by increasing the proof mass or decreasing the spring stiffness, neither of which is desirable for planetary applications. Our approach has been to use an ultra sensitive capacitive position sensor with a sensitivity of better than 10(exp -13) m/Hz(exp 1/2). This allows the use of a stiffer suspension and a smaller proof mass. We have built several prototypes using these principles, and tests show that these devices can exhibit performance comparable to state-of-the-art instruments.

Banerdt, W.↗

Optical fiber sensor for temperature measurement from 600 to 1900 C in gas turbine engines

A temperature sensor system has been fabricated specifically for the harsh environment encountered in temperature measurement on gas turbine engines. Four components comprised the system: a thermally emissive source, a high temperature lightguide, a flexible optical cable and an electro-optic signal processor. The emissive source was located inside a sapphire rod so that the sapphire serves as both a lightguide and as a protective shroud. As the probe was heated, the thermal radiation from the emissive source increased with increasing temperature. The flexible optical cable was constructed with 200 micron core fiber and ruggedized for turbine engine applications. The electro-optic signal processor used the ratio of intensity in two wavelength intervals to determine a digital value of the temperature. The probe tip was operated above 1900 C in a low velocity propane flame and above 1500 C at Mach .37. Probe housings, optical cables, and signal processors were constructed and environmentally tested for the temperature and vibration experienced by turbine engine sensors. This technology was used to build an optical exhaust gas sensor for a General Electric Aircraft Engines F404 turbine. The four optical probes and optical cable were a functional replacement for four thermocouple probes. The system was ground tested for 50 hours with an excess of 1000 thermal cycles. This optical temperature sensor system measured gas temperature up to the operational limit of the turbine engine.

Tregay, G. W.↗

Hybrid UV Imager Containing Face-Up AlGaN/GaN Photodiodes

A proposed hybrid ultraviolet (UV) image sensor would comprise a planar membrane array of face-up AlGaN/GaN photodiodes integrated with a complementary metal oxide/semiconductor (CMOS) readout-circuit chip. Each pixel in the hybrid image sensor would contain a UV photodiode on the AlGaN/GaN membrane, metal oxide/semiconductor field-effect transistor (MOSFET) readout circuitry on the CMOS chip underneath the photodiode, and a metal via connection between the photodiode and the readout circuitry (see figure). The proposed sensor design would offer all the advantages of comparable prior CMOS active-pixel sensors and AlGaN UV detectors while overcoming some of the limitations of prior (AlGaN/sapphire)/CMOS hybrid image sensors that have been designed and fabricated according to the methodology of flip-chip integration. AlGaN is a nearly ideal UV-detector material because its bandgap is wide and adjustable and it offers the potential to attain extremely low dark current. Integration of AlGaN with CMOS is necessary because at present there are no practical means of realizing readout circuitry in the AlGaN/GaN material system, whereas the means of realizing readout circuitry in CMOS are well established. In one variant of the flip-chip approach to integration, an AlGaN chip on a sapphire substrate is inverted (flipped) and then bump-bonded to a CMOS readout circuit chip; this variant results in poor quantum efficiency. In another variant of the flip-chip approach, an AlGaN chip on a crystalline AlN substrate would be bonded to a CMOS readout circuit chip; this variant is expected to result in narrow spectral response, which would be undesirable in many applications. Two other major disadvantages of flip-chip integration are large pixel size (a consequence of the need to devote sufficient area to each bump bond) and severe restriction on the photodetector structure. The membrane array of AlGaN/GaN photodiodes and the CMOS readout circuit for the proposed image sensor would be fabricated separately.

Zheng, Xinyu↗

Design and Fabrication of High-Efficiency CMOS/CCD Imagers

An architecture for back-illuminated complementary metal oxide/semiconductor (CMOS) and charge-coupled-device (CCD) ultraviolet/visible/near infrared- light image sensors, and a method of fabrication to implement the architecture, are undergoing development. The architecture and method are expected to enable realization of the full potential of back-illuminated CMOS/CCD imagers to perform with high efficiency, high sensitivity, excellent angular response, and in-pixel signal processing. The architecture and method are compatible with next-generation CMOS dielectric-forming and metallization techniques, and the process flow of the method is compatible with process flows typical of the manufacture of very-large-scale integrated (VLSI) circuits. The architecture and method overcome all obstacles that have hitherto prevented high-yield, low-cost fabrication of back-illuminated CMOS/CCD imagers by use of standard VLSI fabrication tools and techniques. It is not possible to discuss the obstacles in detail within the space available for this article. Briefly, the obstacles are posed by the problems of generating light-absorbing layers having desired uniform and accurate thicknesses, passivation of surfaces, forming structures for efficient collection of charge carriers, and wafer-scale thinning (in contradistinction to diescale thinning). A basic element of the present architecture and method - the element that, more than any other, makes it possible to overcome the obstacles - is the use of an alternative starting material: Instead of starting with a conventional bulk-CMOS wafer that consists of a p-doped epitaxial silicon layer grown on a heavily-p-doped silicon substrate, one starts with a special silicon-on-insulator (SOI) wafer that consists of a thermal oxide buried between a lightly p- or n-doped, thick silicon layer and a device silicon layer of appropriate thickness and doping. The thick silicon layer is used as a handle: that is, as a mechanical support for the device silicon layer during micro-fabrication.

Pain, Bedabrata↗