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At least 235 records · Page 13

Conductance of Carbon Nanotubes

The recent report of quantized conductance in a 4 m long multiwalled nanotube (MWNT) raises the exciting possibility of ballistic transport at room temperature over relatively long distances. We argue that this is made possible by the special symmetry of the eigenstates of the lowest propagating modes in metallic nanotubes which suppresses backscattering. This unusual effect is absent for the higher propagating modes so that transport is not ballistic once the bias exceeds the cut-off energy for the higher modes, which is estimated to be approximately 75 meV for nanotubes of diameter approximately 15 nm. Also, we show that the symmetry of the eigenstates can significantly affect their coupling to the reservoir and hence the contact resistance. A simple model is presented that can be used to understand the observed conductance-voltage characteristics.

Datta, Supriyo↗

Efficient Design in a DC to DC Converter Unit

Space Flight hardware requires high power conversion efficiencies due to limited power availability and weight penalties of cooling systems. The International Space Station (ISS) Electric Power System (EPS) DC-DC Converter Unit (DDCU) power converter is no exception. This paper explores the design methods and tradeoffs that were utilized to accomplish high efficiency in the DDCU. An isolating DC to DC converter was selected for the ISS power system because of requirements for separate primary and secondary grounds and for a well-regulated secondary output voltage derived from a widely varying input voltage. A flyback-current-fed push-pull topology or improved Weinberg circuit was chosen for this converter because of its potential for high efficiency and reliability. To enhance efficiency, a non-dissipative snubber circuit for the very-low-Rds-on Field Effect Transistors (FETs) was utilized, redistributing the energy that could be wasted during the switching cycle of the power FETs. A unique, low-impedance connection system was utilized to improve contact resistance over a bolted connection. For improved consistency in performance and to lower internal wiring inductance and losses a planar bus system is employed. All of these choices contributed to the design of a 6.25 KW regulated dc to dc converter that is 95 percent efficient. The methodology used in the design of this DC to DC Converter Unit may be directly applicable to other systems that require a conservative approach to efficient power conversion and distribution.

Bruemmer, Joel E.↗

Thermal Conductivity of Carbon Nanotube Composite Films

State-of-the-art ICs for microprocessors routinely dissipate power densities on the order of 50 W/sq cm. This large power is due to the localized heating of ICs operating at high frequencies, and must be managed for future high-frequency microelectronic applications. Our approach involves finding new and efficient thermally conductive materials. Exploiting carbon nanotube (CNT) films and composites for their superior axial thermal conductance properties has the potential for such an application requiring efficient heat transfer. In this work, we present thermal contact resistance measurement results for CNT and CNT-Cu composite films. It is shown that Cu-filled CNT arrays enhance thermal conductance when compared to as-grown CNT arrays. Furthermore, the CNT-Cu composite material provides a mechanically robust alternative to current IC packaging technology.

Ngo, Quoc↗

Multimodal neuroelectric interface development

We are developing electromyographic and electroencephalographic methods, which draw control signals for human-computer interfaces from the human nervous system. We have made progress in four areas: 1) real-time pattern recognition algorithms for decoding sequences of forearm muscle activity associated with control gestures; 2) signal-processing strategies for computer interfaces using electroencephalogram (EEG) signals; 3) a flexible computation framework for neuroelectric interface research; and d) noncontact sensors, which measure electromyogram or EEG signals without resistive contact to the body.

Evaluation Studies↗

Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs

Degradation of wire bonds (WBs) is one of the major factors limiting reliability of plastic encapsulated microcircuits (PEMs) at high temperatures. Use of PEMs in military and aerospace applications requires extended and thorough evaluation of encapsulating materials and reliability of packages in harsh environments. However, the effect of environmental conditions on characteristics of molding compounds (MCs) and reliability of wire bonds has not been studied sufficiently to date. In this work, two types of PEMs in QFP-style packages have been stored in different environments at temperatures from 130 C to 225 C for up to 4,500 hours in some cases. To assess the effect of oxygen, the parts were aged at 198 C in air and vacuum chambers. The effect of humidity was evaluated during long-term highly accelerated temperature and humidity stress testing (HAST) at temperatures of 130 C and 150 C. Thermo-mechanical and thermo-gravimetrical analyses were used to evaluate the effect of environment on characteristics of molding compound used. Measurements of contact resistances of wire bonds and their mechanical strength were employed to monitor degradation of wire bonds throughout the testing. Correlation between degradation of MC and WB failures has been analyzed. The effect of environmental conditions on accelerating factors of WB failures has been assessed, and the mechanism of wire bond degradation due to the presence of moisture and oxygen is discussed.

Teverosky, Alexander↗

Directly Deposited Current Collecting Grids for AMTEC Electrodes

Current collection in porous thin film electrodes on solid electrolytes has been improved by using thick film grids to decrease sheet and contact resistance in RhW and PtW electrodes. The grids are directly deposited on the solid electrolyte, either by sputter or photodepostion, and the electrode is deposited over the grid. Comparison of the performance of electrodes having such underlying grids with that of electodes without such grids has shown performance, as measured by current or power produced, to be improved by 10-30% in electrodes with grids.

Ryan, M. A.↗

Reliability Evaluation of Au/Al Wire Bonds in Commercial Microcircuits

The slide presentation provides an overview of research related to problems in quality evaluation in the mechanisms of wire bond degradation. Case studies presented examine the evaluation of reliability of hermetic and plastic microcircuits with suspected poor wire bonding. The authors conclude that in the cases when destructive physical analysis (DPA) or design evaluation indicate possible problems with wire bonding, a wire bond qualification testing may be required. This test should include high temperature storage (175 degrees C to 200 decrees C) of the parts with periodic measurements of contact resistances followed by internal examination and wire pull or ball sear testing.

Teverovsky, Alexander↗

Indium Hybridization of Large Format TES Bolometer Arrays to Readout Multiplexers for Far-Infrared Astronomy

The advance of new detector technologies combined with enhanced fabrication methods has resulted in an increase in development of large format arrays. The next generation of scientific instruments will utilize detectors containing hundreds to thousands of elements providing a more efficient means to conduct large area sky surveys. Some notable detectors include a 32x32 x-ray microcalorimeter for Constellation-X, an infrared bolometer called SAFIRE to fly on the airborne observatory SOFIA, and the sub-millimeter bolometer SCUBA-2 to be deployed at the JCMT which will use more than 10,000 elements for two colors, each color using four 32x40 arrays. Of these detectors, SCUBA-2 is farthest along in development and uses indium hybridization to multiplexers for readout of the large number of elements, a technology that will be required to enable the next generation of large format arrays. Our current efforts in working toward large format arrays have produced GISMO, the Goddard IRAM Superconducting 2-Millimeter observer. GISMO is a far infrared instrument to be field tested later this year at the IRAM 30 meter telescope in Spain. GISMO utilizes transition edge sensor (TES) technology in an 8x16 filled array format that allows for typical fan-out wiring and wire-bonding to four 1x32 NIST multiplexers. GISMO'S electrical wiring is routed along the tops of 30 micron walls which also serve as the mechanical framework for the array. This architecture works well for the 128 element array, but is approaching the limit for routing the necessary wires along the surface while maintaining a high fill factor. Larger format arrays will benefit greatly from making electrical connections through the wafer to the backside, where they can be hybridized to a read-out substrate tailored to handling the wiring scheme. The next generation array we are developing is a 32x40 element array on a pitch of 1135 microns that conforms to the NIST multiplexer, already developed for the SCUBA-2 instrument This architecture will utilize electrical connections that route from the TES to the support frame and through the wafer. The detector chip will then be hybridized to the NIST multiplexer via indium bump bonding. In our development scheme we are using substrates that allow for diagnostic testing of electrical continuity across the entire array and we are testing our process to minimize or eliminate any contact resistance at metal interfaces. Our goal is hybridizing a fully functional 32x40 array of TES bolometers to a NIST multiplexer. The following work presents our current progress toward enabling this technology.

Miller, Timothy M.↗

Evaluation of Contact Separation Force Testing as a Screening Methodology for Electrical Socket Contacts

During system level testing intermittent and permanent open circuit failures of mated, crimp removable, electrical contact pairs were experienced. The root cause of the failures was determined to be low (but not zero) contact forces applied by the socket contact tines against the engaging pin. The low contact force reduces the effectiveness of the wiping action of the socket tines against the pin. The observed failure mode may be produced when insufficient wiping during mate, demate and small relative movement in use allows for the accumulation of debris or insulating films that electrically separate the contact pair. The investigation identified at least three manufacturing process control problems associated with the socket contacts that enabled shipment of contacts susceptible to developing low contact forces: (1) Improper heat treatment of the socket tines resulting in plastic rather than elastic behavior; (2) Overly thinned socket tines at their base resulting in reduced pin retention forces; (3) Insufficient screening tests to identify parts susceptible to the aforementioned failure mechanisms. The results from an extensive screening program of socket contacts utilizing the industry standard contact separation force test procedures are described herein. The investigation shows this method to be capable of identifying initially weak sockets. However, sockets whose contact retention forces may degrade during use may not be screened out by pin retention testing alone. Further investigations are required to correlate low contact retention forces with increased electrical contact resistance in the presence of insulating films that may accumulate in the use environment.

Christopher Green↗

Thermal Analysis and Testing of Candidate Materials for PAIDAE Inflatable Aeroshell

The Program to Advance Inflatable-Decelerators for Atmospheric Entry (PAIDAE) is a NASA project tasked with developing and evaluating viable inflatable-decelerator aeroshell geometries and materials. Thermal analysis of material layups supporting an inflatable aeroshell was completed in order to identify expected material response, failure times, and to establish an experimental test matrix to keep barrier layer materials from reaching critical temperature limits during thermal soak. Material layups were then tested in the 8- foot High Temperature Tunnel (8'HTT), where they were subjected to hypersonic aerothermal heating conditions, similar to those expected for a Mars entry. This paper presents a broad overview of the thermal analysis supporting multiple materials, and layup configurations tested in the 8'HTT at flight conditions similar to those that would be experienced during Mars entry trajectories. Direct comparison of TPS samples tested in the 8'HTT verify that the thermal model accurately predicted temperature profiles when there are up to four materials in the test layup. As the number of material layers in each test layup increase (greater than 4), the accuracy of the prediction decreases significantly. The inaccuracy of the model predictions for layups with more than four material layers is believed to be a result of the contact resistance values used throughout the model being inaccurate. In addition, the harsh environment of the 8'HTT, including hot gas penetrating through the material layers, could also be a contributing factor.

DelCorso, Joseph A.↗

New Technology for Microfabrication and Testing of a Thermoelectric Device for Generating Mobile Electrical Power

We report the results of fabrication and testing of a thermoelectric power generation module. The module was fabricated using a new "flip-chip" module assembly technique that is scalable and modular. This technique results in a low value of contact resistivity ( < or = 10(exp 5) Ohms-sq cm). It can be used to leverage new advances in thin-film and nanostructured materials for the fabrication of new miniature thermoelectric devices. It may also enable monolithic integration of large devices or tandem arrays of devices on flexible or curved surfaces. Under mild testing, a power of 22 mW/sq cm was obtained from small (<100 K) temperature differences. At higher, more realistic temperature differences, approx.500 K, where the efficiency of these materials greatly improves, this power density would scale to between 0.5 and 1 Watt/cm2. These results highlight the excellent potential for the generation and scavenging of electrical power of practical and usable magnitude for remote applications using thermoelectric power generation technologies.

Prasad, Narashimha S.↗

Special Component Designs for Differential-Amplifier MMICs

Special designs of two types of electronic components transistors and transmission lines have been conceived to optimize the performances of these components as parts of waveguide-embedded differential-amplifier monolithic microwave integrated circuits (MMICs) of the type described in the immediately preceding article. These designs address the following two issues, the combination of which is unique to these particular MMICs: Each MMIC includes a differential double-strip transmission line that typically has an impedance between 60 and 100 W. However, for purposes of matching of impedances, transmission lines having lower impedances are also needed. The transistors in each MMIC are, more specifically, one or more pair(s) of InP-based high-electron-mobility transistors (HEMTs). Heretofore, it has been common practice to fabricate each such pair as a single device configured in the side-to-side electrode sequence source/gate/drain/gate/source. This configuration enables low-inductance source grounding from the sides of the device. However, this configuration is not suitable for differential operation, in which it is necessary to drive the gates differentially and to feed the output from the drain electrodes differentially. The special transmission-line design provides for three conductors, instead of two, in places where lower impedance is needed. The third conductor is a metal strip placed underneath the differential double-strip transmission line. The third conductor increases the capacitance per unit length of the transmission line by such an amount as to reduce the impedance to between 5 and 15 W. In the special HEMT-pair design, the side-to-side electrode sequence is changed to drain/gate/source/gate/ drain. In addition, the size of the source is reduced significantly, relative to corresponding sizes in prior designs. This reduction is justified by the fact that, by virtue of the differential configuration, the device has an internal virtual ground, and therefore there is no need for a low-resistance contact between the source and the radio-frequency circuitry. The source contact is needed only for DC biasing. These designs were implemented in a single-stage-amplifier MMIC. In a test at a frequency of 305 GHz, the amplifier embedded in a waveguide exhibited a gain of 0 dB; after correcting for the loss in the waveguide, the amplifier was found to afford a gain of 0.9 dB. In a test at 220 GHz, the overall gain of the amplifier- and-waveguide assembly was found to be 3.5 dB.

Kangaslahti, Pekka↗

Design for On-Sun Evaluation of Evaporator Receivers

A heat pipe designed for operation as a solar power receiver should be optimized to accept the solar energy flux and transfer this heat into a reactor. Optical properties of the surface, thermal conductance of the receiver wall, contact resistance of the heat pipe wick, and other heat pipe wick properties ultimately define the maximum amount of power that can be extracted from the concentrated sunlight impinging on the evaporator surface. Modeling of solar power receivers utilizing optical and physical properties provides guidance to their design. On-sun testing is another important means of gathering information on performance. A test rig is being designed and built to conduct on-sun testing. The test rig is incorporating a composite strip mirror concentrator developed as part of a Small Business Innovative Research effort and delivered to NASA Glenn Research Center. In the strip concentrator numerous, lightweight composite parabolic strips of simple curvature were combined to form an array 1.5 m x 1.5 m in size. The line focus of each strip is superimposed in a central area simulating a point of focus. A test stand is currently being developed to hold the parabolic strip concentrator, track the sun, and turn the beam downward towards the ground. The hardware is intended to be sufficiently versatile to accommodate on-sun testing of several receiver concepts, including those incorporating heat pipe evaporators. Characterization devices are also being developed to evaluate the effectiveness of the solar concentrator, including a receiver designed to conduct calorimetry. This paper describes the design and the characterization devices of the on-sun test rig, and the prospect of coupling the concentrated sunlight to a heat pipe solar power receiver developed as part of another Small Business Innovative Research effort.

Jaworske, Donald A.↗

Ascent Heating Thermal Analysis on Spacecraft Adaptor Fairings

When the Crew Exploration Vehicle (CEV) is launched, the spacecraft adaptor (SA) fairings that cover the CEV service module (SM) are exposed to aero heating. Thermal analysis is performed to compute the fairing temperatures and to investigate whether the temperatures are within the material limits for nominal ascent aeroheating case. The ascent heating is analyzed by using computational fluid dynamics (CFD) and engineering codes at Marshall Space Flight Center. The aeroheating environment data used for this work is known as Thermal Environment 3 (TE3) heating data. One of the major concerns is with the SA fairings covering the CEV SM and the SM/crew launch vehicle (CLV) flange interface. The TE3 heating rate is a function of time, wall temperature, and the spatial locations. The implementation of the TE3 heating rate as boundary conditions in the thermal analysis becomes challenging. The ascent heating thermal analysis on SA fairings and SM/CLV flange interface are performed using two commercial software packages: Cullimore & Ring (C&R) Thermal Desktop (TD) 5.1 and MSC Patran 2007r1 b. TD is the pre-and post-processor for SINDA, which is a finite-difference-based solver. In TD, the geometry is built and meshed, the boundary conditions are defined, and then SINDA is used to compute temperatures. MSC Pthermal is a finite-element- based thermal solver. MSC Patran is the pre- and post-processor for Pthermal. Regarding the boundary conditions, the convection, contact resistance, and heat load can be imposed in different ways in both programs. These two software packages are used to build the thermal model for the same analysis to validate each other and show the differences in the modeling details.

Wang, Xiao Yen↗

Method to Improve Indium Bump Bonding via Indium Oxide Removal Using a Multi-Step Plasma Process

A process for removing indium oxide from indium bumps in a flip-chip structure to reduce contact resistance, by a multi-step plasma treatment. A first plasma treatment of the indium bumps with an argon, methane and hydrogen plasma reduces indium oxide, and a second plasma treatment with an argon and hydrogen plasma removes residual organics. The multi-step plasma process for removing indium oxide from the indium bumps is more effective in reducing the oxide, and yet does not require the use of halogens, does not change the bump morphology, does not attack the bond pad material or under-bump metallization layers, and creates no new mechanisms for open circuits.

Greer, H. Frank↗

Can the Lateral Proximity Effect Be Used to Create the Superconducting Transition of a Micron-Sized TES?

Recent measurements of micron-sized Mo/Au bilayer Transition Edge Sensors (TESs) have demonstrated that the TES can behave like an S-S'-S weak link due to the lateral proximity effect from superconducting leads. In this regime the Tc is a function of bias current, and the effective Tc shifts from the bilayer Tc towards the lead Tc. We explore the idea that a micron-sized S-N-S weak link could provide a new method to engineer the TES Tc. This method would be particularly useful when small size requirements for a bilayer TES (such as for a hot-electron microbolometer) lead to undesirable shifts in the bilayer Te. We present measurements of a variety of micron-sized normal Au 'TES' devices with Nb leads. We find no evidence of a superconducting transition in the Au film of these devices, in dramatic contrast to the strong lateral proximity effect seen in micron-sized Mo/Au bilayer devices. The absence of a transition in these devices is also in disagreement with theoretical predictions for S-N-S weak links. We hypothesize that a finite contact resistance between the Nb and Au may be weakening the effect. We conclude that the use of the lateral proximity effect to create a superconducting transition will be difficult given current fabrication procedures.

Barrentine, E. M.↗

Efficient Thermally Conductive Strap Design for Cryogenic Propellant Tank Supports and Plumbing

After evalu1ating NASA space architecture goals, the Office of Chief Technologist identified the need for developing enabling technology for long term loiters in space with cryogenic fluids. One such technology is structural heat interception. In this prototype, heat interception at the tank support strut was accomplished using a thermally conductive link to the broad area cooled shield. The design methodology for both locating the heat intercept and predicting the reduction in boil-off heat leak is discussed in detail. Results from the chosen design are presented. It was found that contact resistance resulting from different mechanical attachment techniques played a significant role in the form and functionality of a successful design.

Elchert, J. P.↗

Efficient Thermally Conductive Strap Design for Cryogenic Propellant Tank Supports and Plumbing

After evaluating NASA space architecture goals, the Office of Chief Technologist identified the need for developing enabling technology for long term loiters in space with cryogenic fluids. One such technology is structural heat interception. In this prototype, heat interception at the tank support strut was accomplished using a thermally conductive link to the broad area cooled shield. The design methodology for both locating the heat intercept and predicting the reduction in boil-off heat leak is discussed in detail. Results from the chosen design are presented. It was found that contact resistance resulting from different mechanical attachment techniques played a significant role in the form and functionality of a successful design.

Elchert, J. P.↗