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At least 217 records · Page 12

Topography and transport properties of oligo(phenylene ethynylene) molecular wires studied by scanning tunneling microscopy

Conjugated phenylene(ethynylene) molecular wires are of interest as potential candidates for molecular electronic devices. Scanning tunneling microscopic study of the topography and current-voltage (I-V) characteristics of self-assembled monolayers of two types of molecular wires are presented here. The study shows that the topography and I-Vs, for small scan voltages, of the two wires are quite similar and that the electronic and structural changes introduced by the substitution of an electronegative N atom in the central phenyl ring of these wires does not significantly alter the self-assembly or the transport properties.

Polymers/chemistry↗

Device and Method for Connections Made Between a Crimp Connector and Wire

An ultrasonic device and method obtains desirable crimp connections between a crimp connector and a wire, or bundle of wires, by assessing the desirability of connections made in a wire-to-wire connection and in other situations where two materials with good acoustic propagation characteristics are joined together via deformation. An embodiment of the device as a crimping tool comprises a compressing means, pulse-generating circuitry. at least one ultrasonic transmitting transducer, at least one ultrasonic receiving transducer, receiving circuitry, and a display. The user may return to a previously crimped connection and assess the desirability of the connection by compressing the device about the connection, sending an acoustic signal through the crimp, andco111paring the received signal to a signal obtained from known desirable connections.

Yost, William T.↗

Evaluating the Gradient of the Thin Wire Kernel

Recently, a formulation for evaluating the thin wire kernel was developed that employed a change of variable to smooth the kernel integrand, canceling the singularity in the integrand. Hence, the typical expansion of the wire kernel in a series for use in the potential integrals is avoided. The new expression for the kernel is exact and may be used directly to determine the gradient of the wire kernel, which consists of components that are parallel and radial to the wire axis.

Wilton, Donald R.↗

A Method For The Verification Of Wire Crimp Compression Using Ultrasonic Inspection

The development of a new ultrasonic measurement technique to assess quantitatively wire crimp terminations is discussed. The amplitude change of a compressional ultrasonic wave propagating at right angles to the wire axis and through the junction of a crimp termination is shown to correlate with the results of a destructive pull test, which is a standard for assessing crimp wire junction quality. To demonstrate the technique, the case of incomplete compression of crimped connections is ultrasonically tested, and the results are correlated with pull tests. Results show that the nondestructive ultrasonic measurement technique consistently predicts good crimps when the ultrasonic transmission is above a certain threshold amplitude level. A quantitative measure of the quality of the crimped connection based on the ultrasonic energy transmitted is shown to respond accurately to crimp quality. A wave propagation model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process. This model is in agreement within 6% of the ultrasonic measurements. A prototype instrument for applying this technique while wire crimps are installed is also presented. The instrument is based on a two-jaw type crimp tool suitable for butt-splice type connections. A comparison of the results of two different instruments is presented and shows reproducibility between instruments within a 95% confidence bound.

Cramer, K. E.↗

Thermal Control Method for High-Current Wire Bundles by Injecting a Thermally Conductive Filler

A procedure was developed to inject thermal filler material (a paste-like substance) inside the power wire bundle coming from solar arrays. This substance fills in voids between wires, which enhances the heat path and reduces wire temperature. This leads to a reduced amount of heat generated. This technique is especially helpful for current and future generation high-power spacecraft (1 kW or more), because the heat generated by the power wires is significant enough to cause unacceptable overheating to critical components that are in close contact with the bundle.

Rodriguez-Ruiz, Juan↗

Process for Nondestructive Evaluation of the Quality of a Crimped Wire Connector

A process and apparatus for collecting data for nondestructive evaluation of the quality of a crimped wire connector are provided. The process involves providing a crimping tool having an anvil and opposing jaw for crimping a terminal onto a stranded wire, moving the jaw relative to the anvil to close the distance between the jaw and the anvil and thereby compress the terminal against the wire, while transmitting ultrasonic waves that are propagated through the terminal-wire combination and received at a receiving ultrasonic transducer as the jaw is moved relative to the anvil, and detecting and recording the position of the jaw relative to the anvil as a function of time and detecting and recording the amplitude of the ultrasonic wave that is received at the receiving ultrasonic transducer as a function of time as the jaw is moved relative to the anvil.

Yost, William T.↗

Development of a High Performance, Low Profile Translation Table with Wire Feedthrough for a Deep Space CubeSat

NEAScout, a 6U cubesat and secondary payload on NASA's EM-1, will use an 85 sq m solar sail to travel to a near-earth asteroid at about 1 Astronomical Unit (about 1.5 x 10(exp 8) km) for observation and reconnaissance1. A combination of reaction wheels, reaction control system, and a slow rotisserie roll about the solar sail's normal axis were expected to handle attitude control and adjust for imperfections in the deployed sail during the 2.5-year mission. As the design for NEAScout matured, one of the critical design parameters, the offset in the center of mass and center of pressure (CP/CM offset), proved to be sub-optimal. After significant mission and control analysis, the CP/CM offset was accommodated by the addition of a new subsystem to NEAScout. This system, called the Active Mass Translator (AMT), would reside near the geometric center of NEAScout and adjust the CM by moving one portion of the flight system relative to the other. The AMT was given limited design space - 17 mm of the vehicle's assembly height-and was required to generate +/-8 cm by +/-2 cm translation to sub-millimeter accuracy. Furthermore, the design must accommodate a large wire bundle of small gage, single strand wire and coax cables fed through the center of the mechanism. The bend radius, bend resistance, and the exposure to deep space environment complicates the AMT design and operation and necessitated a unique design to mitigate risks of wire bundle damage, binding, and cold-welding during operation. This paper will outline the design constraints for the AMT, discuss the methods and reasoning for design, and identify the lessons learned through the designing, breadboarding and testing for the low-profile translation stages with wire feedthrough capability.

Few, Alex↗

Development of a High-Performance, Low-Profile Translation Table with Wire Feedthrough for a Deep Space CubeSat

NEAScout, a 6U cubesat and secondary payload on NASA's EM-1, will use an 85 sq m solar sail to travel to a near-earth asteroid at about 1 Astronomical Unit (about 1.5 x 10(exp 8) km) for observation and reconnaissance1. A combination of reaction wheels, reaction control system, and a slow rotisserie roll about the solar sail's normal axis were expected to handle attitude control and adjust for imperfections in the deployed sail during the 2.5-year mission. As the design for NEAScout matured, one of the critical design parameters, the offset in the center of mass and center of pressure (CP/CM offset), proved to be sub-optimal. After significant mission and control analysis, the CP/CM offset was accommodated by the addition of a new subsystem to NEAScout. This system, called the Active Mass Translator (AMT), would reside near the geometric center of NEAScout and adjust the CM by moving one portion of the flight system relative to the other. The AMT was given limited design space - 17 mm of the vehicle's assembly height-and was required to generate +/-8 cm by +/-2 cm translation to sub-millimeter accuracy. Furthermore, the design must accommodate a large wire bundle of small gage, single strand wire and coax cables fed through the center of the mechanism. The bend radius, bend resistance, and the exposure to deep space environment complicates the AMT design and operation and necessitated a unique design to mitigate risks of wire bundle damage, binding, and cold-welding during operation. This paper will outline the design constraints for the AMT, discuss the methods and reasoning for design, and identify the lessons learned through the designing, breadboarding and testing for the low-profile translation stages with wire feedthrough capability.

Few, Alex↗

Integration of Multilevel Superconducting Buried Wiring Layers with Transition-Edge Sensor Detectors for Large Scale Arrays

Lynx, one of the four mission concepts under consideration for the next Astrophysics DecadalReview, will include a microcalorimeter array consisting of more than 100,000 pixels in a compact arrangement with absorber pitch as small as 25 microns. In order to realize the desired array scale, fine-pitch multi-level superconducting wiring with high yield, compatible with rapid expansion of our hydra absorber designs, is essential. We have demonstrated a method of integrating transition edge sensor (TES) microcalorimeters with suitable multilevel buried wiring, fabricated at MIT Lincoln Laboratory using advanced tools dedicated to superconducting circuit fabrication. The TES Mo/Au bilayer is deposited on a high-quality oxide surface created by chemical-mechanical polishing, allowing tight specifications on the TES superconducting transition and link conductivity to be achieved even though the process order has been inverted. The TESs contact the top-level niobium wiring through vias etched through silicon dioxide down to the topmost wiring layer. The article discusses the overall fabrication process, as wellas the behavior of sensors with different via designs, proximity structures, and lateral sizes. An initial iteration of the integrated fabrication process indicates that microcalorimeters fabricated in this way should meet mission specifications using a Mo/Au bilayer with a reasonable critical temperature below 100 mK.

Detector↗

Metallic Powder Core Tubular Wire (PCTW) Development for Additive Manufacturing

NASA Langley Research Center (LaRC) in Hampton, VA, and the Center for Welding, Joining, and Coating Research (CWJCR) in the Department of Metallurgical and Materials Engineering at the Colorado School of Mines (CSM) in Golden, CO, have collaborated for nearly fifteen years to develop metallic powder core tubular wire (PCTW) feedstock for additive manufacturing (AM) using electron beam deposition. The motivation for this development was to offset dealloying observed during deposition of titanium and aluminum alloy solid wire feedstock in the LaRC electron beam freeform fabrication (EBF3) system and to explore novel alloy compositions by tailoring the powder fill. EBF3 is a fusion-based AM process that is performed under vacuum and is consequently prone to vaporization loss of low vapor pressure alloying elements. Research spanning four graduate student research projects succeeded in developing the basic methodology to fabricate PCTW, the mass balance equations used to define the powder fill, microstructure control through particulate inoculation, and the feasibility of producing metal matrix composite materials. Metallic PCTW is comprised of a thin foil sheath wrapped around a powder blend. Fabrication of PCTW at CSM was accomplished using a tubular wire mill system to first bend a flat strip into a u-shaped cross section, deposit a powder fill, create a lap joint to seal the wire, and draw to final diameter. Powder management systems were developed to ensure uniform mixing of powder constituents and identify feed rates for optimum fill ratios. Processing parameters were successfully developed for titanium and aluminum alloy sheaths to account for material work hardening during drawing. Mass balance equations were developed to account for compositional contributions of the sheath and powder fill. PCTW composition can be adjusted through selection of the sheath or powder materials. PCTWs were successfully developed to offset Al loss in deposits of Ti-6-4 and Mg loss in Al 6061, resulting in deposits that were within the composition limits for each material. Ti-6-4 deposits were fabricated using PCTW comprised of commercially pure (CP) titanium sheath and a fill of pre-alloyed Ti-6-4 powder with additions of elemental Al and V powders. Additions of both elements were required to account for the CP Ti from the sheath, and Al was further enhanced to offset documented losses in EBF3 deposits. For Al 6061 deposits, composition was modulated through the choice of sheath material. The PCTW was made using an Al 5052 sheath to supplement Mg content and a fill composition of pre-alloyed 6061 powder with additions of Si and Cu.The slower solidification rate of the EBF3 process compared with laser powder bed fusion processes can lead to coarse-grained microstructures and mechanical property anisotropy. EBF3deposits of Ti-6-4 exhibited large epitaxially grown β grains, which result in degraded mechanical properties in the deposition direction. Microstructure refinement was achieved through a combination of electron beam modulation and the use of a PCTW designed for Ti-6-4 deposits and modified by the addition of powder made from Fe and B. Resulting deposits exhibited reductions in β grain size, α phase colony intercept length and lath width, and an increased volume fraction of β phase. The mechanism of microstructure refinement was related to precipitation of boride particles. Hardness testing confirmed that mechanical property anisotropy was reduced and an overall increase in hardness was achieved.Metal matrix composite (MMC) materials offer strength and stiffness benefits over unreinforced materials. Two methods were investigated using PCTW technology for producing Al 6061 basedMMC materials; the direct addition of SiC reinforcing particles and the in-situ generation of reinforcements through reaction synthesis of precursor powders. Al 6061 based MMCs reinforced with SiC exhibited particle clustering and formation of aluminum carbides during deposition. The application of a Ni coating to the SiC particles prior to incorporation into the powder fill eliminated aluminum carbide formation and aided particle distribution during deposition. Modulation of beam focus and power further reduced aluminum carbide formation and aided particle distribution. In reaction synthesis, precursor additions undergo an exothermic reaction during deposition to form new ceramic products, generally of finer scale than the initial precursor components. The product phases provide reinforcement in the MMC and act as nucleation sites during solidification, resulting in grain refinement, improved mechanical properties, and reduced susceptibility to solidification cracking. Higher tensile strength and stiffness were demonstrated in Al 6061 based MMCs with 2 vol% reinforcement. These combined research efforts demonstrate the potential of PCTW technology for customizing of alloy composition and achieving microstructure control. A manufacturing process for titanium- and aluminum-based PCTWs was developed based on iterative design, theoretical calculations, and empirical data. PCTW technology successfully mitigated Al loss from Ti-6-4 and Mg loss in Al 6061, resulted in grain refinement in Ti-6-4, and demonstrated fabrication of Al based MMCs

Marcia S Domack↗

(abstract) An All Sky Cirrus Confusion Noise Map for WIRE

The Wide Field Infrared Explorer (WIRE) is a Small Explorer (SMEX) satellite scheduled for launch in 1998 which will carry out a sky survey of at least 100 square degrees in the wavelength regions of 9-15(micro)m and 21-27(micro)m with spatial resolution of approximately 20 arcsec and sensitivity exceeding 0.6mJy. At this sensitivity level WIRE observations can be seriously affected by the confusion noise contribution from the infrared cirrus emission, so the WIRE survey must be planned with some knowledge of the expected level of cirrus confusion. Production of a cirrus confusion noise map with 0.5 degree resolution based on the spatial power spectral density of the cirrus emission in the IRAS ISSA data is in progess using the method described by Gauthier, et al. Spectrally resolved power spectra density data is obtained from the ISSA maps with a wavelet transform technique.

Wide Field Infrared Explorer WIRE infrared sky sur↗

Electrical and Thermal Characterization of 3D Printed Thermoplastic Parts with Embedded Wires for High Current-Carrying Applications

Fabrication of parts exhibiting multi-functionality has recently been complemented by hybrid polymer extrusion additive manufacturing in combination with wire embedding technology. While much mechanical characterization has been performed on parts produced with fused deposition modeling, limited characterization has been performed when combined electrical and thermal loads are applied to 3D printed multi-material parts. As such, this work describes the design, fabrication, and testing of 3D printed thermoplastic coupons containing embedded copper wires that carried current. An automated fabrication process was used employing a hybrid additive manufacturing machine that dispensed polycarbonate thermoplastic and embedded bare copper wires. Testing included AC and DC hipot testing as well as thermal testing on as-fabricated and heat treated coupons to determine the effect of porosity in the substrate. The heat-treated parts contained reduced amounts of porosity, as corroborated through scanning electron microscopy, which led to 50 % increased breakdown strength and 30 to 40 % increased heat dissipation capabilities. The results of this research are describing a set of design protocol that can be used as a guideline for 3D printed embedded electronics to predict the electrical and thermal behavior.

Hipot testing↗

Wire Rope Inspection Report Safety Division, Code 360

The purpose of this report is to review Federal Regulations, Voluntary Consensus Standards (VCS), and best practices associated with WRI requirements within the government and industry. This report provides an analysis to NASA Headquarters regarding the limited risks that wire ropes present to the Agency based on the interpretation of Section 29 CFR 1910.179 (m) of the Occupational Safety and Health Administration (OSHA) requirements that allow inspections of OHC wire rope based on the operational status of the crane. This report also provides details and recommendations for the reduction of personnel exposure to safety risk associated with working at heights while inspecting wire rope on inactive lifting devices.

Wire Rope↗

Hot-wire Anemometry and Planned Test Entries

- Hot-wire anemometers are sensitive to mass flux and total temperature - Applications for hot-wire anemometry include - Determining the flow quality within a facility - Mapping the flowfield that is influenced by a model - Mean flow distortion - Boundary-layer instabilities & transition - It’s an especially important diagnostic if there is no line of sight - We use a constant temperature anemometer (CTA) at a high overheat & calibrate the wire using a modified King’s Law

Hypersonics↗

DEVELOPMENT OF A LIGHT-WEIGHT REGENERATIVELY COOLED THRUST CHAMBER WITH BRAZED RIBS AND BRAZED OUTER WIRE TRAP

Design and fabrication procedures are discussed of a brazed-ribtype thrust chamber fabricated from stainless steel or inconel for a Sooo-lb thrust 20: 1 expansion-area-ratio regeneratively cooled liquidpropellant rocket engine which is designated as the JPL 6K Engine and operates at a chamber pressure of 150 psia. Hydrazine is used as the fuel and regenerative coolant and nitrogen tetroxide as the oxidizer. The nozzle-throat diameter is 5.42 in. The thrust chamber consists of a sheet-metal gas-side liner with longitudinal ribs spotwelded and brazed to the outer surface. Wire is wrapped over the ribs circumferentially, spot-welded to the ribs, and brazed. The liner, ribs, and wire form the coolant-passage walls. There are three basic advantages to this type of thrust chamber: light weight, ease of fabrication, and comparatively low cost. The total dry weight of a thrust chamber of this type and size made of 347 stainless steel is 46.2 lb, and the wet weight is 56.3 Ib. A total of 87 static engine tests were made on 19 of 23 thrust chambers fabricated by this technique. Four of the chambers tested had an expansion-area ratio of 20:1, and 15, which were shorter but had the same throat diameter, had an expansion-area ratio of 3.5:l. Accumulated test time was 1926 sec, including 558 sec regenerative cooling with hydrazine and 1368 sec cooling with water. One 20:l thrust chamber was subjected to 16 separate engine tests, with an accumulated test time of 399 sec, and was still in very good operating condition after the tests were completed. With water flowing through the coolant passages at 10 lb/sec, the measured nominal pressure drop between coolant manifolds of a 20:l thrust chamber wrapped with flat wire was 17.2 psi.

Thrust Chamber↗

Cantilever springs maintain tension in thermally expanded wires

Two deflected cantilever springs strung with wire provide force displacement compensation to maintain tension in the wires as they undergo thermal expansion. This method of maintaining tension in thermally expanded wires is used in electric space heaters and residential heat exchangers.

Terselic, R. A.↗

Wiring harnesses documented by punched-card technique

Cards representing a connector are punched, sorted, and then used to printout wiring documentation for that connector. When wiring changes are made, new cards are punched and the wiring documentation is reprinted to reflect the latest configuration.

Hicks, W. W.↗