Towards a Unified, Scalable, and Highly Capable Next Generation Avionics Interconnect: The NEXUS Approach
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next generation avionics↗
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Results for “interconnections”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Physical Reasoning of Interconnection Forces for Efficient Assembly Planning
Many of the approaches proposed to date for assembly planning have focused on the geometric reasoning of path interferences among parts to generate assembly sequences efficiently.
interconnection↗
Modular chassis simplifies packaging and interconnecting of circuit boards
A system of modular chassis structures has simplified the design for mounting a number of printed circuit boards. This design is structurally adaptable to computer and industrial control system applications.
Arens, W. E.↗
A Flight Investigation of the Performance, Handling Qualities, and Operational Characteristics of a Deflected Slipstream STOL Transport Airplane Having Four Interconnected Propellers
Flight test of performance, handling qualities, and operational characteristics of slipstream stol transport aircraft
HANDLING QUALITY↗
Series parallel interconnections of solar arrays
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Goyette, N. A.↗
Analytical and experimental investigation of outflow residuals in interconnected spherical tanks
Analytical and experimental investigation of propellant distribution during outflow of spherical tanks for possible space vehicle application
Boyle, R. J.↗
Codes, automata, and continuous systems - Explicit interconnections.
Automata and continuous system theories and relationships between convolutional codes and zero state automata and cyclic codes and zero input automata
Massey, J. L.↗
Codes, automata, and continuous systems - Explicit interconnections.
Automata and continuous system theories and relationships between convolutional codes and zero state automata and cyclic codes and zero input automata
Massey, J. L.↗
Leads integral with the internal interconnection that penetrate the molded wall of a package
Multiplicity of external ribbon leads makes possible connections to a sealed or encapsulated microassembly. The leads are integral with the internal connections on a single part that can be fabricated economically by fine-detail electroplating.
Marley, J.↗
Interconnection of solar cells Patent
Metal strip mounting arrangement for solar cell arrays on spacecraft
Haynos, J. G.↗
Metallurgical studies of microcircuit interconnections
Vacuum evaporated films of Au, Pt, and Au-on-Pt on glass substrates after heat treatment
Nowak, W. B.↗
Design of a 12-GHz multicarrier earth-terminal for satellite-CATV interconnection
The design and development of the front-end for a multi-carrier system that allows multiplex signal transmission from satellite-borne transponders is described. Detailed systems analyses provided down-converter specifications. The 12 GHz carrier down-converter uses waveguide, coaxial, and microstrip transmission line elements in its implementation. Mixing is accomplished in a single-ended coaxial mixer employing a field-replacable cartridge style diode.
Newman, B. A.↗
Manufacture and quality control of interconnecting wire harnesses
Four-volume series of documents has been prepared as standard reference. Each volume may be used separately and covers wire and cable preparation as well as harness fabrication and installation. Series should be useful addition to libraries of manufactures of electrical and electronic equipment.
Source record↗
Application of diffusion bonding to electronic interconnection of flatpack leads
Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.
Korb, R. W.↗
A digital simulation method for interconnected continuous systems.
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Diperna, R. A.↗
Diffusion and structural changes in microcircuit interconnections
The interdiffusion of platimum and gold films, a couple utilized in beam lead microcircuits, has been studied for temperatures up to 550 C. Gold-on-platinum couples and separate platimum and gold films 80-450 nm thick, were deposited by electron beam evaporation onto oxidized (111) silicon substrates. Diffusion was monitored by means of spectral reflectance versus wavelength in the band 500-1000 nm. The separate metal films showed good adhesion and stable reflectances (after an initial change) for at least 6 h at diffusion temperatures, in contrast to the couples. Analysis of platinum diffusion through the gold films yielded an activation energy about 38 kcal/g-atom and a pre-exponential factor of the order 0.001 sq cm/sec, values close to those for volume diffusion. The pre-exponential factor especially is dependent upon film deposition conditions.
Nowak, W. B.↗