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Hand tool forms right angles in electronic component leads so they fit the spaced holes of a printed circuit board. This tool firmly holds the leads at points near the component ends to prevent damage and provide accuracy.
Simple, rapid method measures the surface area of a pattern such as comprised by the conductors on a printed circuit board. A negative or positive film of the circuit layout is placed over a uniformly illuminated translucent surface and the proportion of light transmitted to silicon solar cells is determined.
Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material specifications.
Effect of clothing on control of microorganism shedding from worker constructing printed circuit board assembly
Thin film conformal coatings for environmental, handling, reliability and insulation protection of printed circuit boards
Tool bends leads quickly and accurately for mounting on printed circuit boards. It has grooves and bend-angles aligned for particular circuit board applications.
Device for nondestructive testing of soldered joints correlates stress with load to predict printed circuit board lifetime.
Cold testing method prevents formation of frost on printed circuit boards and part holders during testing at sub-zero temperatures. Freon permits rapid attainment of the required testing temperature.
Printed circuit board design allows for thermal stressing of the soldered joints during many thermal cycles. Components' leads should be cleaned, tinned, and freed of particles that prevent solder adherence, have a thin conformal coating, and have an air space between the coating and the body of the component.
Techniques for preparing printed circuit boards are used to provide an alternate method for producing panel symbology for ground computer test trap. After processing, the panel unit is either solder or gold plated.
Test trap consists of logic nest of five printed circuit boards, plus power supply within the unit. Device monitors more than one logic area simultaneously, gives visual display of detected error, operates at computer speed, maintains readily available logic description of cards used, and is compatible with existing computer circuitry.
Postsoldering cleaning agent evaluation for compatibility with printed circuit board assembly materials
Electrical spot terminal assembly for printed circuit boards
Development of magnetic probe for nondestructive testing of multilayer printed circuit boards to determine existence of opens or shorts is reported. Components of probe are described and procedures for operation are discussed. Two illustrations are provided to show magnetic circuits and principles of operation.
A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.
Parts are securely held on sealed, printed circuit board that is both package and test fixture. Parts can be handled, stored, and tested in sealed package.
The structural test unit of the electron-proton spectrometer was tested to a random vibration spectra and to a sinusoidal resonant search to comply with the requirements of a verification plan for the spectrometer. The test item consisted of mass simulated electronic and printed circuit boards mounted in a flight type electronic housing. The arrangement, center of gravity, and weight were as proposed for flight units.
Design principles and test results of modifications to two wideband channels, 8 kHz DS located at 44kHz and 16 kHz SSB located at 104 kHz, are given. Data cover power supply modifications, wideband operational amplifiers, trade-off to determine requirements for precision components, printed circuit board layout, applicability of original equipment specification No. 110438, and optimum wideband channel design.