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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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The goals of cost/benefit assessments are to provide quantitative and qualitative data to aid in the decision-making process. Benefits derived from increased throughput (or decreased delays) used to balance life-cycle costs. Packaging technologies together may provide greater gains (demonstrate higher return on investment).
Colliding pulse mode-locked laser arrays are being developed at 20 GHz for WDM applications. Arrays with 5 wavelengths in the EDFA gain bandwidth have already been demonstrated, with the final goal being a packaged, 10 wavelength mode-locked laser array.
A high energy, single mode, all solid-state Nd:YAG laser primarily for pumping an UV converter is developed. Greater than 1 J/pulse at 50 HZ PRF and pulse widths around 22 ns have been demonstrated. Higher energy, greater efficiency may be possible. Refinements are known and practical to implement. Technology Demonstration of a highly efficient, high-pulse-energy, single mode UV wavelength generation using flash lamp pumped laser has been achieved. Greater than 90% pump depletion is observed. 190 mJ extra-cavity SFG; IR to UV efficiency > 21% (> 27% for 1 mJ seed). 160 mJ intra-cavity SFG; IR to UV efficiency up to 24% Fluence < 1 J/sq cm for most beams. The pump beam quality of the Nd:YAG pump laser is being refined to match or exceed the above UV converter results. Currently the Nd:YAG pump laser development is a technology demonstration. System can be engineered for compact packaging.
In 2020, the Mars Oxygen In-Situ Resource Utilization Experiment (MOXIE) will fly to Mars as part of the Mars-2020 “Perseverance” rover’s experiment package, and for the first time will demonstrate the use of in-situ resources of another planet, by using the carbon dioxide atmosphere of Mars as a feedstock to produce oxygen. MOXIE, however, was not the first flight experiment proposed to test in-situ resource utilization (ISRU). The Mars ISPP Precursor, “MIP”, was a flight experiment on the 2001 Mars Surveyor Lander that was designed to demonstrate In-situ Propellant Production--ISPP--for the first time on Mars. The experiment was designed to show that it was possible to produce oxygen from the carbon dioxide atmosphere, and to demonstrate the individual technology components that would go into a full-scale production plant. The aim point of the oxygen production was to showcase the possibility of producing oxygen for use as rocket fuel, ultimately as an enabling technology for a future human expedition to Mars.
Resonators and qubits with a niobium (Nb) base metal layer achieve some of the highest coherence times in superconducting quantum devices. The performance of such devices is often limited by loss associated with two-level systems, which are found primarily at material surfaces and interfaces. The metal-air (MA) interface is a major contributor to device loss. In this work, we develop a fast-sealing microwave cavity that enables devices to be placed under vacuum within five minutes of oxide removal, thereby significantly reducing the MA interface loss compared to common device processing and packaging approaches. Using coplanar stripline resonators, we demonstrate that devices sealed in such a cavity exhibit internal quality factors exceeding one million at single-photon power. After re-exposure to air, the devices show downward resonance frequency shifts and quality factor degradations, quantitatively consistent with a model of Nb oxide regrowth. The fast-sealing microwave cavity provides a practical and consistent method to mitigate MA interface loss and sustain high coherence in Nb devices, and establishes a controlled platform for studying metal oxide regrowth kinetics and dielectric properties, the understanding of which is critical to achieving high coherence in superconducting quantum devices.
The Data Analysis Plan (DAP) describes the data analysis that the C3 Work Package (WP) will perform in support of the Access 5 Step 1 C3 flight demonstration objectives as well as the processes that will be used by the Flight IPT to gather and distribute the data collected to satisfy those objectives. In addition to C3 requirements, this document will encompass some Human Systems Interface (HSI) requirements in performing the C3 flight demonstrations. The C3 DAP will be used as the primary interface requirements document between the C3 Work Package and Flight Test organizations (Flight IPT and Non-Access 5 Flight Programs). In addition to providing data requirements for Access 5 flight test (piggyback technology demonstration flights, dedicated C3 technology demonstration flights, and Airspace Operations Demonstration flights), the C3 DAP will be used to request flight data from Non- Access 5 flight programs for C3 related data products
The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.
The Mars In-Situ Propellant Production (ISPP) Precursor (MIP) experiment package is planned for inclusion on the Mars 2001 Lander. This experiment package consists of five experiments whose purpose is to demonstrate the performance of various ISPP processes in-situ on Mars. The demonstrated ability to produce propellant for Mars Return Vehicles (MRV) is considered to be a necessary precursor to any future manned mission to Mars. The Mars Thermal Environment/Radiator Characterization (MTERC) experiment is part of the MIP package and is intended to determine the Mars night sky temperature as well as to characterize the performance degradation of radiators caused by environmental exposure on Mars over time. Radiators are needed as part of the ISPP process to remove heat from the Mars Atmosphere Acquisition and Compression (MAAC) CO2 sorption compressor. MTERC will provide the data needed to optimize the design of radiators for ISPP and other processes. A MTERC Development Unit (DU) has been fabricated and tested at JPL. The MTERC DU consists of 1) a radiator subassembly, 2) a motor/cover subassembly, 3) a differential temperature control circuit and motor control electronics circuit board, and 4) a command and data handling electronics circuit board. This paper will describe the operational theory and the configuration of the MTERC DU and will discuss the current status of the MTERC experiment development including some selected results of performance testing that has been completed prior to the ISRU III meeting.
The Mars In-Situ Propellant Production (ISPP) Precursor (MIP) experiment package is planned for inclusion on the Mars 2001 Lander. This experiment package consists of five experiments whose purpose is to demonstrate the performance of various ISPP processes in-situ on Mars. The demonstrated ability to produce propellant for Mars Return Vehicles (MRV) is considered to be a necessary precursor to any future manned mission to Mars. The Mars Thermal Environment/Radiator Characterization (MTERC) experiment is part of the MIP package and is intended to determine the Mars night sky temperature as well as to characterize the performance degradation of radiators caused by environmental exposure on Mars over time. Radiators are needed as part of the ISPP process to remove heat from the Mars Atmosphere Acquisition and Compression (MAAC) C02 sorption compressor. MTERC will provide the data needed to optimize the design of radiators for ISPP and other processes. A MTERC Development Unit (DU) has been fabricated and tested at JPL. The MTERC DU consists of: (1) a radiator subassembly, (2) a motor/cover subassembly, (3) a differential temperature control circuit and motor control electronics circuit board, and (4) a command and data handling electronics circuit board. This paper will describe the operational theory and the configuration of the MTERC DU and will discuss the current status of the MTERC experiment development including some selected results of performance testing that has been completed prior to the ISRU III meeting.
This project resulted in multiple first-of-a-kind demonstrations, including two generations of transmitters, a receiver, and a complete coherent link. The transmitter architecture, based on EAMs to generate QPSK modulation was first demonstrated in InP, which has limitations for scaling up to chips with multiple channels for full WDM architectures, and implementing the densities and level of integration needed to implement co-packaging with electronics. Our work resulted in the first demonstration of this architecture on a Si platform compatible with copackaging, and our working prototypes illustrated the potential of the approach. The link demonstration was also the first coherent optical link realized in a multi-micron waveguide platform. For the transmitters, integrating efficient III-V EAM devices into the large waveguide Si platform simultaneously enables significant reduction in driver power consumption while minimizing optical losses in routing and fiber coupling. On the receiver side, optical coupling and propagation losses are also minimized in the multi-micron platform, reducing required laser optical power which improves link energy efficiency. The measurement results presented in the final report demonstrate that we achieved the speed objectives for the program (112Gb/s: 56Gbaud QPSK), albeit at a higher BER than targeted. The report provides assessments of the low-powercoherent link architecture and associated components developed under the program from both technological and commercial viewpoints.
Microfabricated surface ion traps and silicon-based photonics are critical technologies for scaling quantum systems. Current ion trap architectures face scalability and integration challenges due to limitations in optical access, fabrication techniques, and material compatibility. State-of-the-art quantum computers and atomic clocks are investigating monolithic integration, which necessitates custom traps for each ion species and has not overcome the integration hurdles presented by merging these technologies. The Chimera (Ion Traps and Packaging for Heterogeneous Integration) project proposes a novel approach utilizing heterogeneous integration (HI) of ion traps and photonic circuits. This separation of components allows for flexibility in ion trap design and reduces fabrication compromises. The Chimera project specifically designed an ion trap to interface vertically with a separately fabricated waveguide chip and demonstrates the first steps to integrating them at the packaging level. The ion trap features a large area of removed silicon, allowing the photonics chip outputs closer to the ion trap, improving alignment and packaging processes. The alignment must be accurate to < 1 µm to ensure that the light from the waveguide can overlap with the trapping region. This fine alignment must also be maintained through an ultra-high vacuum bake, a critical step in preparing an ion trap experiment. By combining separate chips, we demonstrate a new path for scaling trapped ion technology that is less reliant on monolithic integration. We successfully fabricated a trap with a large area of oxide removed, resulting in a region thinned to about 40 µm, a key milestone toward successful integration.
Legacy waste generated by the sodium-cooled fast reactor, EBR-II, program at the Idaho National Laboratory (INL) (owned by the U.S. Department of Energy and managed and operated by Battelle Energy Alliance, LLC) is challenging to treat and disposition using conventional methods. As a result, Veolia Nuclear Solutions is under contract with the Idaho National Laboratory to demonstrate an integrated retrieval and disposition solution for Remote-Handled Mixed Low-Level Waste currently stored in underground liners at INL. Delivery of the integrated solution builds on the expertise and successes of Veolia Nuclear Solutions under its Problematic Waste Treatment Initiative with INL. This initiative focuses solely on the treatment of problematic (reactive metal containing) waste streams using the Veolia Nuclear Solutions GeoMelt{sup R} In-Container Vitrification (ICV{sup TM}) technology. Under the contract, Veolia Nuclear Solutions will provide a fully commissioned prototype remote retrieval system to semi-remotely retrieve and size-reduce problematic waste liners into a safe and consolidated package for transport. The consolidated package will be shipped to Richland, Washington for demonstration treatment using the robust GeoMelt Richland system at Perma-Fix Northwest. The treated waste will ultimately be disposed of as a vitrified Low-Level Waste glass monolith. Veolia Nuclear Solutions has delivered countless remotely operated systems globally to solve some of the industry's most challenging problems. To ensure risk is mitigated in the best possible manner, a methodical phased approach is being utilized to validate the integrated solution. This contract focuses on the delivery and deployment of the prototype retrieval system onsite and the treatment of a single liner. Following successful demonstration treatment using GeoMelt ICV, the project is planning to make prototype enhancements before retrieving and treating another liner. Establishing a new integrated approach for retrieval and disposition of waste offers many benefits to INL and the U.S. Department of Energy. It is anticipated that the integrated solution will provide significant cost and schedule savings by increasing the number of liners dispositioned per year. In addition, the complexity of the overall waste disposition process will be reduced. Remotely retrieving and size-reducing waste in the field will provide additional safety to operational personnel and allow critical resources, such as hot cells, to focus on the primary missions at hand. Vitrification (using the GeoMelt ICV technology) allows for the direct processing of metal clad waste thereby significantly reducing pretreatment steps while providing a robust waste form for long-term disposal. The results from this ongoing contract are presented in this paper. (authors)
An investigation has been conducted in the Langley 20-foot free-spinning tunnel on a l/19-scale model of the North American T-28C airplane to determine the spin and recovery characteristics. The T-28C airplane is similar to the T-28B airplane except for slight modifications for the arresting hook. The lower rear section of the fuselage was cut out and, consequently, the lower part of the rudder was removed to make a smooth fairing with the fuselage. The T-28B airplane had good recovery characteristics; but these modifications, along with the addition of gun packages on the wings, led to poor and unsatisfactory spin-recovery characteristics during demonstration spins of the T-28C airplane. Model test results indicated that without the gun packages installed, satisfactory recoveries could be obtained if the elevators were held full back while the rudder was fully reversed and the ailerons were held neutral. However, with the addition of gun packages to the wings and the corresponding change in loading, recoveries were considered unsatisfactory. Recoveries attempted by using a larger chord or larger span rudder were improved very slightly, but were still considered marginal or unsatisfactory. Strakes placed on the nose of the model were effective in slowing the spin rotation slightly and, in most instances, decreased the turns for recovery slightly. Recovery characteristics were slightly marginal for the full fuel loading when strakes and the extended-chord rudder were installed; but with the wing fuel partly used, recovery characteristics were again considered unsatisfactory or, at least, definitely on the marginal side. The optimum control technique for recovery is movement of the rudder to full against the spin with the stick held full back (elevators full up) and the ailerons held neutral, followed by forward movement of the stick only after the spin rotation ceases. Inverted-spin test results indicate that the airplane will spin steep and fast and that recovery by full rudder reversal will be satisfactory if the ailerons are held neutral.
A Python-based metrics and diagnostics package is currently being developed by the ARM Infrastructure Team at Lawrence Livermore National Laboratory to facilitate the use of long-term high frequency measurements from the ARM program in evaluating the regional climate simulation of clouds, radiation, precipitation, and aerosols. This metrics and diagnostics package computes climatological means of targeted climate model simulation and generates tables and plots for comparing the model simulation with ARM observational data. The CMIP model data sets are also included in the package to enable model inter-comparison as demonstrated in Zhang et al. (2018) and Zhang et al. (2020). The mean of the CMIP model can be served as a reference for individual models. Basic performance metrics are computed to measure the accuracy of mean state and variability of climate models. The evaluated physical quantities include cloud fraction, temperature, relative humidity, cloud liquid water path, total column water vapor, precipitation, sensible and latent heat fluxes, aerosol optical depth, and radiative fluxes, with plan to extend to more fields, such as the evaluation of model simulated aerosol physicochemical properties and cloud microphysics properties. Process-oriented diagnostics focusing on aerosol, cloud, and precipitation-related phenomena are also being developed for the evaluation and development of specific model physical parameterizations. In addition to the Southern Great Plains (SGP), North Slope of Alaska (NSA) and Tropical Western Pacific (TWP) atmospheric observatories in the ARMDIAGS version 2.0, the version 3.0 package have extended to the data collected at the ARM Eastern North Atlantic (ENA) atmospheric observatory and the Observation and Modeling of the Green Ocean Amazon (GOAMAZON) field campaign. The metrics and diagnostics package are currently built upon standard Python libraries and additional Python packages developed by DOE (CDAT). The ARM metrics and diagnostic package is available publicly with the hope that it can serve as an easy entry point for climate modelers to compare their models with ARM data. In this report, we first provide an overview of major metrics in section 2. The input data, which constitutes the core content of the metrics and diagnostics package, is summarized in section 3. A user's guide documenting the workflow/structure of the version 3.0 codes and including step-by-step instruction for running the package is described in section 4.
NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.
Computational fluid dynamics simulations have been performed to study the applicability of engineering CFD methods for thermals striping analysis. Thermal striping is the fluctuating temperature profile in a solid caused by fluctuating fluid temperature, and the resulting fluctuating thermal stresses cause high cycle fatigue and eventual material failure. Here this study presents the methodology for thermal striping analysis that including a transient conjugate heat transfer RANS model and benchmark the results against a sodium triple jet experiment. The multiphysics calculations are implemented to analyze the thermal stresses in the solid domain caused by the coupled heat transfer between the fluid and solid domains. Validation data from a liquid sodium triple jet experiment include time-averaged temperature measurements and power spectra of the temperature signal. The numerical results agree well with these experimental measures, demonstrating key features such as the dominant frequency of temperature fluctuations. The applicability of a low-cost wall treatment method is demonstrated, enabling key computational savings. Finally, the performance of two finite element stress analysis software packages is compared, and the validity of the lower-cost method is confirmed. These results demonstrate the applicability of engineering methods for computational thermal striping calculations, enabling thermal striping estimations in large fluid systems such as the core of a Sodium-cooled nuclear reactor.
The goal of this project was to demonstrate technical feasibility of an integrated approach for deep energy retrofits by packaging innovative technologies with smart communicating controls that represent the next generation of energy efficiency. The integrated solutions for optimized performance (ISOP) package integrates (i) advanced lighting and plug load controls; (ii) intelligent daylight harvesting through automated self-powered shades and window films; (iii) advanced HVAC controls sequences (ASHRAE Guideline (GDL) 36); and (iv) fault detection and diagnosis (FDD) and continuous commissioning (CCx) using advanced analytics. These technologies address energy use across multiple building end uses that represent more than 60% of the energy consumption in all commercial buildings. The project was structured to be implemented over three budget periods: Budget Period 1 scope included site selection, project design, site-specific customization of technology packages, procurement of technologies, initiation of installation of technologies, the development of a measurement and verification plan and collection of pre-retrofit data collection. The first year go/no-go decision was based on securing host sites representing 250,000 sq. ft. of occupied operational spaces, savings analysis, technology procurement and initiation of installation. Budget Period 2 planned to complete technology installations and initiate data collection of post-retrofit performance data. The second year go/no-go was to be the completion of technology installations and commissioning, metering and data collecting to support the requirements laid out in site specific M&V plans. Budget Period 3 planned to collect and analyze post-retrofit performance data and provide data and reporting to support energy efficiency rebate programs. After the team completed activities planned for Budget Period 1, the team reached a Go/No-Go Decision Point. At that point, TRC recommended that DOE discontinue the project without prejudice due to challenges with securing demonstration sites to meet the full 250,000 sf of occupied operational spaces and DOE concurred. In Budget Period 1, the TRC team developed criteria to recruit and evaluate potential demonstration host sites. TRC worked with Princeton University, the project demonstration partner, to identify buildings on their campus as potential candidates for the demonstration. Following the selection of demonstration sites, the TRC team customized energy technology packages according to the needs and characteristics of each site. TRC defined technology specifications, identified vendors, and conducted analysis to estimate energy and cost savings potential. The project team then developed schedules for technology procurement processes and scheduled for installation at all selected demonstration sites. The project team worked with Princeton University and DOE to develop an approach to verify energy savings achieved through measurement and verification (M&V) 2.0 methods. Princeton University initiated open bids to procure the necessary materials and installation contractors. Bid results came back higher than estimates due to a couple of factors – lack of familiarity of the bidders with the proposed technologies and lack of local trained installers to execute the installation of these new measures. Due to the higher bids, projects no longer met the internal cost-effectiveness criteria used by Princeton to proceed with procurement of the full suite of technologies as proposed in ISOP. Princeton had already procured parts of the ISOP package as part of a campus-wide initiative for FDD and lighting retrofits, but with the higher costs for other ISOP components, Princeton could no longer commit to the full ISOP package on the selected sites. Based on this, the team reached the Go/No-Go decision point, where they decided not to proceed with the project. Princeton is separately installing portions of the ISOP package where they individually meet Princeton’s payback criteria but on a different schedule than would have been needed for the DOE ISOP project. The team has learned several lessons from project progress in the first budget period. The team will utilize these lessons in future projects, as should any team which proceeds with a project around the ISOP technology. The first lesson is that more information about the proposed sites is required earlier in the process (perhaps even at the proposal stage) in order to have a successful demonstration. Technical details not evident earlier in the process (such as the TLED limitations for ALCS) can derail project execution. The second lesson is that pricing of emerging technologies is highly variable due to lack of familiarity of local installers and distributor with the proposed technologies as well as alternate bids using products they were more familiar with, but that cost more than the ones proposed by TRC. Finally, the last major lesson is that the host site’s internal project criteria is of critical importance. Based on these higher installed costs and lack of an informed installer base for the products proposed for this project, the project does not meet Princeton’s simple payback goals of five years.
A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.