Development of thinned silicon sensors on 8” wafers (CRADA FRA-2015-0015 Final Report)
Sensors fabricated from high resistivity, float zone, silicon material have been the basis of vertex detectors and trackers for the last 30 years. The areas of these devices have increased from a few square cm to >200 m 2 for the existing CMS tracker. CMS and ATLAS upgrades will each require more than 200 m 2 of silicon and the CMS High Granularity Calorimeter (HGC) will require more than 600 m 2 . Cost and complexity of assembly of these devices is related to the area of each module, which in turn is set by the area of the silicon sensors. A move from 4” and 6” wafers (the only sizes currently available) to 8” diameter in volume production has the potential for savings of tens of millions of dollars in the detector upgrade programs at the Large Hadron Collider (LHC) and future experiments. In addition to large area, the devices must be radiation hard, which can be achieved by the use of sensors thinned to 200 microns or less. The combination of wafer thinning and large wafer diameter is a significant technical challenge, and is the subject of this work.