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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11

LET and Range Characteristics of Proton Recoil Ions in Gallium Nitride (GaN)

A better understanding of the linear energy transfer and the range of proton recoil ions in gallium nitride is necessary to properly evaluate GaN device radiation tolerance. By analyzing the linear energy transfer (LET) and range of recoil heavy ions in GaN we can begin to reproduce the body of knowledge that exists for Si-based devices for this upcoming technology. Although the previous data on older technology has impressive depth and breadth we must be diligent and cautious in the application of these institutional intuitions when applied to emerging technologies such as GaN. As ever increasing materials science advances emerge, a sound methodology for evaluating new technologies must be established in order to apply what we know towards the effort of ensuring radiation tolerance.

gallium nitride (GaN)↗

Engineered Interfaces in Extruded Polyphenylsulfone- Boron Nitride Composite Insulation

Improving matrix-filler interactions is critical for optimizing dielectric performance in composite insulation; however, the technique used to an introduce inorganic filler into organic matrices varies in its ability to satisfactorily reduce the size of cavities and interfaces. This study reports how sample rheology influenced the dielectric performance and thermal conductivity of extruded polyphenylsulfone (PPSU) – hexagonal boron nitride (BN) composite insulation through changing the BN incorporation strategy. Depending on the technique used to introduce BN into the host matrix, the low melt viscosity, torque, and melt viscosity temperature of the polymer were reduced, enabling better mixing, heat transfer, and smaller voids. This corresponded to an increase in dielectric strength compared to other formulations; however, the thermal conductivity shifted further away from the thermal conductivity target of 1 W/m·K target, which was an indication of a larger separation distance between the particles in samples with smaller interfaces. A trade-off between dielectric strength and thermal conductivity may exist when maximizing thermal conduction without sacrificing dielectric strength.

polyphenylsulfone↗

Engineered Interfaces in Extruded Polyphenylsulfone-Boron Nitride Composite Insulation

Improving matrix-filler interactions is critical for optimizing dielectric performance in composite insulation; however, the technique used to introduce inorganic fillers into an organic matrix varies in its ability to satisfactorily reduce the size of cavities and interfaces. This study reports effects from changing the filler incorporation strategy on the rheology, dielectric performance and thermal conductivity of extruded polyphenylsulfone (PPSU) – hexagonal boron nitride (hBN) composite insulation. Depending on the technique used to introduce BN into the host matrix, the viscosity, torque, and melt viscosity temperature of the polymer were reduced, enabling better mixing, heat transfer, and smaller voids. This corresponded to an increase in dielectric strength compared to other formulations at either a similar or lower filler loading. On the other hand, the thermal conductivity in these specimens shifted further away from the thermal conductivity target of 1 W/m·K, which was an indication of a larger separation distance between the particles in samples with smaller interfaces. A trade-off between dielectric strength and thermal conductivity may exist when maximizing thermal conduction without sacrificing dielectric strength.

Polyphenylsulfone↗

Intercalation and Exfoliation of Hexagonal Boron Nitride

Innovators at NASA's Glenn Research Center have made several breakthroughs in treating hexagonal boron nitride (hBN) nanomaterials, improving their properties to supplant carbon nanotubes in many applications. These advances have hBN nanomaterials set to transform applications such as heat sinks, electrical insulators, lightweight piezoelectric polymers for satellites and unmanned aerial vehicles, ceramic composites for jet engines, biomedical components, and radiation shielding technology.

Hexagonal Boron Nitride↗

Modification of Hexagonal Boron Nitride with Metal Oxides

The development of multifunctional hexagonal boron nitride (hBN) materials aims to capitalize on the intrinsic properties of hBN which include being electrically insulating, thermally conductive, and chemically and thermally stable at high temperatures. The creation of novel composite materials that include these properties is required to address our current aerospace and space engineering challenges. Researchers at NASA Glenn have done significant prior work which has produced processes to intercalate, exfoliate, coat, and functionalize various hBN materials. This presentation covers our recent progress towards the integration of titanium oxides into hBN utilizing our previous methods along with optimizing and producing new methods to create novel functional hBN nanomaterials.

boron nitride↗

Laser Sintering of RTM385-SLS Thermoset Polyimides With Boron Nitride

RTM385-SLS is a melt-processable thermoset polyimide resin specially formulated with a complex melt viscosity (ƞ*) of ~104-105 poise for laser sintering. RTM385-SLS resin powder was mixed with 20-25% of hexagonal boron nitride (h-BN) and subjected to laser sintering (LS) to print out “Green” disks and dogbone specimens which could be further post-cured in an oven to complete the crosslinking of the reactive phenylethynyllphthalic anhydride (PEPA) terminal groups within the resin to achieve a very high glass transition temperature (T g ) of 385°C. The cured composite specimens were then subjected to thermal analysis, thermal conductivity measurement and mechanical testing for characterization.

Additive manufacturing↗

Engineered Hexagonal Boron Nitride:Titanium Dioxide Composites for High Voltage Insulation

Hexagonal boron nitride (hBN) and Titanium dioxide are both ceramic materials with widespread use in commercial and consumer applications in everything from cosmetics and paint to deep space satellite components. As a dielectric material, hBN is electrically insulating, thermally conductive, and stable to most temperatures and environments. Titanium dioxide is also a good electrical insulator with a wide bandgap and large dielectric constant, as well as high temperature tolerance and chemical stability. This presentation covers our recent efforts to combine the best properties of hBN and titanium dioxide to produce an intercalated hBN:titanium dioxide composite which was then further processed and incorporated into polymer composites, as well as a standalone ceramic material for testing as a novel insulation material.

boron nitride↗

Electrical Endurance to Extrinsic Aging of Polyphenylsulfone-Boron Nitride Composite Insulation for Aeronautical Power Systems

Various insulating materials which can be potentially used in energy application, especially in electrified transportation, are investigated in this paper. They are based on Polyphenylsulfone matrix filled by macro and nano hexagonal Boron-nitride particles. Our study focuses on electrical properties, particularly endurance to partial discharges. Upon developing an original testing procedure and adequate partial discharge inception modeling, it is shown that that the h-BN micron and nano fillers can significantly improve the dielectric strength and resistance of PPSU to extrinsic aging, even in comparison with the insulating material typically used for electrified transportation, i.e., corona resistant polyimide. Also, a new diagnostic marker, extracted from partial discharge monitoring and analytics obtained by an innovative software, i.e., the likelihood surface discharge identification, seems to be very promising for dynamic residual life prediction for an insulation system subjected to surface discharges.

Polyphenylsulfone (PPSU)↗

High Yield Exfoliation of a Sub-Micron Hexagonal Boron Nitride Using a Solvent Free Method

Sodium fluoride (NaF) has been found to be an activation agent in exfoliating a hexagonal boron nitride (hBN) platelet, using solvent free method. The procedure was carried out by enhancing the intercalation of ferric chloride (FeCl3) in an intermediate step, up to 330 °C, followed by removal of the by-product at room temperature. In this research, five additional common salts including lithium fluoride, potassium fluoride, lithium chloride, sodium chloride, and potassium chloride, were examined and compared to NaF for their effectiveness in producing the most exfoliation of a commercially available sub-micron-size hBN. It was found that, all fluoride and chloride salts significantly activated the intercalation of FeCl3 into this hBN. Analyses and characterization from X-ray diffraction, scanning electron microscopy, Fourier transform infrared spectroscopy and Raman spectroscoy revealed NaCl to be one of most effective agents without further heat treatment and the least expensive salt in the intercalating reaction and exfoliation process. The synthetic route of this solvent free method is straightforward with 89% yield and above which can be produced on a large scale.

boron nitride↗

Radiation tolerant silicon nitride insulated gate field effect transistors

Metal-Insulated-Semiconductor Field Effect Transistor /MISFET/ device uses a silicon nitride passivation layer over a thin silicon oxide layer to enhance the radiation tolerance. It is useful in electronic systems exposed to space radiation environment or the effects of nuclear weapons.

Newman, P. A.↗