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Two-dimensional MEMS microshutter arrays are being developed for use as a high contrast field selector for the Near Infrared Spectrograph (NIRSpec) on the James Webb Space Telescope (JWST). We present details of microshutter array fabrication and give results of work done to optimize the flatness of microshutter elements through film stress control for both room temperature and cryogenic (35K) operation.
Rapid identification of pathogenic bacterial species is an important factor in combating public health problems such as E. coli contamination. Food and waterborne pathogens account for sickness in 76 million people annually (CDC). Diarrheagenic E. coli is a major source of gastrointestinal illness. Severe sepsis and Septicemia within the hospital environment are also major problems. 75 1,000 cases annually with a 30-50% mortality rate (Crit Care Med, July '01, Vol. 29, 1303-10). Patient risks run the continuum from fever to organ failure and death. Misdiagnosis or inappropriate treatment increases mortality. There exists a need for rapid screening of samples for identification of pathogenic species (Certain E. coli strains are essential for health). Critical to the identification process is the ability to isolate analytes of interest rapidly. This poster discusses novel devices for the separation of particles on the basis of the dielectric properties, mass and surface charge characteristics is presented. Existing designs involve contact between electrode surfaces and analyte medium resulting in contamination of the electrode bearing elements Two different device designs using different bulk micromachining MEMS processes (PolyMUMPS and a PyrexBIGold electrode design) are presented. These designs cover a range of particle sizes from small molecules through eucaryotic cells. The application of separation of bacteria is discussed in detail. Simulation data for electrostatic and microfluidic characteristics are provided. Detailed design characteristics and physical features of the as fabricated PolyMUMPS design are provided. Analysis of the simulation data relative to the expected performance of the devices will be provided and subsequent conclusions discussed.
An effort to develop large-aperture, wide-angle-scanning reflectarray antennas for microwave radar and communication systems is underway. In an antenna of this type as envisioned, scanning of the radiated or incident microwave beam would be effected through mechanical rotation of the passive (reflective) patch antenna elements, using microelectromechanical systems (MEMS) stepping rotary actuators typified by piezoelectric micromotors. It is anticipated that the cost, mass, and complexity of such an antenna would be less than, and the reliability greater than, those of an electronically scanned phased-array antenna of comparable beam-scanning capability and angular resolution. In the design and operation of a reflectarray, one seeks to position and orient an array of passive patch elements in a geometric pattern such that, through constructive interference of the reflections from them, they collectively act as an efficient single reflector of radio waves within a desired frequency band. Typically, the patches lie in a common plane and radiation is incident upon them from a feed horn.
A RF MEMS switch comprising a crossbeam of SiC, supported by at least one leg above a substrate and above a plurality of transmission lines forming a CPW. Bias is provided by at least one layer of metal disposed on a top surface of the SiC crossbeam, such as a layer of chromium followed by a layer of gold, and extending beyond the switch to a biasing pad on the substrate. The switch utilizes stress and conductivity-controlled non-metallic thin cantilevers or bridges, thereby improving the RF characteristics and operational reliability of the switch. The switch can be fabricated with conventional silicon integrated circuit (IC) processing techniques. The design of the switch is very versatile and can be implemented in many transmission line mediums.
Sensors designed and fabricated according to the principles of microelectromechanical systems (MEMS) are being developed for several medical applications in outer space and on Earth. The designs of these sensors are based on a core design family of pressure sensors, small enough to fit into the eye of a needle, that are fabricated by a "dissolved wafer" process. The sensors are expected to be implantable, batteryless, and wireless. They would be both powered and interrogated by hand-held radio transceivers from distances up to about 6 in. (about 15 cm). One type of sensor would be used to measure blood pressure, particularly for congestive heart failure. Another type would be used to monitor fluids in patients who have hydrocephalus (high brain pressure). Still other types would be used to detect errors in delivery of drugs and to help patients having congestive heart failure.
A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectromechanical systems (MEMS) that have been fabricated on dissimilar substrates. Unlike in some older membrane-transfer processes, there is no use of wax or epoxy during transfer. In this process, the substrate of a wafer-level structure to be transferred serves as a carrier, and is etched away once the transfer has been completed. Another important feature of this process is that two electrodes constitutes an electrostatic actuator array. An SOI wafer and a silicon wafer (see Figure 1) are used as the carrier and electrode wafers, respectively. After oxidation, both wafers are patterned and etched to define a corrugation profile and electrode array, respectively. The polysilicon layer is deposited on the SOI wafer. The carrier wafer is bonded to the electrode wafer by using evaporated indium bumps. The piston pressure of 4 kPa is applied at 156 C in a vacuum chamber to provide hermetic sealing. The substrate of the SOI wafer is etched in a 25 weight percent TMAH bath at 80 C. The exposed buried oxide is then removed by using 49 percent HF droplets after an oxygen plasma ashing. The SOI top silicon layer is etched away by using an SF6 plasma to define the corrugation profile, followed by the HF droplet etching of the remaining oxide. The SF6 plasma with a shadow mask selectively etches the polysilicon membrane, if the transferred membrane structure needs to be patterned. Electrostatic actuators with various electrode gaps have been fabricated by this transfer technique. The gap between the transferred membrane and electrode substrate is very uniform ( 0.1 m across a wafer diameter of 100 mm, provided by optimizing the bonding control). Figure 2 depicts the finished product.
A proposed inchworm actuator, to be designed and fabricated according to the principles of microelectromechanical systems (MEMS), would effect linear motion characterized by steps as small as nanometers and an overall range of travel of hundreds of microns. Potential applications for actuators like this one include precise positioning of optical components and active suppression of noise and vibration in scientific instruments, conveyance of wafers in the semiconductor industry, precise positioning for machine tools, and positioning and actuation of micro-surgical instruments. The inchworm motion would be generated by a combination of piezoelectric driving and electrostatic clamping. The actuator (see figure), would include a pair of holders (used for electrostatic clamping), a slider (the part that would engage in the desired linear motion), a driver, a piezoelectric stack under the driver, and a pair of polymer beams centrally clamped to the flexure beam via a T bar. The holders would be held stationary. One end of the piezoelectric stack would be held stationary; the other end would be connected to the bottom of the driver, which would be free to move up and down. All of these components except the piezoelectric stack and the polymer beams would be micromachined from a 500- m-thick silicon wafer by deep reactive-ion etching. The inchworm motion would be perpendicular to the broad faces of the wafer (perpendicular to the plane of the figure). The combination of the polymer beams and the centrally clamped flexure beam would spring-bias the slider into a position such that, in the absence of electrostatic clamping, the gap between the slider on the one hand and both the driver and the holder on the other hand would be no more than a few microns. This arrangement would make it possible to electrostatically pull the slider into contact with either the holders or the driver at a clamping force of the order of 1 N by applying a reasonably small voltage (of the order of 100 V).
A microshutter array (MSA) has been developed for use as an aperture array for multi-object selections in James Webb Space Telescope (JWST) technology. Light shields, molybdenum nitride (MoN) coating on shutters, and aluminum/aluminum oxide coatings on interior walls are put on each shutter for light leak prevention, and to enhance optical contrast. Individual shutters are patterned with a torsion flexure that permits shutters to open 90 deg. with a minimized mechanical stress concentration. The shutters are actuated magnetically, latched, and addressed electrostatically. Also, micromechanical features are tailored onto individual shutters to prevent stiction. An individual shutter consists of a torsion hinge, a shutter blade, a front electrode that is coated on the shutter blade, a backside electrode that is coated on the interior walls, and a magnetic cobalt-iron coating. The magnetic coating is patterned into stripes on microshutters so that shutters can respond to an external magnetic field for the magnetic actuation. A set of column electrodes is placed on top of shutters, and a set of row electrodes on sidewalls is underneath the shutters so that they can be electrostatically latched open. A linear permanent magnet is aligned with the shutter rows and is positioned above a flipped upside-down array, and sweeps across the array in a direction parallel to shutter columns. As the magnet sweeps across the array, sequential rows of shutters are rotated from their natural horizontal orientation to a vertical open position, where they approach vertical electrodes on the sidewalls. When the electrodes are biased with a sufficient electrostatic force to overcome the mechanical restoring force of torsion bars, shutters remain latched to vertical electrodes in their open state. When the bias is removed, or is insufficient, the shutters return to their horizontal, closed positions. To release a shutter, both the electrode on the shutter and the one on the back wall where the shutter sits are grounded. The shutters with one or both ungrounded electrodes are held open. Sub-micron bumps underneath light shields and silicon ribs on back walls are the two features to prevent stiction. These features ensure that the microshutter array functions properly in mechanical motions. The MSA technology can be used primarily in multi-object imaging and spectroscopy, photomask generation, light switches, and in the stepper equipment used to make integrated circuits and MEMS (microelectromechanical systems) devices.
This work focused on developing, fabricating, and fully calibrating a flowangle probe for aeronautics research by utilizing the latest microelectromechanical systems (MEMS), leadless silicon on insulator (SOI) sensor technology. While the concept of angle probes is not new, traditional devices had been relatively large due to fabrication constraints; often too large to resolve flow structures necessary for modern aeropropulsion measurements such as inlet flow distortions and vortices, secondary flows, etc. Mea surements of this kind demanded a new approach to probe design to achieve sizes on the order of 0.1 in. (.3 mm) diameter or smaller, and capable of meeting demanding requirements for accuracy and ruggedness. This approach invoked the use of stateof- the-art processing techniques to install SOI sensor chips directly onto the probe body, thus eliminating redundancy in sensor packaging and probe installation that have historically forced larger probe size. This also facilitated a better thermal match between the chip and its mount, improving stability and accuracy. Further, the leadless sensor technology with which the SOI sensing element is fabricated allows direct mounting and electrical interconnecting of the sensor to the probe body. This leadless technology allowed a rugged wire-out approach that is performed at the sensor length scale, thus achieving substantial sensor size reductions. The technology is inherently capable of high-frequency and high-accuracy performance in high temperatures and harsh environments.
The Film-Evaporation MEMS Tunable Array (FEMTA) concept for propulsion and thermal control of picosats exploits microscale surface tension effect in conjunction with temperature- dependent vapor pressure to realize compact, tunable and low-power thermal valving system. The FEMTA is intended to be a self-contained propulsion unit requiring only a low-voltage DC power source to operate. The microfabricated thermal valving and very-high-integration level enables fast high-capacity cooling and high-resolution, low-power micropropulsion for picosats that is superior to existing smallsat micropropulsion and thermal management alternatives.
This paper discusses the effect of ionizing radiation on two types of deformable MEMS mirrors.
A survey and evaluation of MEMS-based microvalves has been conducted to assess the applicability of this valve technology for propulsion applications on future microspacecraft.
This guideline was developed as an aid to help in the understanding of Microelectromechanical Systems (MEMS) reliability and to facilitate the insertion of this technology into high reliability applications. Modeled after the GaAs MMIC Reliability Assurance Guideline for Space Applications by Kayali, et al., is was felt that a guideline would be more advantageous to people than a strict specification.
Short Overview of MEMS based high-temperature seismometer.
A microelectromechanical system (MEMS) device can be used for quantitative mechanical testing of materials within a controlled (chemical and temperature) environment, with the ability for electrochemical control to the specimen, that is coupled with a complimentary in-situ characterization technique.
An integrated-optics MEMS-actuated beam-steering system is disclosed, wherein the beam-steering system includes a lens and a programmable vertical coupler array having a switching network and an array of vertical couplers, where the switching network can energize of the vertical couplers such that it efficiently emits the light into free-space. The lens collimates the light received from the energized vertical coupler and directs the output beam along a propagation direction determined by the position of the energized vertical coupler within the vertical-coupler array. In some embodiments, the vertical coupler is configured to correct an aberration of the lens. In some embodiments, more than one vertical coupler can be energized to enable steering of multiple output beams. In some embodiments, the switching network is non-blocking.
A microelectromechanical systems (MEMS)-tunable optical ring resonator is described herein. The ring resonator includes a resonator ring and a tuner ring, along with one or more springs. The springs may be internal or external, i.e., either within or outside the areal footprint of the resonator ring and the tuner ring. The one or more springs are configured to displace the tuner ring from the resonator ring by a desired gap based upon a desired resonant wavelength of the resonator ring. Tuning is implemented by applying a voltage to the ring resonator, with motion of the tuner ring causing a corresponding change in the effective index of the resonator ring. As the ring resonator is essentially a capacitive device, it draws very little power once tuning is achieved.
An integrated-optics MEMS-actuated beam-steering system is disclosed, wherein the beam-steering system includes a lens and a programmable vertical coupler array having a switching network and an array of vertical couplers, where the switching network can energize of the vertical couplers such that it efficiently emits the light into free-space. The lens collimates the light received from the energized vertical coupler and directs the output beam along a propagation direction determined by the position of the energized vertical coupler within the vertical-coupler array. In some embodiments, the vertical coupler is configured to correct an aberration of the lens. In some embodiments, more than one vertical coupler can be energized to enable steering of multiple output beams. In some embodiments, the switching network is non-blocking.