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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

NASA Tech Briefs, June 2010

Topics covered include: Situational Awareness from a Low-Cost Camera System; Data Acquisition System for Multi-Frequency Radar Flight Operations Preparation; Mercury Toolset for Spatiotemporal Metadata; Social Tagging of Mission Data; Integrating Radar Image Data with Google Maps; Demonstration of a Submillimeter-Wave HEMT Oscillator Module at 330 GHz; Flexible Peripheral Component Interconnect Input/Output Card; Interface Supports Lightweight Subsystem Routing for Flight Applications; MMIC Amplifiers and Wafer Probes for 350 to 500 GHz; Public Risk Assessment Program; Particle Swarm Optimization Toolbox; Telescience Support Center Data System Software; Update on PISCES; Ground and Space Radar Volume Matching and Comparison Software; Web-Based Interface for Command and Control of Network Sensors; Orbit Determination Toolbox; Distributed Observer Network; Computer-Automated Evolution of Spacecraft X-Band Antennas; Practical Loop-Shaping Design of Feedback Control Systems; Fully Printed High-Frequency Phased-Array Antenna on Flexible Substrate; Formula for the Removal and Remediation of Polychlorinated Biphenyls in Painted Structures; Integrated Solar Concentrator and Shielded Radiator; Water Membrane Evaporator; Modeling of Failure for Analysis of Triaxial Braided Carbon Fiber Composites; Catalyst for Carbon Monoxide Oxidation; Titanium Hydroxide - a Volatile Species at High Temperature; Selective Functionalization of Carbon Nanotubes: Part II; Steerable Hopping Six-Legged Robot; Launchable and Retrievable Tetherobot; Hybrid Heat Exchangers; Orbital Winch for High-Strength, Space-Survivable Tethers; Parameterized Linear Longitudinal Airship Model; and Physics of Life: A Model for Non-Newtonian Properties of Living Systems.

Source record↗
NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗
DOE OSTI2021

Toward Performance Portable Programming for Heterogeneous System-on-Chips: Case Study with Qualcomm Snapdragon SoC

Future heterogeneous Domain-Specific System-on-Chips (DSSoC) will be extraordinarily complex in terms of processors, memory hierarchies, and interconnection networks.To manage this complexity, architects, system software designers, and application developers need programming technologies that are flexible, accurate, efficient, and productive. These technologies will need to be as independent of any one specific architecture as is practical, because the sheer dimensionality and scale of the complexity will not allow porting and optimizing applications foreach given DSSoC. To address these issues, we are developing Cosmic Castle, a performance portable programming toolchain for streaming applications on heterogeneous architectures. The primary focus of Cosmic Castle is on enabling efficient and performant code generation through the smart compiler and intelligent runtime system. This paper presents the preliminary evaluation of our ongoing work toward Cosmic Castle. Specifically, we detail our code porting efforts and evaluate various benchmarks on the Qualcomm Snapdragon SoC using tools developed through Cosmic Castle.

Cabrera, Anthony↗
NASA NTRS2010

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗
NASA NTRS2008

Initial Performance Results on IBM POWER6

The POWER5+ processor has a faster memory bus than that of the previous generation POWER5 processor (533 MHz vs. 400 MHz), but the measured per-core memory bandwidth of the latter is better than that of the former (5.7 GB/s vs. 4.3 GB/s). The reason for this is that in the POWER5+, the two cores on the chip share the L2 cache, L3 cache and memory bus. The memory controller is also on the chip and is shared by the two cores. This serializes the path to memory. For consistently good performance on a wide range of applications, the performance of the processor, the memory subsystem, and the interconnects (both latency and bandwidth) should be balanced. Recognizing this, IBM has designed the Power6 processor so as to avoid the bottlenecks due to the L2 cache, memory controller and buffer chips of the POWER5+. Unlike the POWER5+, each core in the POWER6 has its own L2 cache (4 MB - double that of the Power5+), memory controller and buffer chips. Each core in the POWER6 runs at 4.7 GHz instead of 1.9 GHz in POWER5+. In this paper, we evaluate the performance of a dual-core Power6 based IBM p6-570 system, and we compare its performance with that of a dual-core Power5+ based IBM p575+ system. In this evaluation, we have used the High- Performance Computing Challenge (HPCC) benchmarks, NAS Parallel Benchmarks (NPB), and four real-world applications--three from computational fluid dynamics and one from climate modeling.

Saini, Subbash↗
NASA NTRS2004

Power Actuation and Switching Module Development

The Deep Space Avionics (DSA) Project is developing a Power Actuation and Switching Module (PASM). This component enables a modular and scalable design approach for power switching applications, which can result in a wide variety of power switching architectures using this simple building block. The PASM is designed to provide most of the necessary power switching functions of spacecraft for various Deep Space missions including future missions to Mars, comets, Jupiter and its moons. It is fabricated using an A SIC process that is tolerant of high radiation. The development includes two application specific integrated circuits (ASICs) and support circuitry all packaged using High Density Interconnect (HDI) technology. It can be operated in series or parallel with other PASMs, It can be used as a high-side or low-side switch and it can drive thruster valves, pyrotechnic devices such as NASA standard initiators, bus shunt resistors, and regular spacecraft component loads. Each PASM contains two independent switches with internal current limiting and over-current trip-off functions to protect the power subsystem from load faults. During turnon and turnoff each switch can limit the rate of current change (di/dt) to a value determined by the user. Threeway majority-voted On/Off commandability and full switch status telemetry (both analog and digital) are built into the module. This paper describes the development process used to design, model, fabricate, and test these compact and versatile power switches. Preliminary test results from prototype HDI PASM hardware are also discussed.

Power Actuation and Switching Module (PASM)↗
DOE OSTI2022

Advanced Power-Hardware-in-the-Loop Evaluation of Inverter-Based Resources (IBRs)

Power-hardware-in-the-loop evaluation of IBRs has become more and more important as it provides reliable testing results to investigate the real responses of inverters with interconnected systems. A successful laboratory PHIL testing gives confidence of the hardware system to be deployed and de-risk technology integration prior to field deployment. So far, there are two important applications for PHIL evaluation: (1) test stability and functionality of large utility inverters into the system when it interconnects to the distribution systems/microgrids; and (2) test the collective grid service that inverters can provide to the grid. For the first application, the PHIL evaluation has high requirements for the stability and accuracy of the PHIL interface as the close-loop in digital real time simulator (DRTS) should replicate the actual current and voltage dynamics in the inverter. This is challenging because of the delays, sensing errors, nonlinearities of inverters, and hardware bandwidth limitations of the elements in the HIL loop. For the second application, multiple inverters will be tested resulting in multiple PCCs, which naturally causes competing dynamics and oscillations among hardware inverters if traditional PHIL interface is used. Therefore, new PHIL interface should be developed to compromise between stability and accuracy and represent the dispatched grid services for the hardware inverters. In this presentation, we will share our latest work in developing PHIL interface in these two applications to address the two key challenges.

DERMS↗
DOE OSTI2021

GMLC Survey of Distributed Energy Resource Interconnection and Interoperability Standards

This document reports on the Grid Modernization Laboratory Consortium effort to identify gaps in standards for the interconnection and interoperability of distributed energy resources (DERs). The project extended a 3-year period from 2017 to 2019. Under the work plan, the team identified standards and test procedures related to interconnection and interoperability, grouped under the broad headings of their primary applicable technology domain: automotive, responsive loads, photovoltaic inverters, inverter-based energy storage, machine-based DERs, and microgrids. The team then conducted a gap analysis by comparing the current standards to the expected future requirements needed for specific grid services. Overall, gaps could be any activity needed to harmonize requirements among standards development organizations, minimize conflicting requirements among technology domains, or streamline conformance test procedures.

24 POWER TRANSMISSION AND DISTRIBUTION↗
NASA NTRS1995

Constructing Scientific Applications from Heterogeneous Resources

A new model for high-performance scientific applications in which such applications are implemented as heterogeneous distributed programs or, equivalently, meta-computations, is investigated. The specific focus of this grant was a collaborative effort with researchers at NASA and the University of Toledo to test and improve Schooner, a software interconnection system, and to explore the benefits of increased user interaction with existing scientific applications.

Schichting, Richard D.↗
DOE OSTI2025

CERF: IM3 Projected Western US Power Plant Locations

Overview The Capacity Expansion Regional Feasibility (CERF) model is an open-source geospatial python package that provides new power plant locations at a 1km resolution. The model ingests U.S. state or regional-scale electricity system capacity expansion plans, such as those produced by the Global Change Analysis Model (GCAM-USA), and identifies feasible, site-specific locations for individual new power plants (renewable and non-renewable). CERF combines high-resolution geospatial suitability analyses with an economic algorithm that selects individual plant siting locations based on grid interconnection costs and the locational marginal value of new generation. The model incorporates a wide range of dynamic constraints and opportunities, such as protected lands, population density, existing infrastructure, and water availability. This dataset provides CERF power plant siting results for IM3 Phase 2 simulations across eight different scenarios for the Western US through 2055. The scenarios include combinations of two Shared Socioeconomic Pathways (SSP3 and SSP5) with four high-resolution climate projections specific to the United States (see, https://tgw-data.msdlive.org/). These climate projections include "hotter" and "cooler" variants for two Representative Concentration Pathways (RCP4.5 and RCP8.5). The resulting eight simulations are: rcp45cooler_ssp3 rcp45cooler_ssp5 rcp45hotter_ssp3 rcp45hotter_ssp5 rcp85cooler_ssp3 rcp85cooler_ssp5 rcp85hotter_ssp3 rcp85hotter_ssp5 CERF siting results in this dataset correspond to capacity expansion plans in the GCAM-USA IM3 Phase 2 simulation data and are available for each of the above scenarios. Data Details Temporal Range: 2015-2055 in 5-year timesteps. Note that 2015 is the experiment base year and 2020 and beyond represent model simulation years. Spatial Range: Plant locations are provided for the eleven states in the Western US including Arizona, California, Colorado, Idaho, Montana, New Mexico, Nevada, Oregon, Utah, Washington, and Wyoming. Spatial Resolution: 1 km-squared, provided in x and y coordinates Geospatial Projection: Albers Equal Area Conic (ESRI:102003) File Type: csv The dataset contains subdirectories for each of the eight scenarios described in the overview. Each scenario folder contains two subfolders with the following information: 1. Power Plant Data This directory contains a single .csv file of power plant locations for both pre-existing (non-CERF sited plants in operation in 2015) and new (CERF-sited) power plants across the temporal range along with additional CERF model output parameters for CERF-sited plants. Plant with a siting year earlier than 2020 correspond to facilities that are operational leading into the first timestep CERF simulation. For a more detailed description of CERF model output parameters, see the CERF model documentation. Note that the cerf_plant_id parameter is unique within each scenario file but not across scenario files. Parameter Descriptions scenario - Name of scenario cerf_plant_id - Unique siting identifier cerf_sited - If True, indicates that plant was sited by CERF model. If False, indicates pre-existing facility region_name - Name of region (state) tech_id - Technology ID tech_name - Full generation technology name inclusive of cooling type (if applicable) and additional characteristics tech_simple - Simplified generation technology type unit_size_mw - Power plant unit size (MW) xcoord - X coordinate in the default CRS (meters) ycoord - Y coordinate in the default CRS (meters) index - Index position in the flattend 2D array buffer_in_km - Exclusion buffer around site (km) sited_year - Year of siting retirement_year - Year of retirement lmp_zone - Locational marginal price (LMP) zone ID locational_marginal_price_usd_per_mwh - Locational marginal price ($/MWh) generation_mwh_per_year - Generation output (MWh/yr) operating_cost_usd_per_year - Cost of plant operations ($/yr) net_operational_value - Net operational value based on LMP and and operating costs ($/yr) interconnection_cost - Cost of interconnection for transmission & gas pipeline (if applicable) net_locational_cost -- Difference of interconnection cost and operating value ($/yr) capacity_factor_fraction - Capacity factor (fraction) carbon_capture_rate_fraction - Carbon capture rate (fraction) fuel_co2_content_tons_per_btu - Fuel CO2 content (tons/Btu) fuel_price_usd_per_mmbtu - Fuel price ($/MMBtu) fuel_price_esc_rate_fraction - Fuel price escalation rate (fraction) heat_rate_btu_per_kWh - Heat rate (Btu/kWh) lifetime_yrs - Technology lifetime for annuity (years) operational_life_yrs - Operational lifetime for retirement (years) variable_om_usd_per_mwh - Variable operation and maintenance costs of yearly capacity use ($/MWh) variable_om_esc_rate_fraction - Variable operation and maintenance costs escalation rate (fraction) carbon_tax_usd_per_ton - Carbon tax ($/ton) carbon_tax_esc_rate_fraction - Carbon tax escalation rate (fraction) 2. Storage Data This directory contains information on new and pre-existing energy storage facilities operational in each timestep along with various storage operational parameters. The 2015 timestep provides pre-existing energy storage data and corresponds with facilities that are operational leading into the first model simulation timestep. Note that coordinates in the storage files correspond to the interconnection point on the grid (substation location), not individual energy storage locations. Energy storage is added in a cumulative process at each given interconnection point. That is, each individual file provides the total operational storage capacity interconnected to the specified substation for the given timestep, inclusive of previously installed storage at that location and new storage installed in that timestep at that location. Parameters scenario - Name of scenario timestep - Simulation timestep name - Unique storage identifier s_typ - Type of energy storage technology (battery or pumped storage hydro) s_node - Node ID of interconnecting substation xcoord - X coordinate in the default CRS (meters) ycoord - Y coordinate in the default CRS (meters) charge_rate - Maximum charge rate (power capacity) of storage system (MW) discharge_rate - Maximum discharge rate (power capacity) of storage system (MW) duration - Duration of storage system (hours) max_SoC - Allowed maximum state of charge (energy capacity) of storage system (MWh) min_SoC -Allowed minimum state of charge (energy capacity) of storage system (MWh) charge_eff - Efficiency of charge (fraction between 0 and 1) discharge_eff - Efficiency of discharge (fraction between 0 and 1) Acknowledgment IM3 is a multi-institutional effort led by Pacific Northwest National Laboratory and supported by the U.S. Department of Energy's Office of Science as part of research in MultiSector Dynamics, Earth and Environmental Systems Modeling Program.

CERF↗
NASA NTRS2001

Latency Hiding in Dynamic Partitioning and Load Balancing of Grid Computing Applications

The Information Power Grid (IPG) concept developed by NASA is aimed to provide a metacomputing platform for large-scale distributed computations, by hiding the intricacies of highly heterogeneous environment and yet maintaining adequate security. In this paper, we propose a latency-tolerant partitioning scheme that dynamically balances processor workloads on the.IPG, and minimizes data movement and runtime communication. By simulating an unsteady adaptive mesh application on a wide area network, we study the performance of our load balancer under the Globus environment. The number of IPG nodes, the number of processors per node, and the interconnected speeds are parameterized to derive conditions under which the IPG would be suitable for parallel distributed processing of such applications. Experimental results demonstrate that effective solution are achieved when the IPG nodes are connected by a high-speed asynchronous interconnection network.

Das, Sajal K.↗
NASA NTRS1993

Applications and development of communication models for the touchstone GAMMA and DELTA prototypes

The goal of this project was to develop models of the interconnection networks of the Intel iPSC/860 and DELTA multicomputers to guide the design of efficient algorithms for interprocessor communication in problems that commonly occur in CFD codes and other applications. Interprocessor communication costs of codes for message-passing architectures such as the iPSC/860 and DELTA significantly affect the level of performance that can be obtained from those machines. This project addressed several specific problems in the achievement of efficient communication on the Intel iPSC/860 hypercube and DELTA mesh. In particular, an efficient global processor synchronization algorithm was developed for the iPSC/860 and numerous broadcast algorithms were designed for the DELTA.

Seidel, Steven R.↗
DOE OSTI2022

Network Uncertainty Quantification for Analysis of Multi-Component Systems

To impact physical mechanical system design decisions and realize the full promise of high-fidelity computational tools, simulation results must be integrated at the earliest stages of the design process. This is particularly challenging when dealing with uncertainty and optimizing for system-level performance metrics, as full-system models (often notoriously expensive and time-consuming to develop) are generally required to propagate uncertainties to system-level quantities of interest. Methods for propagating parameter and boundary condition uncertainty in networks of interconnected components hold promise for enabling design under uncertainty in real-world applications. These methods avoid the need for time consuming mesh generation of full-system geometries when changes are made to components or subassemblies. Additionally, they explicitly tie full-system model predictions to component/subassembly validation data which is valuable for qualification. These methods work by leveraging the fact that many engineered systems are inherently modular, being comprised of a hierarchy of components and subassemblies that are individually modified or replaced to define new system designs. By doing so, these methods enable rapid model development and the incorporation of uncertainty quantification earlier in the design process. The resulting formulation of the uncertainty propagation problem is iterative. We express the system model as a network of interconnected component models, which exchange solution information at component boundaries. We present a pair of approaches for propagating uncertainty in this type of decomposed system and provide implementations in the form of an open-source software library. We demonstrate these tools on a variety of applications and demonstrate the impact of problem-specific details on the performance and accuracy of the resulting UQ analysis. This work represents the most comprehensive investigation of these network uncertainty propagation methods to date.

42 ENGINEERING↗
NASA NTRS1977

Preliminary design of a flight control system for a V/STOL airplane with geared variable pitch fans

A flight control system designed for an aircraft powered by three variable pitch fans, interconnected by shafts to provide lifting system redundancy is considered for application to a Navy Type A V/STOL aircraft with similar configurational features. The differences and similarities in the applications are discussed with emphasis on a design approach for safety in the event of failures in the propulsion and flight control systems. Differences in flying qualities and system design criteria are considered.

Gotleib, P.↗
NASA NTRS1979

Multilevel modeling of the space construction base

A mathematical model representing a flexible space vehicle in terms of interconnected discrete masses is recast into hierarchical form to facilitate the application of multilevel control techniques. The model's state equations are temporarily decoupled by utilization of a set of coordination equations. A hierarchical form of the model is constructed with the set of coordination equations at the top of the hierarchy and the set of decoupled scalar state equations in the bottom level.

Chichester, F. D.↗
NASA NTRS1981

Optical data transmission technology for fixed and drag-on STS payload umbilicals, volume 2

Optical data handling methods are studied as applicable to payload communications checkout and monitoring. Both payload umbilicals and interconnecting communication lines carrying payload data are examined for the following: (1) ground checkout requirements; (2) optical approach (technical survey of optical approaches, selection of optimum approach); (3) survey and select components; (4) compare with conventional approach; and (5) definition of follow on activity.

St.denis, R. W.↗
NASA NTRS1994

Open architectures for formal reasoning and deductive technologies for software development

The objective of this project is to develop an open architecture for formal reasoning systems. One goal is to provide a framework with a clear semantic basis for specification and instantiation of generic components; construction of complex systems by interconnecting components; and for making incremental improvements and tailoring to specific applications. Another goal is to develop methods for specifying component interfaces and interactions to facilitate use of existing and newly built systems as 'off the shelf' components, thus helping bridge the gap between producers and consumers of reasoning systems. In this report we summarize results in several areas: our data base of reasoning systems; a theory of binding structures; a theory of components of open systems; a framework for specifying components of open reasoning system; and an analysis of the integration of rewriting and linear arithmetic modules in Boyer-Moore using the above framework.

Mccarthy, John↗
NASA NTRS2000

Applications of SPICE for modeling miniaturized biomedical sensor systems

This paper proposes a model for a miniaturized signal conditioning system for biopotential and ion-selective electrode arrays. The system consists of three main components: sensors, interconnections, and signal conditioning chip. The model for this system is based on SPICE. Transmission-line based equivalent circuits are used to represent the sensors, lumped resistance-capacitance circuits describe the interconnections, and a model for the signal conditioning chip is extracted from its layout. A system for measurements of biopotentials and ionic activities can be miniaturized and optimized for cardiovascular applications based on the development of an integrated SPICE system model of its electrochemical, interconnection, and electronic components.

Microelectrodes↗