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At least 199 records · Page 11

Overview of the Design, Fabrication and Performance Requirements of Micro-Spec, an Integrated Submillimeter Spectrometer

Micro-Spec is a compact submillimeter (350-700 GHz) spectrometer which uses low loss superconducting niobium microstrip transmission lines and a single-crystal silicon dielectric to integrate all of the components of a grating-analog spectrometer onto a single chip. Here we present details of the fabrication and design of a prototype Micro-Spec spectrometer with resolution, R64, where we use a high-yield single-flip wafer bonding process to realize instrument components on a 0.45 m single-crystal silicon dielectric. We discuss some of the electromagnetic design concerns (such as loss, stray-light, cross-talk, and fabrication tolerances) for each of the spectrometer components and their integration into the instrument as a whole. These components include a slot antenna with a silicon lens for optical coupling, a phase delay transmission line network, parallel plate waveguide interference region, and aluminum microstrip transmission line kinetic inductance detectors with extremely low cross-talk and immunity to stray light. We have demonstrated this prototype spectrometer with design resolution of R64. Given the optical performance of this prototype, we will also discuss the extension of this design to higher resolutions suitable for balloon-flight.

spectrometer↗

Transition-Edge Hot-Electron Microbolometers for Millimeter and Submillimeter Astrophysics

The millimeter and the submillimeter wavelengths of the electromagnetic spectrum hold a wealth of information about the evolution of the universe. In particular, cosmic microwave background (CMB) radiation and its polarization carry the oldest information in the universe, and provide the best test of the inflationary paradigm available to astronomy today. Detecting gravity waves through their imprint on the CMB polarization would have extraordinary repercussions for cosmology and physics. A transition-edge hot-electron micro - bolometer (THM) consists of a superconducting bilayer transition-edge sensor (TES) with a thin-film absorber. Unlike traditional monolithic bolometers that make use of micromachined structures, the THM em ploys the decoupling between electrons and phonons at millikelvin temperatures to provide thermal isolation. The devices are fabricated photolithographically and are easily integrated with antennas via microstrip transmission lines, and with SQUID (superconducting quantum interference device) readouts. The small volume of the absorber and TES produces a short thermal time constant that facilitates rapid sky scanning. The THM consists of a thin-film metal absorber overlapping a superconducting TES. The absorber forms the termination of a superconducting microstripline that carries RF power from an antenna. The purpose of forming a separate absorber and TES is to allow flexibility in the optimization of the two components. In particular, the absorbing film's impedance can be chosen to match the antenna, while the TES impedance can be chosen to match to the readout SQUID amplifier. This scheme combines the advantages of the TES with the advantages of planar millimeter-wave transmission line circuits. Antenna-coupling to the detectors via planar transmission lines allows the detector dimensions to be much smaller than a wavelength, so the technique can be extended across the entire microwave, millimeter, and submillimeter wavelength ranges. The circuits are fabricated using standard microlithographic techniques and are compatible with uniform, large array formats. Unlike traditional monolithic bolometers that make use of micromachined structures, the THM employs the decoupling between electrons and phonons at millikelvin temperatures to provide thermal isolation. There is no fragile membrane in the structure for thermal isolation, which improves the fabrication yield.

Hsieh, Wen-Ting↗

Characterization of power delivery and losses in a long coaxial inner MITL

The long coaxial inner magnetically insulated transmission line (MITL) is considered as a possible transmission line to guide power to deep underground high yield fusion experiments. The considered dimensions are of order 10-15 meters in length, 60 cm radius, and 6 mm AK gap, with peak current 60 MA and peak pulse 100 ns. In designing such a MITL, the main concern is power loss due to low density plasmas being produced by high electric fields and temperatures. It is found that a 10m-long prototypical MITL is a viable design, with maximum current losses below 10% and temperature rise due to electron impact not exceeding 400°C, thereby avoiding thermal desorption of contaminants and the formation of low density plasmas.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Dispersion-Engineered Traveling Wave Kinetic Inductance Parametric Amplifier

A traveling wave kinetic inductance parametric amplifier comprises a superconducting transmission line and a dispersion control element. The transmission line can include periodic variations of its dimension along its length. The superconducting material can include a high normal state resistivity material. In some instances the high normal state resistivity material includes nitrogen and a metal selected from the group consisting of titanium, niobium and vanadium. The traveling wave kinetic inductance parametric amplifier is expected to exhibit a noise temperature below 100 mK/GHz.

Zmuidzinas, Jonas↗

Alternating Direction Decomposition with Strong Bounding and Convexification (ADDSBC) for Solving Security Constrained AC Unit Commitment Problems

This project aims to develop efficient and robust computational methods for solving the security-constrained unit commitment and alternating current optimal power flow problem (SC-UC-ACOPF). The SC-UC-ACOPF problem is at the center of the short-term operation of the U.S. Power Grid. It is solved every week, every day, and every 10 minutes to plan for the optimal action of electricity generation and consumption by minimizing the generation cost and maintaining power system reliability against potential disruptions of equipment failures. In mathematical terms, SC-UC-ACOPF is a challenging large-scale mixed-integer nonlinear optimization model. This means that the decisions involve both discrete variables, e.g. the turning on and off of generators and switching of transmission lines and transformers, and continuous decisions, e.g. the amount of energy generated by each generator and the power flows in the power grid. The physics of the power flow is described by nonlinear equations involving real and reactive power and bus voltages. Another key feature is the large number of contingencies, i.e. the system needs to stay reliable in face of failure of any one equipment, such as transmission lines and generators. The U.S. power grids are extremely complicated and large scale with more than 5,000 generators, 50,000 buses, and 100,000 high-voltage transmission lines, making the SC-UC-ACOPF a very large-scale computation challenge. The research developed in this project aims to solve the SC-UC-ACOPF problems in the three timescales, i.e. weekly, daily, and every 10-min. The proposed computational methods are built on a principled algorithmic approach of decomposition and penalization. More specifically, the algorithm develops spatial and temporal decomposition by exploiting the strong temporal coupling and weak spatial coupling of the UC problem and the complementary feature, i.e. weak temporal coupling and strong spatial coupling of the ACOPF problem. The algorithm also leverages recent progresses in strong convex relaxation of ACOPF. A unique feature of the proposed approach is that it generates a valid, global upper bound on the optimal maximum profit. In this way, a global optimality gap is available to measure the quality of the solution. To further speed up computation, the research team has developed a plethora of effective heuristics to strengthen the iterative penalty-based decomposition framework. For instance, a heuristic is developed to construct inner approximations of the time coupling constraints within the time decoupled problems. Contingencies are pre-screened and low-rank matrix computation is exploited to find the almost unique solution to each contingency. A novel heuristic for line switching is proposed and tested with positive impacts on instances where line switching is beneficial. Taking a systematic approach and carefully handling every detail of the problem pays off. The TIM-GO’s performance throughout the trials and the final event was stellar. TIM-GO garnered the second highest total prize money and is ranked in the top three positions across all categories of comparison.

97 MATHEMATICS AND COMPUTING↗

Issues concerning centralized versus decentralized power deployment

The results of a study of proposed lunar base architectures to identify issues concerning centralized and decentralized power system deployment options are presented. The power system consists of the energy producing system (power plant), the power conditioning components used to convert the generated power into the form desired for transmission, the transmission lines that conduct this power from the power sources to the loads, and the primary power conditioning hardware located at the user end. Three power system architectures, centralized, hybrid, and decentralized, were evaluated during the course of this study. Candidate power sources were characterized with respect to mass and radiator area. Two electrical models were created for each architecture to identify the preferred method of power transmission, dc or ac. Each model allowed the transmission voltage level to be varied at assess the impact on power system mass. The ac power system models also permitted the transmission line configurations and placements to determine the best conductor construction and installation location. Key parameters used to evaluate each configuration were power source and power conditioning component efficiencies, masses, and radiator areas; transmission line masses and operating temperatures; and total system mass.

Metcalf, Kenneth J.↗

Anomalous transport in discrete arcs and simulation of double layers in a model auroral circuit

The evolution and long-time stability of a double layer (DL) in a discrete auroral arc requires that the parallel current in the arc, which may be considered uniform at the source, be diverted within the arc to charge the flanks of the U-shaped double layer potential structure. A simple model is presented in which this current redistribution is effected by anomalous transport based on electrostatic lower hybrid waves driven by the flank structure itself. This process provides the limiting constraint on the double layer potential. The flank charging may be represented as that of a nonlinear transmission line. A simplified model circuit, in which the transmission line is represented by a nonlinear impedance in parallel with a variable resistor, is incorporated in a one-dimensional simulation model to give the current density at the DL boundaries. Results are presented for the scaling of the DL potential as a function of the width of the arc and the saturation efficiency of the lower hybrid instability mechanism.

Smith, Robert A.↗

Microrectenna: A Terahertz Antenna and Rectifier on a Chip

A microrectenna that would operate at a frequency of 2.5 THz has been designed and partially fabricated. The circuit is intended to be a prototype of an extremely compact device that could be used to convert radio-beamed power to DC to drive microdevices (see Figure 1). The microrectenna (see Figure 2) circuit consists of an antenna, a diode rectifier and a DC output port. The antenna consists of a twin slot array in a conducting ground plane (denoted the antenna ground plane) over an enclosed quarter-wavelength-thick resonant cavity (denoted the reflecting ground plane). The circuit also contains a planar high-frequency low-parasitic Schottky-barrier diode, a low-impedance microstrip transmission line, capacitors, and contact beam leads. The entire 3-D circuit is fabricated monolithically from a single GaAs wafer. The resonant cavity renders the slot radiation pattern unidirectional with a half-power beam width of about 65. A unique metal mesh on the rear of the wafer forms the backplate for the cavity but allows the GaAs to be wet etched from the rear surface of the twin slot antennas and ground plane. The beam leads protrude past the edge of the chip and are used both to mount the microrectenna and to make the DC electrical connection with external circuitry. The antenna ground plane and the components on top of it are formed on a 2- m thick GaAs membrane that is grown in the initial wafer MBE (molecular beam epitaxy) process. The side walls of the antenna cavity are not metal coated and, hence, would cause some loss of power; however, the relatively high permittivity (epsilon=13) of the GaAs keeps the cavity modes well confined, without the usual surface-wave losses associated with thick dielectric substrates. The Schottky-barrier diode has the usual submicron dimensions associated with THz operation and is formed in a mesa process above the antenna ground plane. The diode is connected at the midpoint of a microstrip transmission line, which is formed on 1- m-thick SiO (permittivity of 5) laid down on top of the GaAs membrane. The twin slots are fed in phase by this structure. To prevent radio-frequency (RF) leakage past the slot antennas, low-loss capacitors are integrated into the microstrip transmission line at the edges of the slots. The DC current- carrying lines extend from the outer edges of the capacitors, widen approaching the edges of the chip, and continue past the edges of the chip to become the beam leads used in tacking down the devices. The structure provides a self-contained RF to DC converter that works in the THz range.

Siegel, Peter↗

In-Line Optical Transmission Imaging of Decals for Quality Control - Task 3

Quality monitoring is a critical aspect for manufacturing systems. Ideally the monitoring would be done in-line, be non-contact, non-destructive, and fast. This would enable reduced scrap and higher throughput. This poster presents an optical transmission method for evaluating and mapping coatings. With the method shown in the poster we can visualize optical variations on the macro and micro scales. This allows us to see the overall trend in loading in both the cross web and down web directions. Furthermore, we can visualize defects such dewetting spots, streaks, clumps, and pinholes where there is a lack of coating. The optical transmission signal has been found to be proportional to the IrOx loading signal using XRF measurements. Therefore, an optical transmission setup can be installed in-line and allow for a fast, non-contact method for mapping loading variations and defects.

coating uniformity↗

Pulse Coupling for Laser Excitation

Tapered transmission line couples energy from magnetic switch to excimer laser. Transmission line provides constant impedance for pulses from switch and distributes pulses across length of laser as nearly uniform wave fronts. Allows smaller, more efficient magnetic core to be used in switch. Losses and circuit capacitance are less than for full-laser-width line and core.

Pacala, T. J.↗

Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/mm-wave integrated circuits on low resistivity Si wafers. However, the closely spaced transmission lines are susceptible to high levels of cross-coupling, which degrades the overall circuit performance. In this paper, theoretical and experimental results on coupling of Finite Ground Coplanar (FGC) waveguides embedded in polyimide layers are presented for the first time. These results show that FGC lines have approximately 8 dB lower coupling than coupled Coplanar Waveguides. Furthermore, it is shown that the forward and backward coupling characteristics for FGC lines do not resemble the coupling characteristics of other transmission lines such as microstrip.

Ponchak, George E.↗

Fabrication of Compact Superconducting Lowpass Filters for Ultrasensitive Detectors

It is extremely important for current and future far-infrared and sub-millimeter ultrasensitive detectors, which include transition edge sensors (TES) and microwave kinetic inductance detectors, to be adequately filtered from stray electromagnetic radiation in order to achieve their optimal performance. One means of filtering stray radiation is to block leakage associated with electrical connections in the detector environment. Here we discuss a fabrication methodology for realizing non-dissipative planar filters imbedded in the wall of the detector enclosure to limit wave propagation modes up to far-infrared frequencies. Our methodology consists of fabricating a boxed stripline transmission line, in which a superconducting (Nb, Mo, or Al) transmission line is encased in a silicon dioxide dielectric insulator coated with a metallic shell. We report on achieved attenuation and return loss and find that it replicates the simulated data to a high degree.

Brown, Ari↗

Low Loss, Finite Width Ground Plane, Thin Film Microstrip Lines on Si Wafers

Si RFICs on standard, 2 Omega-cm. Si wafers require novel transmission lines to reduce the loss caused by the resistive substrate. One such transmission line is commonly called Thin Film Microstrip (TFMS), which is created by depositing a metallic ground plane, thin insulating layers, and the microstrip lines on the Si wafer. Thus, the electric fields are isolated from the Si wafer. In this paper, it is shown through experimental results that the ground plane of TFMS may be finite width and comparable to the strip width in size while still achieving low loss on 2 Omega-cm Si. Measured effective permittivity shows that the field interaction with the Si wafer is small.

Ponchak, George E.↗

A Third Harmonic Voltage Injection Technique to Improve The Power Transmission Capacity

To facilitate the growing deployment of renewable energy sources and increasing load demand, it is imperative to increase the power transmission capacity of the existing transmission corridors. The available power uprating techniques are either costly, or require significant alteration to the existing system. Moreover, most of these techniques are suitable for long transmission lines. In light of these limitations, a third harmonic voltage injection based power uprating technique is proposed in this article. The proposed technique is economic, immune to line impedance unbalance, and is applicable for any length of transmission line. Most importantly, the technique needs very minimal modification in the existing system at the substation level. The efficacy of the proposed technique is validated through simulation and experiments.

Das, Anubrata↗

Miniaturized Wilkinson Power Dividers Utilizing Capacitive Loading

This letter reports the miniaturization of a planar Wilkinson power divider by capacitive loading of the quarter wave transmission lines employed in conventional Wilkinson power dividers. Reduction of the transmission line segments from lambda/4 to between lambda/5 and lambda/12 are reported here. The input and output lines at the three ports and the lines comprising the divider itself are coplanar waveguide (CPW) and asymmetric coplanar stripline (ACPS), respectively. The 10 GHZ power dividers are fabricated on high resistivity silicon (HRS) and alumina wafers. These miniaturized dividers are 74% smaller than conventional Wilkinson power dividers, and have a return loss better than +30 dB and an insertion loss less than 0.55 dB. Design equations and a discussion about the effect of parasitic reactance on the isolation are presented for the first time.

Scardelletti, Maximilian C.↗

Method of additively manufacturing an integrated circuit of an interconnect packaging structure

A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.

Papapolymerou, Ioannis↗

The effect of coupling line loss in microstrip to dielectric resonator coupling

The interaction between a dielectric resonator and a microstrip transmission line is fundamentally a field phenomenon. However, the model of Figure 1b widely is used to represent the arrangement in Figure 1a, and predicts the behavior encountered in practice. The microstrip line of length l = n(lambda)/4 between the input and coupling planes and the lambda/4 open-circuit stub usually is assumed to be lossless. This paper considers the effect of coupling line loss on the unloaded-Q and coupling coefficient beta of the combination. It shows that transmission line loss can cause the decrease in unloaded-Q that has been observed to occur with tight coupling, and limits the coupling coefficient to a much lower value than would be obtained with a lossless coupling line.

Hearn, C. P.↗