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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

Mechanical properties of 3C silicon carbide

The residual stress and Young's modulus of 3C silicon carbide (SiC) epitaxial films deposited on silicon substrates were measured by load-deflection measurements using suspended SiC diaphragms fabricated with silicon micromachining techniques. The film's residual stress was tensile and averaged 274 MPa while the in-plane Young's modulus averaged 394 GPa. In addition, the bending moment due to the residual stress variation through the thickness of the film was determined by measuring the deflection of free-standing 3C-SiC cantilever beams. The bending moment was in the range of 2.6 x 10 exp -8 -4.2 x 10 exp-8 N m.

Tong, Lijun↗
NASA NTRS1993

Electron-Tunneling Magnetometer

Electron-tunneling magnetometer is conceptual solid-state device operating at room temperature, yet offers sensitivity comparable to state-of-art magnetometers such as flux gates, search coils, and optically pumped magnetometers, with greatly reduced volume, power consumption, electronics requirements, and manufacturing cost. Micromachined from silicon wafer, and uses tunneling displacement transducer to detect magnetic forces on cantilever-supported current loop.

Kaiser, William J.↗
NASA NTRS1993

Techniques For Mass Production Of Tunneling Electrodes

Techniques for mass production of tunneling electrodes developed from silicon-micromachining, lithographic patterning, and related microfabrication processes. Tunneling electrodes named because electrons travel between them by quantum-mechanical tunneling; tunneling electrodes integral parts of tunneling transducer/sensors, which act in conjunction with feedback circuitry to stabilize tunneling currents by maintaining electrode separations of order of 10 Angstrom. Essential parts of scanning tunneling microscopes and related instruments, and used as force and position transducers in novel microscopic accelerometers and infrared detectors.

Kenny, Thomas W.↗
NASA NTRS1993

A Microseismometer for Terrestrial and Extraterrestrial Applications

The scientific and technical requirements of extraterrestrial seismology place severe demands on instrumentation. Performance in terms of sensitivity, stability, and frequency band must match that of the best terrestrial instruments, at a fraction of the size, mass, and power. In addition, this performance must be realized without operator intervention in harsh temperature, shock, and radiation environments. These constraints have forced us to examine some fundamental limits of accelerometer design in order to produce a small, rugged, sensitive seismometer. Silicon micromachined sensor technology offers techniques for the fabrication of monolithic, robust, compact, low-power and -mass accelerometers. However, currently available sensors offer inadequate sensitivity and bandwidth. Our implementation of an advanced silicon micro machined seismometer is based on principles developed at JPL for high-sensitivity position sensor technology. The use of silicon micro machining technology with these new principles should enable the fabrication of a 10(exp -11) g sensitivity seismometer with a bandwidth of at least 0.01 to 20 Hz. The low Q properties of pure single-crystal silicon are essential in order to minimize the Brownian thermal noise limitations generally characteristic of seismometers with small proof masses. A seismometer consists of a spring-supported proof mass and a transducer for measuring its motion. For long period motion a position sensor is generally used, for which the displacement is proportional to the ground acceleration. The mechanical sensitivity can be increased either by increasing the proof mass or decreasing the spring stiffness, neither of which is desirable for planetary applications. Our approach has been to use an ultra sensitive capacitive position sensor with a sensitivity of better than 10(exp -13) m/Hz(exp 1/2). This allows the use of a stiffer suspension and a smaller proof mass. We have built several prototypes using these principles, and tests show that these devices can exhibit performance comparable to state-of-the-art instruments.

Banerdt, W.↗
NASA NTRS1992

Space micro-guidance and control - Applications and architectures

The features and the components of a new microscale guidance, navigation, and control (GN&C) system for future space systems are discussed. An approach is described for the utilization of new microengineering technologies for achieving major reductions in the GN&C system's mass, size, power, and costs. The micro-GN&C system and the component concepts include microactuated adaptive optics, micromachined inertial sensors, fiberoptic data nets with light-power transmission, and VLSI microcomputers. The GN&C system will be applied in microspacecraft, microlanders, microrovers, remote sensing platforms, interferometers, and deployable reflectors.

Mettler, Edward↗
NASA NTRS1992

Electron tunnel sensors

We have used the extreme sensitivity of electron tunneling to variations in electrode separation to construct a novel, compact displacement transducer. Electrostatic forces are used to control the separation between the tunneling electrodes, thereby eliminating the need for piezoelectric actuators. The entire structure is composed of micromachined silicon single crystals. Applications of the tunneling displacement transducer to the measurement of acceleration and infrared signals are discussed. Measurements of acceleration and infrared sensitivity are reported.

Kenny, T. W.↗
NASA NTRS1992

Development of a hydrogen gas sensor using microfabrication technology

Microfabrication and micromachining technologies are used to produce a hydrogen gas sensor based on a palladium-silver film. The sensor uses a heater that is fabricated by diffusing p-type borones into the substrate, forming a resistance heater. A diode for temperature measurement is produced using p-type boron and n-type phosphor diffused into the substrate. A thickness of the palladium-silver film is approximately 300 arcsec. The hydrogen gas sensor employs the proven palladium-silver diode structure and is surrounded by a phosphor doped resistance heater which can be heated up to a temperature of 250 C. Experimental results show that the sensor is capable of operating over a wide range of hydrogen concentration levels between 0-95 percent without any hysteresis effects.

Liu, Chung-Chiun↗
NASA NTRS1993

Fabrication of high-quality superconductor-insulator-superconductor junctions on thin SiN membranes

We have successfully fabricated high-quality and high-current density superconductor-insulator-superconductor (SIS) junctions on freestanding thin silicon nitride (SIN) membranes. These devices can be used in a novel millimeter-wave and THz receiver system which is made using micromachining. The SIS junctions with planar antennas were fabricated first on a silicon wafer covered with a SiN membrane, the Si wafer underneath was then etched away using an anisotropic KOH etchant. The current-voltage characteristics of the SIS junctions remained unchanged after the whole process, and the junctions and the membrane survived thermal cycling.

Garcia, Edouard↗
NASA NTRS1994

Making Rectangular Apertures In Silicon

Conventional silicon micromachining techniques produce micrometer-sized rectangular apertures. Used to define source and detector openings for measurements of images and scattered light in visible, ultraviolet, and soft x-ray wavelength regions, and as general-purpose optical slits or slit arrays. Rectangular microscopic apertures replace circular pinholes made by puncturing foils with needles or by drilling foils with intense, highly-focused laser beams. Precise photolithography yields apertures of superior geometry.

Leviton, Douglas B.↗
NASA NTRS1994

Dual-Element Tunneling Accelerometer

Improved micromachined tunneling accelerometer contains two deflecting transducer elements: One an elastically supported proof mass having relatively low resonant frequency; other cantilever tunneling transducer that tracks displacement of proof mass and has relatively high resonant frequency ({sup a} 10 kHz). Deflection voltage generated by circuit like described in "Wideband Feedback Circuit for Tunneling Sensor" (NPO-18866). Accelerometers of this type suited for underwater acoustic measurements, detecting vibrations associated with malfunctions in vehicles, detecting seismic signals, monitoring and controlling vibrations in structures, and other applications.

Kaiser, William J.↗
NASA NTRS1993

Microactuator production via high aspect ratio, high edge acuity metal fabrication technology

LIGA is a procession sequence which uses x-ray lithography on photoresist layers of several hundred micrometers to produce very high edge acuity photopolymer molds. These plastic molds can be converted to metal molds via electroplating of many different metals and alloys. The end results are high edge acuity metal parts with large structural heights. The LIGA process as originally described by W. Ehrfeld can be extended by adding a surface micromachining phase to produce precision metal parts which can be assembled to form three-dimensional micromechanisms. This process, SLIGA, has been used to fabricate a dynamometer on a chip. The instrument has been fully implemented and will be applied to tribology issues, speed-torque characterization of planar magnetic micromotors and a new family of sensors.

Guckel, H.↗
NASA NTRS1993

Imaging spectrometry of the Earth and other solar system bodies

Imaging spectrometry is a relatively new tool for remote sensing of the Earth and other bodies of the solar system. The technique dates back to the late 1970's and early 1980's. It is a natural extension of the earlier multi-spectral imagers developed for remote sensing that acquire images in a few, usually broad spectral bands. Imaging spectrometers combine aspects of classical spectrometers and imaging systems, making it possible to acquire literally hundreds of images of an object, each image in a separate, narrow spectral band. It is thus possible to perform spectroscopy on a pixel-by-pixel basis with the data acquired with an imaging spectrometer. Two imaging spectrometers have flown in space and several others are planned for future Earth and planetary missions. The French-built Phobos Infrared Spectrometer (ISM) was part of the payload of the Soviet Mars mission in 1988, and the JPL-built Near Infrared Mapping Spectrometer (NIMS) is currently en route to Jupiter aboard the Galileo spacecraft. Several airborne imaging spectrometers have been built in the past decade including the JPL-built Airborne Visible/Infrared Imaging Spectrometer (AVIRIS) which is the only such sensor that covers the full solar reflected portion of the spectrum in narrow, contiguous spectral bands. NASA plans two imaging spectrometers for its Earth Observing System, the Moderate and the High Resolution Imaging Spectrometers (MODIS and HIRIS). A brief overview of the applications of imaging spectrometry to Earth science will be presented to illustrate the value of the tool to remote sensing and indicate the types of measurements that are required. The system design for AVIRS and a planetary imaging spectrometer will be presented to illustrate the engineering considerations and challenges that must be met in building such instruments. Several key sensor technology areas will be discussed in which miniaturization and/or enhanced performance through micromachining and nanofabrication may allow smaller, more robust, and more capable imaging spectrometers to be built in the future.

Vane, Gregg↗
NASA NTRS1993

Macro, mini, micro and nano (M(sup 3)N) technologies for the future

Microelectromechanical systems (MEMS), micro systems technologies (MST), and micromanufacturing are relatively recent phrases or acronyms that have become synonymous with the design, development, and manufacture of 'micro' devices and systems. Micromanufacturing encompasses MEMS or MST and, in addition, includes all of the processes involved in the production of micro things. Integration of mechanical and electrical components, including built-in computers, can be formed into systems which must be connected to the macroworld. Macro, mini, micro, and nano technologies are all a part of MEMS or micromanufacturing. At this point in the development of the technology, it is becoming apparent that mini systems, with micro components, could very well be the economic drivers of the technology for the foreseeable future. Initial research in the fabrication of microdevices using IC processing technology took place over thirty years ago. Anisotropic etching of silicon was used to produce piezoresistive diaphragms. Since the early 60's, there has been gradual progress in MEMS until the early 1980's when worldwide interest in the technology really started to develop. During this time high aspect ratio micromachining using x rays was started in Germany. In 1987 the concept of a 'silicon micromechanics foundry' was proposed. Since then the interest in the U.S., Germany, and Japan has increased to the point where hundreds of millions of dollars of research monies are being funneled into the technology (at least in Germany and Japan) and the technology has been classified as critical or as a technology or national importance by the U.S. government.

Friedrich, Craig R.↗
NASA NTRS1993

Micro guidance and control synthesis: New components, architectures, and capabilities

New GN&C (guidance, navigation and control) system capabilities are shown to arise from component innovations that involve the synergistic use of microminiature sensors and actuators, microelectronics, and fiber optics. Micro-GN&C system and component concepts are defined that include micro-actuated adaptive optics, micromachined inertial sensors, fiber-optic data nets and light-power transmission, and VLSI microcomputers. The thesis is advanced that these micro-miniaturization products are capable of having a revolutionary impact on space missions and systems, and that GN&C is the pathfinder micro-technology application that can bring that about.

Mettler, Edward↗
NASA NTRS1994

Second International Symposium on Magnetic Suspension Technology, part 1

In order to examine the state of technology of all areas of magnetic suspension and to review related recent developments in sensors and controls approaches, superconducting magnet technology, and design/implementation practices, the Second International Symposium on Magnetic Suspension Technology was held. The symposium included 18 technical sessions in which 44 papers were presented. The technical sessions covered the areas of bearings, bearing modeling, controls, vibration isolation, micromachines, superconductivity, wind tunnel magnetic suspension systems, magnetically levitated trains (MAGLEV), rotating machinery and energy storage, and applications. A list of attendees appears at the end of the document.

Groom, Nelson J.↗
NASA NTRS1994

Second International Symposium on Magnetic Suspension Technology, part 2

In order to examine the state of technology of all areas of magnetic suspension and to review related recent developments in sensors and controls approaches, superconducting magnet technology, and design/implementation practices, the 2nd International Symposium on Magnetic Suspension Technology was held at the Westin Hotel in Seattle, WA, on 11-13 Aug. 1993. The symposium included 18 technical sessions in which 44 papers were presented. The technical sessions covered the areas of bearings, bearing modelling, controls, vibration isolation, micromachines, superconductivity, wind tunnel magnetic suspension systems, magnetically levitated trains (MAGLEV), rotating machinery and energy storage, and applications. A list of attendees appears at the end of the document.

Groom, Nelson J.↗
NASA NTRS1994

Planar rotational magnetic micromotors with integrated shaft encoder and magnetic rotor levitation

Deep x-ray lithography and electroplating may be combined to form a fabrication tool for micromechanical devices with large structural heights, to 500 micron, and extreme edge acuities, less than 0.1 micron-run-out per 100 micron of height. This process concept which originated in Germany as LIGA may be further extended by adding surface micromachining. This extension permits the fabrication of precision metal and plastic parts which may be assembled into three-dimensional micromechanical components and systems. The processing tool may be used to fabricate devices from ferromagnetic material such as nickel and nickel-iron alloys. These materials when properly heat treated exhibit acceptable magnetic behavior for current to flux conversion and marginal behavior for permanent magnet applications. The tool and materials have been tested via planar, magnetic, rotational micromotor fabrication. Three phase reluctance machines of the 6:4 configuration with 280 micron diameter rotors have been tested and analyzed. Stable rotational speeds to 34,000 rpm with output torques above 10 x 10(exp -9) N-m have been obtained. The behavior is monitored with integrated shaft encoders which are photodiodes which measure the rotor response. Magnetic levitation of the rotor via reluctance forces has been achieved and has reduced frictional torque losses to less than 1 percent of the available torque. The results indicate that high speed limits of these actuators are related to torque ripple. Hysteresis motors with magnetic bearings are under consideration and will produce high speed rotational machines with excellent sensor application potential.

Guckel, Henry↗
NASA NTRS1994

Development of microchannel plate x-ray optics

The goal of this research program was to develop a novel technique for focusing x-rays based on the optical system of a lobster's eye. A lobster eye employs many closely packed reflecting surfaces arranged within a spherical or cylindrical shell. These optics have two unique properties: they have unlimited fields of view and can be manufactured via replication of identical structures. Because the angular resolution is given by the ratio of the size of the individual optical elements to the focal length, optical elements with sizes on the order of one hundred microns are required to achieve good angular resolution with a compact telescope. We employed anisotropic etching of single crystal silicon wafers for the fabrication of micron-scale optical elements. This technique, commonly referred to as silicon micromachining, is based on silicon fabrication techniques developed by the microelectronics industry. An anisotropic etchant is a chemical which etches certain silicon crystal planes much more rapidly than others. Using wafers in which the slowly etched crystal planes are aligned perpendicularly to the wafer surface, it is possible to etch a pattern completely through a wafer with very little distortion. Our optics consist of rectangular pores etched completely through group of zone axes (110) oriented silicon wafers. The larger surfaces of the pores (the mirror elements) were aligned with the group of zone axes (111) planes of the crystal perpendicular to the wafer surface. We have succeeded in producing silicon lenses with a geometry suitable for 1-d focusing x-ray optics. These lenses have an aspect ratio (40:1) suitable for x-ray reflection and have very good optical surface alignment. We have developed a number of process refinements which improved the quality of the lens geometry and the repeatability of the etch process. A significant progress was made in obtaining good optical surface quality. The RMS roughness was decreased from 110 A for our initial lenses to 30 A in the final lenses. A further factor of three improvement in surface quality is required for the production of efficient x-ray optics. In addition to the silicon fabrication, an x-ray beam line was constructed at Columbia for testing the optics.

Kaaret, Philip↗