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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

An application of the square-root information filter to large scale linear interconnected systems

The paper considers the use of numerically stable square-root information filter (SRIF) algorithms to reduce the computation and storage requirements of a certain class of large-scale linear interconnected systems (multistation satellite tracking is examined as an example). The reductions are in comparison with conventional sequential covariance type formulations. To illustrate the SRIF algorithm: a 40 subsystem, 10 state problem, for example, has its storage requirements reduced by a full order of magnitude (from 84255 to 8100).

Bierman, G. J.↗
NASA NTRS1977

An application of the square root information filter to large scale linear interconnected systems

It is demonstrated that use of the square root information filter (SRIF) can reduce the storage and computation required for estimation of certain classes of large-scale interconnected systems. The SRIF uses an information array that is related to the Kalman filter covariance and estimate. The SRIF algorithm, which is optimal, is a direct application of matrix partitioning to some optimal filtering algorithms described in the literature. The SRIF algorithm is able to reduce the storage requirements of a 40-subsystem 10-state problem by a full order of magnitude.

Bierman, G. J.↗
NASA NTRS1978

Interconnecting conductively coated coverslides

The International Sun Earth Explorer-1 has the requirement that the entire outer surface of the spacecraft be conductive. A transparent coating of indium oxide was deposited for that reason on the satellite's solar cell coverglasses in order to give them a conductive surface, and the surfaces were interconnected to ground. This paper examines the interconnector attachment problem. On the ISEE-1, wires were bonded to the coverglasses by using a conductive epoxy; the resistance of these bonds increased dramatically with time. A program was initiated to find the functional cause of the resistance increase and to flight-qualify an alternative method of bonding. It was found the tests initiated were insufficient to find the cause of resistance increase and that an alternative solution of using indium solder is acceptable for bonding wires directly to indium oxide.

Gaddy, E. M.↗
NASA NTRS1980

Simulator results of an F-14A airplane utilizing an aileron-rudder interconnect during carrier approaches and landings

A piloted simulator study was conducted to evaluate an aileron rudder interconnect (ARI) control system for the F-14A airplane in the landing configuration. Effects on pilot performance and handling characteristics were investigated. Two ARI configurations were tested and compared to the standard F-14 fleet control system. A nonlinear aerodynamic model of the F-14 was used in conjunction with a six degree of freedom motion base simulator. The evaluation task, which utilized three subject pilots, consistent of a night carrier approach and landing. Both ARI configurations produced improved pilot performance and pilot ratings when compared to the standard control system. Sideslip due to adverse yaw as considerably reduced by the ARI systems and heading control was more stable and precise. Lateral deviation from centerline was reduced during the approach and lateral touchdown dispersion on the carrier deck was reduced with the ARI control systems.

Kelly, W. W.↗
NASA NTRS1982

Tab Interconnect Work Station

Second work station along solar-array assembly line automatically attaches two interconnect tabs to each silicon solar cell. Machine feeds, forms, and cuts tabs from reel of pretinned metal ribbon, transfers tabs into position, and solders them to cell.

Garwood, G.↗
NASA NTRS1981

Forming electrical interconnections through semiconductor wafers

An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

Anthony, T. R.↗
NASA NTRS1981

Limited evaluation of an F-14A airplane utilizing an aileron-rudder interconnect control system in the landing configuration

A flight test was conducted for preliminary evaluation of an aileron-rudder interconnect (ARI) control system for the F-14A airplane in the landing configuration. Two ARI configurations were tested in addition to the standard F-14 flight control system. Results of the flight test showed marked improvement in handling qualities when the ARI systems were used. Sideslip due to adverse yaw was considerably reduced, and airplane turn rate was more responsive to pilot lateral control inputs. Pilot comments substantiated the flight data and indicated that the ARI systems were superior to the standard control system in terms of pilot capability to make lateral offset corrections and heading changes on final approach.

Kelley, W. W.↗
NASA NTRS1981

An automated process sequence using preformed cell contacts and interconnects with a total cost of $0.64 per peak watt in 1986

A process sequence is described which utilizes a preformed metal mesh electrostatically bonded to each cell to provide the front contact. Cells of 12 percent AM1 efficiency have been produced using this scheme. This method also permits access to both contacts on the cell from the back side. In addition, low cost cell interconnection is accomplished using a flexible 'printed circuit' sheet which is ultrasonically bonded to the cell contacts. The complete process sequence as well as automated equipment which also uses ion implantation and pulse annealing is described. The total cost for module fabrication is estimated at $0.64 per peak watt for a 30 MW/year plant.

Armini, A. J.↗
NASA NTRS1982

Evaluation of electrode shape and nondestructive evaluation method for welded solar cell interconnects

Resistance welds of solar cell interconnect tabs were evaluated. Both copper-silver and silver-silver welds were made with various heat inputs and weld durations. Parallel gap and annular gap weld electrode designs were used. The welds were analyzed by light microscope, electron microprobe and scanning laser acoustic microscope. These analyses showed the size and shape of the weld, the relationship between the acoustic micrographs, the visible electrode footprint, and the effect of electrode misalignment. The effect of weld heat input on weld microstructure was also shown.

Baraona, C. R.↗
NASA NTRS1982

Development of technologies for welding interconnects to fifty-micron thick silicon solar cells

A program was conducted to develop technologies for welding interconnects to 50 microns thick, 2 by 2 cm solar cells. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 C to -180 C) were performed on 16 cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48 cell modules (one for each cell type) were assembled with 50 microns thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

Patterson, R. E.↗
NASA NTRS1983

Manipulator interactive design with interconnected flexible elements

This paper describes the development of an analysis tool for the interactive design of control systems for manipulators and similar electro-mechanical systems amenable to representation as structures in a topological chain. The chain consists of a series of elastic bodies subject to small deformations and arbitrary displacements. The bodies are connected by hinges which permit kinematic constraints, control, or relative motion with six degrees of freedom. The equations of motion for the chain configuration are derived via Kane's method, extended for application to interconnected flexible bodies with time-varying boundary conditions. A corresponding set of modal coordinates has been selected. The motion equations are imbedded within a simulation that transforms the vector-dyadic equations into scalar form for numerical integration. The simulation also includes a linear, time-invariant controler specified in transfer function format and a set of sensors and actuators that interface between the structure and controller. The simulation is driven by an interactive set-up program resulting in an easy-to-use analysis tool.

Singh, R. P.↗
NASA NTRS1983

Welding interconnects to 50-micron silicon solar cells

A program was conducted to develop technologies for welding interconnects to 50-micron thick, 2 by 2 cm solar cells obtained from three suppliers. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 deg to -180 deg C) were performed on 16-cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48-cell modules (one for each cell type) were assembled with 50-micron thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

Patterson, R. E.↗
NASA NTRS1985

Vector Lyapunov Functions for Stochastic Interconnected Systems

Theoretical paper presents set of sufficient conditions for asymptotic and exponential stability with probability 1 for class of stochastic interconnected systems. Theory applicable to complicated, large-scale mechanical or electrical systems, and, for several design problems, it reduces computational difficulty by relating stability criteria to fundamental structural features of system.

Boussalis, D.↗
NASA NTRS1984

Stuttgart Interconnection Network Project from PIX to NICS

The PIX follow-up project NICS is described. The purpose of PIX was access to X.25, the DATEX-P network of the Federal German Post Office. The development and implementation of higher protocols for levels 4-7 in the ISOSINN was the actual problem here. Results of the PIX project are given. NICS (Stuttgart Interconnection Network Project) is presented. International Protocols are reviewed. PAD service is described, which allows terminal access to DATEX-P network of the Federal German Post Office.

Source record↗
NASA NTRS1985

On the Interconnection of Incompatible Solid Finite Element Meshes Using Multipoint Constraints

Incompatible meshes, i.e., meshes that physically must have a common boundary, but do not necessarily have coincident grid points, can arise in the course of a finite element analysis. For example, two substructures may have been developed at different times for different purposes and it becomes necessary to interconnect the two models. A technique that uses only multipoint constraints, i.e., MPC cards (or MPCS cards in substructuring), is presented. Since the method uses only MPC's, the procedure may apply at any stage in an analysis; no prior planning or special data is necessary.

Fox, G. L.↗
NASA NTRS1985

Demonstrated results of welded and soldered interconnections

Solar cell modules with welded and soldered interconnections were constructed using a flexible substrate material. These modules were thermally cycled between approx. 80 deg C at rates 100 cycles/day to demonstrate survivability under simulated low Earth orbit (LEO) temperature conditions. The modules, cycled in an inert atmosphere, show durability for 36,000 cycles.

Hart, R. E., Jr.↗