Dataset From the CHIP Tool
An example result output from using CHIP.
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
SEARCH · Engineering Papers
Results for “Chip”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Performance and automatic calibration scheme of the waveform sampler in the ETROC2 ASIC chip
The waveform sampler in the CMS ETROC2 chip for LGAD gain aging monitoring is a 2.56-GS/s 12-bit 8x-Interleaved ADC that consists of a coarse SAR stage, and a fine stage. This architecture delivers high performance on a relatively modest 65 nm process, while requires finding up to 24 calibration constants through calibration. We developed an automatic calibration method using charge injection test data. After calibration, the baseline random error is reduced by a factor of 2.5–3 compared to the default calibration, and a 5% charge measurement precision is achieved in 15 fC charge injection tests.
Fu, Tao [Unlisted, US]↗
Robotic Assembly of Multi-Chip Modules Using Artificial Intelligence
With many properties of dark matter remaining a mystery, the OSCURA experiment aims to detect light dark matter particles using 1,536 Multi-Chip Modules (MCMs), containing a total of 24,576 skipper CCDs. Currently, each MCM is assembled by hand a time-consuming and error-prone process that can be automated. In this ongoing work, we present an automated assembly robot that leverages modern computer vision and artificial intelligence to assemble the OSCURA MCMs. This approach reduces cost, time, and error in the packaging of OSCURA sensors.
Arteaga, Matthew [Northern Illinois U.; Fermilab]↗
Radiation Effects on Network on Chips (NoC) Laboratory Directed Research and Development (LDRD) project
This project was motivated by State-of-the-Art (SOTA) technology that incorporates Network on Chips (NOC) for efficient data communication across the various computer kernels. For example, on the AMD Versal Field Programmable Gate Arrays (FPGA), an NoC has been incorporated for fast data communication from the programmable logic and other computer kernels (processing system, adaptable intelligence engines, etc.). The radiation effects on the legacy technology of this FPGA, such as the programmable logic, are well understood, and established methods exist to measure cross-sections when new families/generations are released; however, newly incorporated technologies, such as the NoC, are not fully understood and could introduce new failure points into the mission space.
36 MATERIALS SCIENCE↗
Digital Silicon Photomultiplier Chip Testing
Silicon Photomultipliers (SiPMs) are highly sensitive photodetectors. Traditional analog SiPMs require complex external readout electronics. Digital SiPMs (dSiPMs) include digital readout circuitry directly on-chip, offering superior timing resolution, reduced power consumption and compact size, pixel-level masking for active noise reduction. The primary objectives of this study are to, verify digital logic integrity of the shift registers used for controlling the pixel masking circuit, and determine the dark count rate of individual pixels as a function of bias voltage and clock frequency. I observe and explain behavior of the shift register and counting circuit.
Graham, Bennett [U. Chicago (main)]↗
Recycle Ga from E-Waste Containing GaN/GaAs Chips - American-Made E-Scrap Prize Voucher (CRADA Final Report)
Purdue University plans to use microorganisms to extract Ga from GaN/GaAs chips. This method is aimed at replacing traditional hydrometallurgy.
36 MATERIALS SCIENCE↗
Gage accurately controls force for placing chips on substrates
Device is developed to control the force used in manually placing chips on substrates. It controls the compression load between 2 small members at loads as low as 25 grams by means of a force control gage that is preset by varying the spring deflection.
Benzie, W. P.↗
Several types of chip formation in plastics machining
Fracture phenomena in plastics cutting - chip types, deformation of material, magnitude, and direction of cutting forces during cutting, and rheological effects on cutting mechanism
PLASTIC MATERIAL↗
Direct interconnection of uncased analog and digital silicon chips into a beam leaded matrix Final report, 1 Apr. 1966 - 30 Dec. 1967
Fabrication technique for direct interconnection of uncased silicon integrated circuit chips
Source record↗
Design and development of a high power, low saturation voltage, multi-chip silicon switching transistor Mid-term progress report
Encapsulation technique for multiple chip silicon switching transistors with silver-Teflon contacts
Stonebraker, E. R.↗
A method for separating a semiconductor wafer into individual chips
Breaking of semiconductor single crystal wafer into chips
Litant, I.↗
Technique for producing bipolar and MOS field effect transistors on a single chip
Several cycles of photoetching, dopant deposition, and drive-in produce selectively-doped regions and semiconductor junctions within a single chip.
Gallagher, R. C.↗
Investigation into the combination of complementary MOS and complementary bipolar circuits on a monolithic silicon chip Final report
Combination of complementary MOS and complementary bipolar circuits on monolithic silicon chip
Cook, R.↗
Design and development of a high power, low saturation voltage, multi-chip silicon switching transistor Final progress report, period ending 19 Feb. 1970
Mechanical design modifications, processing, and test data for high power, low saturation voltage, multi-chip silicon switching transistor
Ferree, H. E.↗
Complementary MOS and bipolar make it together on a single chip
Complementary metal oxide semiconductor and bipolar transistors fabrication on same integrated circuit chip by C-squared technology
Cook, R.↗
Elemental abundances by instrumental activation analyses in chips from 27 lunar rocks
Instrumental activation analyses of abundances in lunar rock chips
Ehmann, W. D.↗
Flexible desk top computers using Large Scale Integration (L.S.I.) chips
Microprogrammable modular computer utilizing only seven different types of L.S.I. elements lowers manufacturing cost and improves reliability. Chips can be standarized and used to implement variable bit length computers.
Garett, H.↗
Development of chip passivated monolithic complementary MISFET circuits with beam leads
Fabrication method is described for alumina passivated silicon MISFET arrays. Technique involves total passivation beam-lead approach and provides completely sealed chip with double level interconnect capability. Refractory metal alloy is used to form interconnect system and obtain metal contacts that withstand temperatures of 873 K for short periods of time.
Ragonese, L. J.↗