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At least 1,801 records · Page 100

The potential impact of MMICs on future satellite communications: Executive summary

This Executive Summary presents the results of a 17-month study on the future trends and requirments for Monolithic Microwave Integrated circuits (MMIC) for space communication application. Specifically this report identifies potential space communication applications of MMICs, assesses the impact of MMIC on the classes of systems that were identified, determines the present status and probable 10-year growth in capability of required MMIC and competing technologies, identifies the applications most likely to benefit from further MMIC development, and presents recommendations for NASA development activities to address the needs of these applications.

Dunn, Vernon E.↗

Test aspects of the JPL Viterbi decoder

The generation of test vectors and design-for-test aspects of the Jet Propulsion Laboratory (JPL) Very Large Scale Integration (VLSI) Viterbi decoder chip is discussed. Each processor integrated circuit (IC) contains over 20,000 gates. To achieve a high degree of testability, a scan architecture is employed. The logic has been partitioned so that very few test vectors are required to test the entire chip. In addition, since several blocks of logic are replicated numerous times on this chip, test vectors need only be generated for each block, rather than for the entire circuit. These unique blocks of logic have been identified and test sets generated for them. The approach employed for testing was to use pseudo-exhaustive test vectors whenever feasible. That is, each cone of logid is tested exhaustively. Using this approach, no detailed logic design or fault model is required. All faults which modify the function of a block of combinational logic are detected, such as all irredundant single and multiple stuck-at faults.

Breuer, M. A.↗

Development of gallium arsenide high-speed, low-power serial parallel interface modules: Executive summary

Final report to NASA LeRC on the development of gallium arsenide (GaAS) high-speed, low power serial/parallel interface modules. The report discusses the development and test of a family of 16, 32 and 64 bit parallel to serial and serial to parallel integrated circuits using a self aligned gate MESFET technology developed at the Honeywell Sensors and Signal Processing Laboratory. Lab testing demonstrated 1.3 GHz clock rates at a power of 300 mW. This work was accomplished under contract number NAS3-24676.

Source record↗

Current distribution in a three-dimensional IC analyzed by a perturbation method. Part 1: A simple steady state theory

The steady state current distribution in a three dimensional integrated circuit is presented. A device physics approach, based on a perturbation method rather than an equivalent lumped circuit approach, is used. The perturbation method allows the various currents to be expressed in terms of elementary solutions which are solutions to very simple boundary value problems. A Simple Steady State Theory is the subtitle because the most obvious limitation of the present version of the analysis is that all depletion region boundary surfaces are treated as equipotential surfaces. This may be an adequate approximation in some applications but it is an obvious weakness in the theory when applied to latched states. Examples that illustrate the use of these analytical methods are not given because they will be presented in detail in the future.

Edmonds, Larry D.↗

Trapped radiation

The vulnerability of spacecraft materials and components to trapped radiation in aerospace environment is considered along with which orbits the radiation effects are most likely to occur. It seems that the effects on organic polymers are embrittlement, change of modulus and coefficient of expansion; on optics the effects are discoloration and distortion. The effects on integrated circuits are also listed.

Vampola, Alfred L.↗

Microwave characteristics of GaAs MMIC integratable optical detectors

Interdigitated photoconductive detectors were fabricated on microwave device structures, making them easily integratable with Monolithic Microwave Integrated Circuits (MMIC). Detector responsivity as high as 2.5 A/W and an external quantum efficiency of 3.81 were measured. Response speed was nearly independent of electrode geometry, and all detectors had usable response at frequencies to 6 GHz. A small signal model of the detectors based on microwave measurements was also developed.

Claspy, Paul C.↗

CMOS Process Monitor

A CMOS Process Monitor, consisting of eight basic test structures, has been prepared to acquire key CMOS parameters to assist in VLSI wafer acceptance. The test structures can be probed using a 2 by N probe pad array and can be arranged to fit into either the interior or the scribe lane of an integrated circuit chip. In order to facilitate the general use of the monitor, a document is being prepared that describes its design, layout, measurement, and analysis. This paper describes the structures included in the monitor, the methodology used to create the monitor, and test results from the monitor.

Buehler, M. G.↗

Comb/serpentine/cross-bridge test structure for fabrication process evaluation

The comb/serpentine/cross-bridge structure was developed to monitor and evaluate same layer shorts and step coverage problems (open and high-resistance wire over steps) for integrated circuit fabrication processes. The cross-bridge provides local measurements of wire sheet resistance and wirewidth. These local parametric measurements are used in the analysis of the serpentine wire, which identifies step coverage problems. The comb/serpentine/cross-bridge structure was fabricated with 3 microns CMOS/bulk p-well process and tested using a computer-controlled parametric test system.

Sayah, Hoshyar R.↗

Optically interconnected phased arrays

Phased-array antennas are required for many future NASA missions. They will provide agile electronic beam forming for communications and tracking in the range of 1 to 100 GHz. Such phased arrays are expected to use several hundred GaAs monolithic integrated circuits (MMICs) as transmitting and receiving elements. However, the interconnections of these elements by conventional coaxial cables and waveguides add weight, reduce flexibility, and increase electrical interference. Alternative interconnections based on optical fibers, optical processing, and holography are under evaluation as possible solutions. In this paper, the current status of these techniques is described. Since high-frequency optical components such as photodetectors, lasers, and modulators are key elements in these interconnections, their performance and limitations are discussed.

Bhasin, Kul B.↗

Submicron nickel-oxide-gold tunnel diode detectors for rectennas

The characteristics of a metal-oxide-metal (MOM) tunnel diode made of nickel, nickel-oxide, and gold, designed and fabricated by standard integrated circuit technology for use in FIR rectennas, are presented. The MOM tunnel diode was formed by overlapping a 0.8-micron-wide layer of 1000-A of nickel, which was oxidized to form a thin layer of nickel oxide, with a 1500 A-thick layer of gold. The dc current-voltage characteristics of the MOM diode showed that the current dependence on voltage was linear about zero bias up to a bias of about 70 mV. The maximum detection of a low-level signal (10-mV ac) was determined to be at a dc voltage of 70 mV across the MOM diode. The rectified output signal due to a chopped 10.6-micron CO2 laser incident upon the rectenna device was found to increase with dc bias, with a maximum value of 1000 nV for a junction bias of 100 mV at room temperature.

Hoofring, A. B.↗

Integrated Optoelectronic Interface

Proposed optoelectronic integrated-circuit device serves as "universal" or standard interface for transmission and reception of digital and analog signals in communication, data-processing, and control systems. Eliminates need for custom design of interface circuitry in sense that it embodies "master-chip" design easily adaptable to use with specific equipment. Includes directly modulated semiconductor laser to generate light signals for transmission along optical fiber; positive/intrinsic/negative, avalanche, or other photodiode to detect light signals received along another optical fiber;and driving, synchronizing, preamplifying, and signal-regenerating circuitry. Muliplexes electronic signals before transmission and/or demultiplexes electronic signals after reception.

Katz, Joseph↗

Interferometric Measurement Of Residual Stress

Stress averaged through thickness of plate measured nondestructively. Theory of elasticity combined with laser interferometric technique into technique for measurement of residual stresses in solid objects - usually in thin, nominally-flat plates. Measurements particularly useful in inspection of wafers of single-crystal silicon for making solar cells or integrated circuits, because stresses remaining after crystal-growing process cause buckling or fracture. Used to predict deflections of plates caused by known applied loads under specified boundary condition, or to infer applied loads that cause known deflections. Also used to relate known deflections to residual stresses equivalent to stresses produced by fictitious applied loads.

Danyluk, Steven↗

Programmable Direct-Memory-Access Controller

Proposed programmable direct-memory-access controller (DMAC) operates with computer systems of 32000 series, which have 32-bit data buses and use addresses of 24 (or potentially 32) bits. Controller functions with or without help of central processing unit (CPU) and starts itself. Includes such advanced features as ability to compare two blocks of memory for equality and to search block of memory for specific value. Made as single very-large-scale integrated-circuit chip.

Hendry, David F.↗

Lightweight, Thermally Conductive Composite Material

Aluminum reinforced with carbon fibers superior to copper in some respects. Lightweight composite material has high thermal conductivity. Consists of aluminum matrix containing graphite fibers, all oriented in same direction. Available as sheets, tubes, and bars. Thermal conductivity of composite along fibers rises above that of pure copper over substantial range of temperatures. Graphite/aluminum composite useful in variety of heat-transfer applications in which reduction of weight critical. Used to conduct heat in high-density, high-speed integrated-circuit packages for computers and in base plates for electronic equipment. Also used to carry heat away from leading edges of wings in high-speed airplanes.

Sharp, G. Richard↗

Simplified Correlator For Ranging Codes

Improved correlating subsystem of pseudorandom-code ranging system made possible by advent of fast, custom-made, very-large-scale integrated circuits. Performs far fewer arithmetical operations, contains much less specialized analog and digital circuitry, and used with large number of different codes.

Tausworthe, R. C.↗

Sampling Downconverter For Radio-Frequency Signals

Phase and delay errors reduced greatly. Proposed GaAs integrated-circuit for receiver of radio signals at gigahertz frequencies samples incoming signal in phase and in quadrature, digitizes it, and down-converts it to baseband in single step. Incorporates both digital and analog components in design offering improved stability, versatility, and sampling bandwidth. Eliminates need for several components found in conventional analog designs, including mixers, postmixer filters, and 90 degree phase shifter.

Thomas, J. B.↗

Temperature Dependence Of Single-Event Effects

Report describes experimental study of effects of temperature on vulnerability of integrated-circuit memories and other electronic logic devices to single-event effects - spurious bit flips or latch-up in logic state caused by impacts of energetic ions. Involved analysis of data on 14 different device types. In most cases examined, vulnerability to these effects increased or remain constant with temperature.

Coss, James R.↗

Failures Of CMOS Devices At Low Radiation-Dose Rates

Method for obtaining approximate failure-versus-dose-rate curves derived from experiments on failures of SGS 4007 complementary metal oxide/semiconductor (CMOS) integrated circuits irradiated by Co60 and Cs137 radioactive sources.

Goben, Charles A.↗

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