Robust Technique for Measuring and Simulating Silicon Wafer Quality Characteristics that Enable the Prediction of Solar Cell Electrical Performance of MEMC Silicon Wafer. Cooperative Research and Development Final Report, CRADA Number CRD-11-438
NREL and MEMC Electronic Materials are interested in developing a robust technique for monitoring material quality of mc-Si and mono-Si wafers -- a technique that can provide relevant data to accurately predict the performance of solar cells fabricated on them. Previous work, performed under two TSAs between NREL and MEMC, has established that dislocation clusters are the dominant performance-limiting factor in MEMC mc-Si solar cells. The work under this CRADA will go further in verifying these results on a larger data set, evaluate possibilities of faster method(s) for mapping dislocations in wafers/ingots, understanding dislocation generation during ingot casting, and helping MEMC to have an internal capability for basic characterization that will provide feedback needed for more accurate crystallization simulations. NREL has already developed dislocation mapping technique and developed a basic electronic model (called Network Model) that uses spatial distribution of dislocations to predict the cell performance. In this CRADA work, we will use these techniques to: (i) establish dislocation, grain size, and grain orientation distributions of the entire ingots (through appropriate DOE) and compare these with theoretical models developed by MEMC, (ii) determine concentrations of some relevant impurities in selected wafers, (iii) evaluate potential of using photoluminescence for dislocation mapping and identification of recombination centers, (iv) evaluate use of diode array analysis as a detailed characterization tool, and (v) establish dislocation mapping as a wafer-quality monitoring tool for commercial mc-Si production.