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At least 181 records · Page 10

Plasma Flow Reactor Investigation into Nucleation of Uranium Oxide on Silica Substrates to Better Understand Fallout Formation

Understanding particulate formation in nuclear debris is critical for predicting fallout transport after a nuclear event. Improved characterization of fallout formation and transport could lead to better guidance for emergency response in a post-detonation scenario. By analyzing how U-oxides nucleate onto different forms of SiO 2 (crystalline and amorphous), we can gain insight into how entrained environmental materials may incorporate into fallout. In this experiment a Plasma Flow Reactor (PFR), was used to replicate the high temperature and extreme flow conditions in a nuclear fireball. Uranyl nitrate was injected into the plasma, and PFR-generated Uranium oxides were allowed to condense onto amorphous (nanoparticles of varying sizes) or crystalline (quartz) SiO 2 substrates. SiO 2 substrates were characterized before and after U-oxide deposition using Scanning Electron Microscopy (SEM) based techniques (i.e. EDS) in order to characterize how U-oxides may nucleate onto these substrates. After a collection time of 4 minutes at an RF coil distance of 25cm, both the amorphous SiO 2 nanoparticles and the crystalline structures demonstrated dendritic nucleation of U-oxide species as identified by SEM/EDS.

54 ENVIRONMENTAL SCIENCES↗

Lithium Growth on Alloying Substrates and Effect on Volumetric Expansion

The widespread implementation of next-generation Li metal anodes is limited, in part, due to the formation of dendritic and/or mossy electrodeposits during cycling. These morphologies can lead to battery failure due to the formation of short circuits and significant volumetric expansion at the anode. One strategy to control the electrodeposition of Li metal is to use lithiophilic materials at the anode. Here, we evaluate the impact of Ag and Au on the early stages of Li metal electrodeposition and cycling. The alloying substrates decrease the voltage for Li reduction and improve Li wetting/adhesion. We probe volumetric expansion directly through dilatometry measurements and find that the degree of volumetric expansion is less when lithium is cycled on an alloying substrate compared to a non-alloying substrate (Cu). Dilatometry experiments reveal that Au has the least amount of volumetric expansion and coin cell cycling experiments indicate that Ag yields more stable cycling compared to Au or Cu. The evaluation of in situ cross-sectional images of cycled coin cells shows that Ag has the lowest volumetric expansion in a coin cell format.

alloys↗

Single-crystal semiconductor films grown on foreign substrates

Intermediate alloy formed between foreign substrates and semiconductor material enable the growth of single crystal semiconductor films on the alloy layer. The melted film must not ball up on the surface of the substrate and neither chemically react nor alloy with the intermediate alloy formed on the substrate.

Vohl, P.↗

In situ sputter cleaning of thin film metal substrates for UHV-TEM corrosion studies.

A prerequisite for conducting valid corrosion experiments by in situ electron microscopy techniques is not only the achievement of UHV background pressure conditions at the site of the specimen but also the ability to clean the surface of the thin metal substrate specimen before initiation of the corrosive interaction. A miniaturized simple ion gun has been constructed for this purpose. The gun is small enough to be incorporated into an UHV electron microscope specimen chamber with hot stage in such a way as to permit bombardment of the substrate specimen while observing it by transmission electron microscopy TEM. It is shown that the ion beam generated is confined well enough to cause a sputtering removal of substrate material at a rate of approximately 5-10 A/min and to prevent the sputter deposition of contaminating material from the specimen holder.

Heinemann, K.↗

Technique for producing 'good' GaAs solar cells using poor-quality substrates

Relatively good GaAs solar cells can be made from poor-quality substrates by making the junction deep (greater than 1 micron) instead of shallow and by 'leaching' both the pGaAs and nGaAs regions during the growth process. AM0 efficiencies of 14.7% (19% AM1) have been obtained from substrates with starting substrate diffusion lengths of 0.6 micron.

Hovel, H. J.↗

Removing bonded skin from a substrate

Metal skin is peeled off like sardine-can cover with key. Method is useful in removing bonded skins from any substrate where substrate is strong enough not to buckle or tear when bonded skin is rolled free. Also, it is useful for removing sections of damaged skin where bladders of other equipment below substrate might be damaged if saw or router were used to cut completely through skin.

Chartier, E. N.↗

Method for making an aluminum or copper substrate panel for selective absorption of solar energy

A panel is described for selectively absorbing solar energy comprising an aluminum substrate. A zinc layer was covered by a layer of nickel and an outer layer of solar energy absorbing nickel oxide or a copper substrate with a nickel layer. A layer of solar energy absorbing nickel oxide distal from the copper substrate was included. A method for making these panels is disclosed.

Roberts, M. L.↗

Aluminium or copper substrate panel for selective absorption of solar energy

A method for making panels which selectively absorb solar energy is disclosed. The panels are comprised of an aluminum substrate, a layer of zinc thereon, a layer of nickel over the zinc layer and an outer layer of solar energy absorbing nickel oxide or a copper substrate with a layer of nickel thereon and a layer of solar energy absorbing nickel oxide distal from the copper substrate.

Roberts, M. L.↗

Attaching of strain gages to substrates

A method and apparatus for attaching strain gages to substrates is described. A strain gage having a backing plate is attached to a substrate by using a foil of brazing material between the backing plate and substrate. A pair of electrodes that are connected to a current source, are applied to opposite sides of the backing plate, so that heating of the structure occurs primarily along the relatively highly conductive foil of brazing material. Field installations are facilitated by utilizing a backing plate with wings extending at an upward incline from either side of the backing plate, by attaching the electrodes to the wings to perform the brazing operation, and by breaking off the wings after the brazing is completed.

Lemcoe, M. M.↗

Study of composites as substrate materials in large space telescopes

Nonmetallic composites such as the graphite/epoxy system were investigated as possible substrates for the primary mirror of the large space telescope. The possible use of fiber reinforced metal matrix composites was reviewed in the literature. Problems arising out of the use of composites as substrate materials such as grinding, polishing, adherence of reflective coatings, rigidity of substrate, hygrospcopici tendency of the composites, thermal and temporal stability and other related problems were examined.

Sharma, A. V.↗

Outdiffusion of recombination centers from the substrate into LPE layers - GaAs

Experimental results are presented showing that outdiffusion of recombination centers from the GaAs substrate into the epitaxial layer takes place during growth. Such outdiffusion decreases the carrier lifetime in the epitaxial layer to much lower values than the radiative recombination limit. Furthermore, it introduces a lifetime gradient across the epitaxial layer which depends critically on the growth velocity and thermal treatment. High rates of growth (such as those attainable in electroepitaxy) and high cooling rates can minimize the adverse effects of normally available substrates on the epitaxial layers; however, good quality substrates are essential for the consistent growth of device quality layers.

Jastrzebski, L.↗

Investigation into the effect of plasma pretreatment on the adhesion of parylene to various substrates

An experimental effort has been undertaken to examine the effect of plasma pretreatment of various substrate materials coated with a polymer in the parylene family. This report describes the procedure and discusses initial data which indicate using plasmas of argon and oxygen to promote adhesion of parylene coatings upon many difficult-to-bond substrates. Substrates investigated were gold, nickel, kovar, teflon (FEP), kapton, silicon, tantalum, titanium, and tungsten. Without plasma treatment, 180 deg peel tests yield a few g/cm (oz/in) strengths. With dc plasma treatment in the deposition chamber, followed by coating, peel strengths are increased by one to two orders of magnitude.

Riley, T.↗

Investigation into the role of NaCL deposited on oxide and metal substrates in the initiation of hot corrosion

The conversion to Na2SO4 of NaCl deposited on oxide substrates was studied as a function of temperature, in air with various SO2 and H2O partial pressures. The substrate was either a pure oxide or an oxide scale growing on a metal specimen. The progress of the reaction was observed using the SEM-EDAX technique to monitor morphological effects and, as far as possible, establish the rate of the process. The physical characteristics of the interaction between salt and substrate were also examined with particular reference to physical damage to the underlying oxide, especially when this is a scale on a metal specimen. An effort was also made to establish the conditions under which liquid phases may form and the mechanisms by which they form.

Birks, N.↗

Empirical study of the interaction of silicon substrate thinness, device design, and solar cell processing

Processing experiments using wire-saw techniques to slice thin silicon wafers are described. Substrates were sliced directly to 17 mil, 8 mil, and 5 mil thicknesses. Some of the 8 mil substrates and all of the 5 mil substrates were chemically etched to 7 and 4 mils, respectively, to guarantee removal of any saw damage. The wafers wire sawed to 17 mil thicknesses were processed as reference cells. A baseline process which results in an n(+)-p cell structure, and two advanced processes which provide n(+)-p-p(+) structures were utilized. By using a p(+) enhancement layer on the solar cell back surface, the performance of the 7 mil wafers was increased to exceed that of the 17 mil solar cells with simple n(+)-p structures. Cells fabricated by an ion implantation sequence utilizing elemental boron and phosphorus implants were shown to be capable of equalling or exceeding the performance of cells fabricated by an equivalent all-diffusion process.

Pryor, R. A.↗

Role of substrate quality on IC performance and yields

The development of silicon and gallium arsenide crystal growth for the production of large diameter substrates are discussed. Large area substrates of significantly improved compositional purity, dopant distribution and structural perfection on a microscopic as well as macroscopic scale are important requirements. The exploratory use of magnetic fields to suppress convection effects in Czochralski crystal growth is addressed. The growth of large crystals in space appears impractical at present however the efforts to improve substrate quality could benefit from the experiences gained in smaller scale growth experiments conducted in the zero gravity environment of space.

Thomas, R. N.↗

Large-area silicon-on-ceramic substrates for low-cost solar cells

The SCIM (Silicon-Coating-By-Inverted Meniscus) process to produce SOC (silicon-on-ceramic) substrates has been investigated for various growth conditions and substrate velocities (4-30 cm/min). Slotted mullite-based substrates (10-cm-wide by 100-cm-long) have been coated with smooth, continuous silicon layers, with thicknesses in the range from 100 to 300 microns. Thermal stress (which can be a problem at low velocities) is prevented by proper thermal design. The highest SCIM-coated SOC cell efficiencies to date are 7.5% (AM1, AR) as compared to 10.5% (AM1, AR) for dip-coated SOC cells. Substantial improvements in cell efficiency are expected when high purity parts are installed in the SCIM-coater.

Schuldt, S. B.↗

Densification of porous refractory substrates

A hydrolyzed tetraethyl orthosilicate is applied to the surface of a porous refractory substrate following which the substrate is heated to a temperature and for a period of time sufficient to bond the silica released from the tetraethyl orthosilicate to the substrate. The surface is thus densified and strengthened.

Ecord, G. M.↗

Holographic fabrication of gratings in metal substrates

A program for investigating the grain enlargement resulting from the laser recrystallization of a thin gallium arsenide film on a patterned substrate, a technique known as graphoepitaxy was evaluated. More specifically, the effects of recrystallizing an uncapped gallium arsenide film using a continuous wave neodymium YAG laser operating at 1.06 microns were studied. In an effort to minimize arsenic loss from the film, the specimens were held in an arsine atmosphere during recrystallization. Two methods for fabricating patterned substrates were developed, one using reactive ion etching of a molybdenum film on both sapphire and silicon substates and another by preferential wet etching of a silicon substrate onto which a film of molybdenum was subsequently deposited.

Fletcher, R. M.↗