Study to develop process controls for line certification on hybrid microcircuits Final report, Nov. 1970 - Feb. 1971
Basic process steps for fabrication of thick or thin film microcircuits for NASA use
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Basic process steps for fabrication of thick or thin film microcircuits for NASA use
Manufacturing quality controls for line certification of thin film and thick film hybrid microcircuits for NASA use
There are no author-identified significant results in this report.
The development of sufficient technology to permit application of boron-aluminum to space shuttle components is described. Specifically, report is made of the fabrication and testing of a 48 in. by 72 in. boron-aluminum compression panel capable of distributing a point load of 350,000 lbs. into a uniform running load within a peaking factor of 1.3 at a temperature of 600 F. In addition, small component testing was performed to verify the compression panel design.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.
There are no author-identified significant results in this report.