Microelectronics for Quantum Sensing
SQMS Symposium
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SQMS Symposium
Italian Summer Students Final Presentations 2023
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Proton damage in electronic equipment based on space radiation simulation studies
Electron microscopy calculations in minimum and maximum capacitance theories for silicon-silicon oxide structures and interfaces
Tests of DTL NAND/NOR microcircuit gate configurations to determine effect of prolonged space environment
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Rugged module package for thin film hybrid microcircuits incorporated a rigid, thermally conductive support structure, which serves as a heat sink, and a lead wire block in which T-shaped electrical connectors are potted. It protects the circuitry from shock and vibration loads, dissipates internal heat, and simplifies electrical connections between adjacent modules.
Multiple chip custom block, MIC construction is used to fabricate an ultracompact, low-power astable multivibrator. The design provides a multivibrator that free runs, eliminating lockup, is triggerable, pulling into synchronization with an external signal source, and permits design flexibility for controlling the frequency variations with temperature.
Open-loop performance of stabilized platform servo electronics system
Hybrid analog-to-digital converter for spacecraft applications
Evaluation of pulse width modulator and power driver for integrated dc power amplifier
Lunar Orbiter flight programmer, electronic design, development, application and performance
Integrated push-pull power amplifier fabricated on a chip of silicon has interdigitated power transistors and is hermetically encapsulated in a beryllia flat package. It provides current output greater than the nominal 10 amperes from an input current drive of 1 ampere.
Monte Carlo computer analysis method for yield and reliability predictions of integrated circuits