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At least 181 records · Page 10

Barrier height enhancement of InP-based n-Ga(0.47)In(0.53)As Schottky-barrier diodes grown by molecular beam epitaxy

Barrier height enhancement of an InP-based p(+)n-Ga(0.47)In(0.53)As Schottky diode grown by MBE has been demonstrated for infra-red photodetector applications. A barrier height of 0.35 eV for n-Ga(0.47)In(0.53)As Schottky barrier diodes, was increased to the effective barrier height of 0.55 eV, with a p(+)-Ga(0.47)In(0.53)As surface layer of 30 nm thick. The results show a reverse leakage current density of 0.0015 A/sq cm and a junction capacitance of 0.3 pF, which are comparable to those of p-Ga(0.47)In(0.53)As Schottky-barrier diodes at a reverse bias voltage of 5 V.

Kim, J. H.↗

Gaussian approximation versus nearly exact performance analysis of optical communication systems with PPM signaling and APD receivers

A 25-Mb/s direct-detection optical communication system that used Q = 4 PPM (pulse-position modulation) signaling was constructed and its performance measured under laboratory conditions. The system used a single-mode AlGaAs laser diode (lambda = 834 nm) and low-noise silicon avalanche photodiode (APD). A procedure for numerically computing system performance is given that uses the nearly exact Webb approximation of the true Conradi distribution for the APD output and does not require excessive amounts of computer time. Comparison revealed that modeling the APD ouptut as a Gaussian process under conditions of negligible background radiation and low (less than 10 to the -12 A) APD bulk leakage currents leads to substantial underestimates of optimal APD gain and overestimates of system bit error probability. Examples illustrate the breakdown of the Gaussian approximation in assessing system performance. The measured performance was in excellent agreement with that predicted by the computational procedure. The system achieved a bit error probability of 10 to the -6 at a received signal energy, corresponding to an average of 60 absorbed photons/bit and optimal APD gain of 700.

Davidson, Frederic M.↗

Computer analysis of the negative differential resistance switching phenomenon of double-injection devices

By directly solving the semiconductor differential equations for the double-injection (DI) devices involving two interacting deep levels, the authors studied the negative differential resistance switching characteristic and its relationship with the device dimension, doping level, and dependence on the deep impurity profile. Computer simulation showed that although one can increase the threshold voltage by increasing the device length, the excessive holding voltage that would follow would put this device in a very limited application such as pulse power source. The excessive leakage current in the low conductance state also jeopardizes the attempt to use the device for any practical purpose. Unless there are new materials and deep impurities found that have a great differential hole and electron capture cross sections and a reasonable energy bandgap for low intrinsic carrier concentration, no big improvement in the fate of DI devices is expected in the near future.

Shieh, Tsay-Jiu↗

Alternative AlxGa1-xAs/GaAs Transistors For Neural Networks

Further development efforts yield alternative version of transistors described in "High-Gain AlxGa1-xAs/GaAs Transistors For Neural Networks" (NPO-18101). Efforts focused on determining effects of various aspects of design and of fabrication processes upon leakage currents and on current gain.

Kim, Jae-Hoon↗

Electrical characterization of glass, teflon, and tantalum capacitors at high temperatures

Dielectric materials and electrical components and devices employed in radiation fields and the space environment are often exposed to elevated temperatures among other things. Therefore, these systems must withstand the high temperature exposure while still providing good electrical and other functional properties. Experiments were carried out to evaluate glass, teflon, and tantalum capacitors for potential use in high temperature applications. The capacitors were characterized in terms of their capacitance and dielectric loss as a function of temperature up to 200 C. At a given temperature, these properties were obtained in a frequency range of 50 Hz to 100 kHz. The DC leakage current measurements were also performed in a temperature range from 20 to 200 C. The obtained results are discussed and conclusions are made concerning the suitability of the capacitors investigated for high temperature applications.

Hammoud, A. N.↗

Squeezed photon-number noise and sub-Poissonian electrical partition noise in a semiconductor laser

Amplitude noise on the light from a semiconductor laser produced a photocurrent fluctuation spectrum that was a maximum of 85 percent (-8.3 dB) below the shot-noise limit. Squeezing in semiconductor lasers is not limited by the overall quantum, or current transfer, efficiency from the laser injection current to the detector photocurrent. Current leakage away from the lasing junction does not introduce Poissonian partition noise.

Richardson, W. H.↗

Electrical properties of teflon and ceramic capacitors at high temperatures

Space power systems and components are often required to operate efficiently and reliably in harsh environments where stresses, such as high temperature, are encountered. These systems must, therefore, withstand exposure to high temperature while still providing good electrical and other functional properties. Experiments were carried out to evaluate Teflon and ceramic capacitors for potential use in high temperature applications. The capacitors were characterized in terms of their capacitance and dielectric loss as a function of temperature, up to 200 C. At a given temperature, these properties were obtained in a frequency range of 50 Hz to 100 kHz. DC leakage current measurements were also performed in a temperature range from 25 to 200 C. The results obtained are discussed and conclusions are made concerning the suitability of the capacitors studied for high temperature applications.

Hammoud, A. N.↗

PASP Plus: An experiment to measure space-environment effects on photovoltaic power subsystems

The Photovoltaic Array Space Power Plus Diagnostic experiment (PASP Plus) was accepted as part of the APEX Mission payload aboard a Pegastar satellite to be orbited by a Pegasus launch vehicle in late 1992. The mission's elliptical orbit will allow us to investigate both space plasma and space radiation effects. PASP Plus will have eleven types of solar arrays and a full complement of environmental and interactions diagnostic sensors. Measurements of space-plasma interactions on the various solar arrays will be made at large negative voltages (to investigate arcing parameters) and at large positive voltages (to investigate leakage currents) by biasing the arrays to various levels up to -500 and +500 volts. The long-term deterioration in solar array performance caused by exposure to space radiation will also be investigated; radiation dosage will be measured by an electron/proton dosimeter included in the environmental sensor complement. Experimental results from PASP Plus will help establish cause-and-effect relationships and lead to improved design guidelines and test standards for new-technology solar arrays.

Guidice, Donald A.↗

Neutron, gamma ray, and temperature effects on the electrical characteristics of thyristors

Experimental data showing the effects of neutrons, gamma rays, and temperature on the electrical and switching characteristics of phase-control and inverter-type SCR's are presented. The special test fixture built for mounting, heating, and instrumenting the test devices is described. Four SCR's were neutron irradiated at 300 K and four at 365 K for fluences up to 3.2 x 10 exp 13 n/sq. cm, and eight were gamma irradiated at 300 K only for gamma doses up to 5.1 Mrads. The electrical measurements were made during irradiation and the switching measurements were made only before and after irradiation. Radiation induced crystal defects, resulting primarily from fast neutrons, caused the reduction of minority carrier lifetime through the generation of R-G centers. The reduction in lifetime caused increases in the on-state voltage drop and in the reverse and forward leakage currents, and decreases in the turn-off time.

Frasca, A. J.↗

Electrical breakdown of Space Station Freedom surfaces

Space Station Freedom (SSF) will be the largest and highest power spacecraft that the U.S. has put into orbit. The solar array will generate 160 volts nominal when in sunlight, and the present baseline design is for the negative end of the solar array to be tied to SSF structure. Due to the balance of leakage currents through the plasma, the structure will be driven approximately 140 volts negative of the ambient conductive ionospheric plasma. Surface materials such as anodized aluminum will have this voltage drop across a thin dielectric which may not have sufficient dielectric strength to prevent dielectric breakdown. This can lead to arcing on the exterior surfaces of Space Station.

Carruth, M. R., Jr.↗

A model for the trap-assisted tunneling mechanism in diffused n-p and implanted n(+)-p HgCdTe photodiodes

This paper presents a theoretical model for the trap-assisted tunneling process in diffused n-on-p and implanted n(+)-on-p HgCdTe photodiodes. The model describes the connection between the leakage current associated with the traps and the trap characteristics: concentration, energy level, and capture cross sections. It is observed that the above two types of diodes differ the voltage dependence of the trap-assisted tunneling current and dynamic resistance. The model takes this difference into account and offers an explanation of the phenomenon. The good fit between measured and calculated dc characteristics of the photodiodes supports the validity of the model.

Rosenfeld, David↗

Assessment of environmental effects on Space Station Freedom Electrical Power System

Analyses of EPS (electrical power system) interactions with the LEO (low earth orbit) environment are described. The results of these analyses will support EPS design so as to be compatible with the natural and induced environments and to meet power, lifetime, and performance requirements. The environmental impacts to the Space Station Freedom EPS include aerodynamic drag, atomic oxygen erosion, ultraviolet degradation, VXB effect, ionizing radiation dose and single event effects, electromagnetic interference, electrostatic discharge, plasma interactions (ion sputtering, arcing, and leakage current), meteoroid and orbital debris threats, thermal cycling effects, induced current and voltage potential differences in the SSF due to induced electric field, and contamination degradation.

Lu, Cheng-Yi↗

Soft x ray window encapsulant for HgI2 detectors

HgI2 is an excellent semiconductor material for a low energy, room temperature x-ray spectrometer. The high values of the atomic numbers for its constituent elements gives high x-ray and gamma ray stopping power. The band gap of HgI2 is significantly higher than other commonly used semiconductors. Owing to the large value band gap, the leakage current for HgI2 devices is smaller, thus allowing low noise performance. Devices fabricated from HgI2 crystals have demonstrated energy resolution sufficient to distinguish the x-ray emission from the neighboring elements on the periodic table. Also the power requirements of HgI2 are very low. These characteristics make a HgI2 spectrometer an ideal component in a satellite based detection system. Unfortunately, HgI2 crystals tend to deteriorate with time, even if protected by standard semiconductor encapsulants. This degradation ruins the performance of the device in terms of its energy resolution and pulse amplitude. The degrading mechanism is believed to be material loss occurring from below the electrodes, due to high vapor pressure of HgI2 at room temperature. To address this major obstacle to rapid expansion of HgI2 technology, a research program aimed at improving device stability by encapsulation with inert polymeric materials was carried out. The program focused specifically on optimizing the encapsulant materials and their deposition techniques. The principal objectives for this program were device encapsulation, device testing, and accelerated testing to ensure very long term stability of these high resolution sensors. A variety of encapsulants were investigated with the selection criteria based on their chemical diffusion barrier properties, mechanical stability, reactivity, and morphology of encapsulant films. The investigation covered different classes of encapsulants including solvent based encapsulants, vapor deposited encapsulants, and plasma polymerized encapsulants. A variety of characterization techniques were employed to examine their effectiveness in stabilizing HgI2 devices; these included permeability evaluation, vacuum and heat testing, scanning electron microscopy (SEM) as well as studying the detector performance of coated detectors. The plasma polymerized films appear to have entirely solved the HgI2 degradation problem. Another achievement of this program was the development of an accelerated testing technique which correlates extremely well with long term tesing.

Entine, G.↗

Neutron, gamma ray, and temperature effects on the electrical characteristics of thyristors

Experimental data showing the effects of neutrons, gamma rays, and temperature on the electrical and switching characteristics of phase-control and inverter-type SCR's are presented. The special test fixture built for mounting, heating, and instrumenting the test devices is described. Four SCR's were neutron irradiated at 300 K and four at 365 K for fluences up to 3.2 x 10 exp 13 pn/sq. cm, and eight were gamma irradiated at 300 K only for gamma doses up to 5.1 Mrads. The electrical measurements were made during irradiation and the switching measurements were made only before and after irradiation. Radiation induced crystal defects, resulting primarily from fast neutrons, caused the reduction of minority carrier lifetime through the generation of R-G centers. The reduction in lifetime caused increases in the on-state voltage drop and in the reverse and forward leakage currents, and decreases in the turn-off time.

Frasca, A. J.↗

Application of high-quality SiO2 grown by multipolar ECR source to Si/SiGe MISFET

A 5 nm-thick SiO2 gate was grown on an Si(p+)/Si(0.8)Ge(0.2) modulation-doped heterostructure at 26 C with an oxygen plasma generated by a multipolar electron cyclotron resonance source. The ultrathin oxide has breakdown field above 12 MV/cm and fixed charge density about 3 x 10 exp 10/sq cm. Leakage current as low as 1/micro-A was obtained with the gate biased at 4 V. The MISFET with 0.25 x 25 sq m gate shows maximum drain current of 41.6 mA/mm and peak transconductance of 21 mS/mm.

Sung, K. T.↗

Greatly improved 3C-SiC p-n junction diodes grown by chemical vapor deposition

This paper reports the fabrication and initial electrical characterization of greatly improved 3C-SiC (beta-SiC) p-n junction diodes. These diodes, which were grown on commercially available 6H-SiC substrates by chemical vapor deposition, demonstrate rectification to -200 V at room temperature, representing a fourfold improvement in reported 3C-SiC diode blocking voltage. The reverse leakage currents and saturation current densities measured on these diodes also show significant improvement compared to previously reported 3C-SiC p-n junction diodes. When placed under sufficient forward bias, the diodes emit significantly bright green-yellow light. These results should lead to substantial advancements in 3C-SiC transistor performance.

Neudeck, Philip G.↗

Using advanced microelectronic test chips to qualify ASIC's for space

Qualification procedures for complex integrated circuits are being developed under a U.S. government program known as Qualified Manufacturing Lines (QML). This effort is focused on circuits designed by IC manufacturers and has not addressed application specific IC's (ASIC's) designed at system houses. The qualification procedures described here are intended to be responsive to the needs of system houses who design their own ASIC's and have them fabricated at Silicon foundries. A particular focus of this presentation will be the use of the TID (total Ionizing Dose) Chip to evaluate CMOS foundry processes and to provide parameters for circuit simulators. This chip is under development as a standard chip for qualifying the total dose aspects of ASIC's. The benefits of standardization are that the results will be well understood and easy to interpret. Data is presented and compared for 1.6 micron and 3.0 micron CMOS. The data shows that 1.6 micron CMOS is significantly harder than 3.0 micron CMOS. Two failure modes are explored: (1) the radiation-induced degradation of timing delays; and (2) radiation-induced leakage currents.

Buehler, M. G.↗

Results of thermal vacuum tests for the PASP+ flight modules

The PASP PLUS (Photovoltaic Array Space Power Plus Diagnostics) program is a photovoltaic experiment which will be flown on the Air Force satellite APEX (Advanced Photovoltaic And Electronic Experiment). APEX will be launched with a Pegasus during the summer of 1993. There are two other small experiments on APEX but PASP+ is the largest, uses the most power, and accounts for over 90 percent of the data requirements. The orbit is elliptical with apogee and perigee of 1050 and 190 nautical miles respectively. The inclination is 70 deg. The two main objectives of PASP+ are to determine the interactions between high voltage arrays and the space plasma environment and to determine the radiation damage characteristics of several newer types of solar cells. In order to determine the interactions with the space plasma, several of the individual cell strings will be biased to voltages up to plus or minus 500 V, and leakage currents and arcing rates will be measured. The radiation degradation characteristics will be determined by the continuous monitoring of I-V data for all of the cell strings. As part of an overall testing program, the PASP+ panels and controller were put through a thermal vacuum test in order to check the thermal analysis, obtain temperature coefficients for the individual modules, and have an end-to-end test of the entire PASP+ experiment. This thermal vacuum test is described briefly and the results obtained during that testing are discussed.

Curtis, Henry↗