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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10
All sourcesNASA NTRSDOE OSTI
NASA NTRS2011

Failure Modes in Capacitors When Tested Under a Time-Varying Stress

Power-on failure has been the prevalent failure mechanism for solid tantalum capacitors in decoupling applications. A surge step stress test (SSST) has been previously applied to identify the critical stress level of a capacitor batch to give some predictability to the power-on failure mechanism [1]. But SSST can also be viewed as an electrically destructive test under a time-varying stress (voltage). It consists of rapidly charging the capacitor with incremental voltage increases, through a low resistance in series, until the capacitor under test is electrically shorted. When the reliability of capacitors is evaluated, a highly accelerated life test (HALT) is usually adopted since it is a time-efficient method of determining the failure mechanism; however, a destructive test under a time-varying stress such as SSST is even more time efficient. It usually takes days or weeks to complete a HALT test, but it only takes minutes for a time-varying stress test to produce failures. The advantage of incorporating a specific time-varying stress profile into a statistical model is significant in providing an alternative life test method for quickly revealing the failure mechanism in capacitors. In this paper, a time-varying stress that mimics a typical SSST has been incorporated into the Weibull model to characterize the failure mechanism in different types of capacitors. The SSST circuit and transient conditions for correctly surge testing capacitors are discussed. Finally, the SSST was applied for testing Ta capacitors, polymer aluminum capacitors (PA capacitors), and multi-layer ceramic (MLC) capacitors with both precious metal electrodes (PME) and base metal electrodes (BME). The test results are found to be directly associated with the dielectric layer breakdown in Ta and PA capacitors and are independent of the capacitor values, the way the capacitors were built, and the capacitors manufacturers. The test results also show that MLC capacitors exhibit surge breakdown voltages much higher than the rated voltage and that the breakdown field is inversely proportional to the dielectric layer thickness. The SSST data can also be used to comparatively evaluate the voltage robustness of capacitors for decoupling applications.

Liu, David (Donhang)↗
NASA NTRS2018

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗
DOE OSTI2021

Multimodal 3D characterization of voids in shock-loaded tantalum: Implications for ductile spallation mechanisms

Predicting the failure of crystalline materials at high strain rates requires knowledge of the underlying failure mechanisms and their dependence on microstructure. However, little experimental consensus exists on the underlying micromechanics of spallation. In this study, a 3D-EBSD characterization experiment is performed on tantalum prior to and after partial spallation by plate impact, which allowed for the statistical assessment of the microstructural neighborhoods surrounding incipient voids. In analyzing the resulting dataset containing 5884 grains and 467 voids, it is observed that the voids were roughly spherical and consistent in size throughout the spalled material. The voids mostly resided at quadruple points, at triple junctions, at grain boundaries, and within grains, in decreasing order of prevalence. Moreover, voids tended to form at grain boundaries with high degrees of plastic incompatibility, growing into the plastically soft grain but orienting primarily with or perpendicular to the loading direction. Here, the statistics from these analyses of 3D microstructural data support dynamic cavitation models for ductile spallation.

36 MATERIALS SCIENCE↗
NASA NTRS2013

Progressive Damage Modeling of Durable Bonded Joint Technology

The development of durable bonded joint technology for assembling composite structures for launch vehicles is being pursued for the U.S. Space Launch System. The present work is related to the development and application of progressive damage modeling techniques to bonded joint technology applicable to a wide range of sandwich structures for a Heavy Lift Launch Vehicle. The joint designs studied in this work include a conventional composite splice joint and a NASA-patented Durable Redundant Joint. Both designs involve a honeycomb sandwich with carbon/epoxy facesheets joined with adhesively bonded doublers. Progressive damage modeling allows for the prediction of the initiation and evolution of damage. For structures that include multiple materials, the number of potential failure mechanisms that must be considered increases the complexity of the analyses. Potential failure mechanisms include fiber fracture, matrix cracking, delamination, core crushing, adhesive failure, and their interactions. The joints were modeled using Abaqus parametric finite element models, in which damage was modeled with user-written subroutines. Each ply was meshed discretely, and layers of cohesive elements were used to account for delaminations and to model the adhesive layers. Good correlation with experimental results was achieved both in terms of load-displacement history and predicted failure mechanisms.

Leone, Frank A.↗
NASA NTRS2010

Scaled CMOS Technology Reliability Users Guide

The desire to assess the reliability of emerging scaled microelectronics technologies through faster reliability trials and more accurate acceleration models is the precursor for further research and experimentation in this relevant field. The effect of semiconductor scaling on microelectronics product reliability is an important aspect to the high reliability application user. From the perspective of a customer or user, who in many cases must deal with very limited, if any, manufacturer's reliability data to assess the product for a highly-reliable application, product-level testing is critical in the characterization and reliability assessment of advanced nanometer semiconductor scaling effects on microelectronics reliability. A methodology on how to accomplish this and techniques for deriving the expected product-level reliability on commercial memory products are provided.Competing mechanism theory and the multiple failure mechanism model are applied to the experimental results of scaled SDRAM products. Accelerated stress testing at multiple conditions is applied at the product level of several scaled memory products to assess the performance degradation and product reliability. Acceleration models are derived for each case. For several scaled SDRAM products, retention time degradation is studied and two distinct soft error populations are observed with each technology generation: early breakdown, characterized by randomly distributed weak bits with Weibull slope (beta)=1, and a main population breakdown with an increasing failure rate. Retention time soft error rates are calculated and a multiple failure mechanism acceleration model with parameters is derived for each technology. Defect densities are calculated and reflect a decreasing trend in the percentage of random defective bits for each successive product generation. A normalized soft error failure rate of the memory data retention time in FIT/Gb and FIT/cm2 for several scaled SDRAM generations is presented revealing a power relationship. General models describing the soft error rates across scaled product generations are presented. The analysis methodology may be applied to other scaled microelectronic products and their key parameters.

Microelectronics Reliability↗
NASA NTRS2012

Progressive Damage Analysis of Bonded Composite Joints

The present work is related to the development and application of progressive damage modeling techniques to bonded joint technology. The joint designs studied in this work include a conventional composite splice joint and a NASA-patented durable redundant joint. Both designs involve honeycomb sandwich structures with carbon/epoxy facesheets joined using adhesively bonded doublers.Progressive damage modeling allows for the prediction of the initiation and evolution of damage within a structure. For structures that include multiple material systems, such as the joint designs under consideration, the number of potential failure mechanisms that must be accounted for drastically increases the complexity of the analyses. Potential failure mechanisms include fiber fracture, intraply matrix cracking, delamination, core crushing, adhesive failure, and their interactions. The bonded joints were modeled using highly parametric, explicitly solved finite element models, with damage modeling implemented via custom user-written subroutines. Each ply was discretely meshed using three-dimensional solid elements. Layers of cohesive elements were included between each ply to account for the possibility of delaminations and were used to model the adhesive layers forming the joint. Good correlation with experimental results was achieved both in terms of load-displacement history and the predicted failure mechanism(s).

Leone, Frank A., Jr.↗
DOE OSTI2021

In-situ x-ray computed tomography analysis of fracture mechanisms in ultrasonic additively manufactured Al-6061 alloy

The deformation and failure mechanisms in an ultrasonic additively manufactured Al-6061 alloy are studied using in-situ x-ray computed tomography during tensile deformation as well as ex-situ characterization with scanning electron microscopy. The role of pre-existing voids between the build layers on the failure mechanism is discussed with a focus on individual foil failures and void coalescence.

36 MATERIALS SCIENCE↗
NASA NTRS2000

Failure Engineering Study and Accelerated Stress Test Results for the Mars Global Surveyor Spacecraft's Power Shunt Assemblies

An Engineering-of-Failure approach to designing and executing an accelerated product qualification test was performed to support a risk assessment of a "work-around" necessitated by an on-orbit failure of another piece of hardware on the Mars Global Surveyor spacecraft. The proposed work-around involved exceeding the previous qualification experience both in terms of extreme cold exposure level and in terms of demonstrated low cycle fatigue life for the power shunt assemblies. An analysis was performed to identify potential failure sites, modes and associated failure mechanisms consistent with the new use conditions. A test was then designed and executed which accelerated the failure mechanisms identified by analysis. Verification of the resulting failure mechanism concluded the effort.

Gibbel, Mark↗
NASA NTRS1985

Thermal barrier coating life prediction model

This is the first report of the first phase of a 3-year program. Its objectives are to determine the predominant modes of degradation of a plasma sprayed thermal barrier coating system, then to develop and verify life prediction models accounting for these degradation modes. The first task (Task I) is to determine the major failure mechanisms. Presently, bond coat oxidation and bond coat creep are being evaluated as potential TBC failure mechanisms. The baseline TBC system consists of an air plasma sprayed ZrO2-Y2O3 top coat, a low pressure plasma sprayed NiCrAlY bond coat, and a Rene'80 substrate. Pre-exposures in air and argon combined with thermal cycle tests in air and argon are being utilized to evaluate bond coat oxidation as a failure mechanism. Unexpectedly, the specimens pre-exposed in argon failed before the specimens pre-exposed in air in subsequent thermal cycles testing in air. Four bond coats with different creep strengths are being utilized to evaluate the effect of bond coat creep on TBC degradation. These bond coats received an aluminide overcoat prior to application of the top coat to reduce the differences in bond coat oxidation behavior. Thermal cycle testing has been initiated. Methods have been selected for measuring tensile strength, Poisson's ratio, dynamic modulus and coefficient of thermal expansion both of the bond coat and top coat layers.

Hillery, R. V.↗
DOE OSTI2022

Quantitative spatiotemporal mapping of thermal runaway propagation rates in lithium-ion cells using cross-correlated Gabor filtering

Abuse testing of lithium-ion batteries is widely performed in order to develop new safety standards and strategies. However, testing methodologies are not standardised across the research community, especially with failure mechanisms being inherently difficult to reproduce. High-speed X-ray radiography is proven to be a valuable tool to capture events occurring during cell failure, but the observations made remain largely qualitative. We have therefore developed a robust image processing toolbox that can quantify, for the first time, the rate of propagation of battery failure mechanisms revealed by high-speed X-ray radiography. Using Gabor filter, the toolbox selectively tracks the electrode structure at the onset of failure. This facilitated the estimation of the displacement of electrodes undergoing abuse via nail penetration, and also the tracking of objects, such as the nail, as it propagates through a cell. Further, by cross-correlating the Gabor signals, we have produced practical, illustrative spatiotemporal maps of the failure events. From these, we can quantify the propagation rates of electrode displacement prior to the onset of thermal runaway. The highest recorded acceleration (≈514 mm s -2 ) was when a nail penetrated a cell radially (perpendicular to the electrodes) as opposed to axially (parallel to the electrodes). The initiation of thermal runaway was also resolved in combination with electrode displacement, which occurred at a lower acceleration (≈108 mm s -2 ). Our assistive toolbox can also be used to study other types of failure mechanisms, extracting otherwise unattainable kinetic data. Ultimately, this tool can be used to not only validate existing theoretical mechanical models, but also standardise battery failure testing procedures.

25 ENERGY STORAGE↗
NASA NTRS1971

Lunar surface engineering properties experiment definition. Volume 2: Mechanics of rolling sphere-soil slope interaction

The soil deformation mode under the action of a rolling sphere (boulder) was determined, and a theory based on actual soil failure mechanism was developed which provides a remote reconnaissance technique for study of soil conditions using boulder track observations. The failure mechanism was investigated by using models and by testing an instrumented spherical wheel. The wheel was specifically designed to measure contact pressure, but it also provided information on the failure mechanism. Further tests included rolling some 200 spheres down sand slopes. Films were taken of the rolling spheres, and the tracks were measured. Implications of the results and reevaluation of the lunar boulder tracks are discussed.

Hovland, H. J.↗
DOE OSTI2022

Failure Mode and Effects Analysis for a Photovoltaic Inverter

While PV panel reliability continues to increase, PV inverters become the limiting factor for PV system reliability. Consequently, it is critical to have a generic tool from a third party for PV inverter reliability assessment to help 1) utilities/PV farm operators schedule maintenance in advance, and 2) inverter developers improve the next-generation design. However, these two things cannot be accomplished without first understanding the reasons behind inverter failure. Following this idea, as the first step, it is essential to identify and investigate the most failure-prone components within a PV inverter system. After all, any system is only as reliable as the components that are contained within it. This motivates the failure mode and effects analysis (FMEA) work presented for this workshop. The FMEA is conducted as follows: first, the overview of the methodology on the development of the FMEA is presented; then, based on a top-down approach starting from the PV inverter system, critical inverter components with high failure rates are identified and summarized; afterward, a thorough FMEA study at a component-level is performed and its results, including failure modes, failure mechanisms, and critical stressors, are tabulated; finally, according to three rankings (chance of occurrence, severity of occurrence, and ease of detection prior to failure) for each failure mechanism provided by the FMEA, risk priority numbers are calculated and the failure mechanisms along with the critical stressors are ranked in terms of their potentially detrimental effect on the PV inverter.

Brown, Buck↗
NASA NTRS1978

Mechanics of failure of composite materials

Composite materials are both inhomogeneous and anisotropic. Both of these characteristics affect the internal stress distributions since inhomogeneity involves variations in both strength and stiffness. The fracture mechanics of nonuniform materials are considered, taking into account the effect of nonuniformity on stress distributions near the crack tip, predicted yield zones in nonuniform and uniform materials, and the fracture of a center-notched unidirectional specimen. The mechanics of failure of laminated materials is discussed. It is found that the development of damage in a laminate with increasing load and, possibly, increasing numbers of cycles of loading is peculiar to the laminate in question, i.e., the material system, the stacking sequence, and the geometry. Approaches for monitoring damage development are also described.

Reifsnider, K. L.↗
DOE OSTI2022

Automating Component-Level Stress Measurements for Inverter Reliability Estimation

In the near future, grid operators are expected to regularly use advanced distributed energy resource (DER) functions, defined in IEEE 1547-2018, to perform a range of grid-support operations. Many of these functions adjust the active and reactive power of the device through commanded or autonomous operating modes which induce new stresses on the power electronics components. In this work, an experimental and theoretical framework is introduced which couples laboratory-measured component stress with advanced inverter functionality and derives a reduction in useful lifetime based on an applicable reliability model. Multiple DER devices were instrumented to calculate the additional component stress under multiple reactive power setpoints to estimate associated DER lifetime reductions. A clear increase in switch loss was demonstrated as a function of irradiance level and power factor. This is replicated in the system-level efficiency measurements, although magnitudes were different—suggesting other loss mechanisms exist. Using an approximate Arrhenius thermal model for the switches, the experimental data indicate a lifetime reduction of 1.5% when operating the inverter at 0.85 PF—compared to unity PF—assuming the DER failure mechanism thermally driven within the H-bridge. If other failure mechanisms are discovered for a set of power electronics devices, this testing and calculation framework can easily be tailored to those failure mechanisms.

Flicker, Jack (ORCID:0000000212232154)↗
DOE OSTI2024

A high-resolution pseudo-polygon discrete element model for regional sea ice

Here, this work presents a pseudo-polygon discrete element model for high-resolution sea ice simulations. A scale-invariant bonded particle contact model is proposed to model joints between sea ice floes based on the smeared fracture model and a lattice spring beam model, and the Mohr–Coulomb failure criterion is implemented to represent the shearing failure mechanism of sea ice packings under complex loadings. All mechanical parameters of the bond model can be directly determined from laboratory tests. Validations of the proposed model are made by investigations of mechanical response and failure criteria of field sea ice sheets. Compared with the field observations of sea ice from satellite radar and in situ stress sensors, the proposed model is capable of reproducing the typical constitutive behavior and the Coulomb friction envelope of field sea ice. Finally, the proposed discrete element sea ice model is used to study the effect of loading rates on mechanical behavior including failure strength of regional sea ice.

54 ENVIRONMENTAL SCIENCES↗
NASA NTRS2011

Fracture in Phenolic Impregnated Carbon Ablator

The thermal protection materials used for spacecraft heat shields are subjected to various thermal-mechanical loads during an atmospheric reentry which can threaten the structural integrity of the system. This paper discusses the development of a novel technique to understand the failure mechanisms inside the thermal protection material, Phenolic Impregnated Carbon Ablator (PICA). PICA has successfully flown on the Stardust spacecraft and was the TPS material chosen for the Mars Science Laboratory (MSL), that will fly in 2011. Although PICA has good thermal properties, structurally, it is a weak material. To thoroughly understand failure in PICA, experiments were performed using FiberForm(Registered TradeMark) (precursor of PICA), virgin and furnace-charred PICA. Several small samples were tested inside an electron microscope to investigate the failure mechanisms. Micrographs were obtained before and after the failure in order to study crack initiation and growth. Videos were obtained to capture failure mechanisms in real time. Stress-strain data was obtained simultaneously for all the samples with the help of a data acquisition system, integrated to the mechanical stages. It was found that cracks initiated and grew in the FiberForm when a critical stress limit was reached such that the carbon fibers separated from the binder. However, both for virgin and charred PICA, crack initiation and growth occurred in the matrix (phenolic) phase. Both virgin and charred PICA showed greater strength values compared to FiberForm coupons, confirming that the presence of the porous matrix helps in absorbing the fracture energy.

Agrawal, Parul↗
DOE OSTI2025

Numerical and experimental analysis of mechanically induced failure in electric vehicle battery modules

Mitigating thermal runaway and cell-to-cell propagation is essential for improving the safety of electric and hybrid vehicles. Enhancing digital twin capabilities to predict battery mechanical abuse is particularly critical for automotive and aerospace applications, where crashworthiness is a key concern. Understanding failure conditions and propagation in battery modules during mechanical abuse is complex due to interactions between structural deformation, heat transfer, electrochemical processes, exothermic reactions and mechanical fracture. While prior studies have focused on modeling cell-level behavior, extending these models to module or pack level is necessary for a system level understating of electric vehicle safety. This study develops coupled large deformation finite element models that simultaneously solve for electrochemistry, material failure, internal short circuit and thermal runaway propagation. The models account for mechanical and thermal interactions between lithium-ion cells and other battery components while the contact interfaces are evolving with time. Model-predicted voltage, temperature and force responses are compared with experimental data for validation. The results demonstrate that the approach captures key failure mechanisms, including thermal propagation through heat transfer, electrical propagation from short circuits in parallel-connected cells, and mechanical propagation via penetration and crack formation. These findings show that computational models are valuable tools for understanding battery module failure and providing insight that can reduce the need for extensive experimental testing.

25 ENERGY STORAGE↗
NASA NTRS1985

Experimental and analytical study of ceramic-coated turbine-tip shroud seals for small turbine engines

The results of an experimental and analytical evaluation of ceramic turbine tip shrouds within a small turbine engine operating environment are presented. The ceramic shrouds were subjected to 1001 cycles between idle and high power and steady-state conditions for a total of 57.8 engine hr. Posttest engine inspection revealed mud-flat surface cracking, which was attributed to microcracking under tension with crack penetration to the ceramic and bond coat interface. Sections and micrographs tend to corroborate the thesis. The engine test data provided input to a thermomechanical analysis to predict temperature and stress profiles throughout the ceramic gas-path seal. The analysis predicts cyclic thermal stresses large enough to cause the seal to fail. These stresses are, however, mitigated by inelastic behavior of the shroud materials and by the microfracturing that tensile stresses produce. Microfracturing enhances shroud longevity during early life but provides the failure mechanism during life but provides the failure mechanism during extended life when coupled with the time dependent inelastic materials effects.

Biesiadny, T. J.↗