Damage Assessment of Stress-Thermal Cycled high temperature
We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycles range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees Celsius associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle; the number of cycles; the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles: 1. Ambient temperature - -196 degrees celsius. 2. Ambient temperature - 150 degrees Celsius; 200 degrees Celsius; 250 degrees Celsius. 3. -196 degrees Celsius - 250 degrees Celsius. The Principle findings are that the full cycles from -196 degrees Celsius to to 250 degrees Celsius cause the most significant microcrack of development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associate with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M60JB carbon fabric [0f,90f,90f,0f,0f,90f]ls composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75% of the composite cryogenic (-196 degrees Celsius) ultimate strength.