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At least 181 records · Page 10

Irradiation Effects of 22 and 240 MeV Protons on Several Transistors and Solar Cells

The work covered in this report has been directed toward the investigation of the irradiation effects of 22 and 240 MeV protons on several transistors, solar cells, resistors, and condensers to be used in the space radiation environment. The experimental data indicated definite detrimental effects on transistors and solar cells but no apparent effects on the types of resistors and condensers tested. The detrimental effects are of two distinct types: transient and permanent.

Hulten, W. C.↗

An Integrated MEMS Sensor Cluster System for Aerospace Applications

Efforts to reduce viscous drag on airfoils could results in a considerable saving for the operation of flight vehicles including those of space transportation. This reduction of viscous drag effort requires measurement and active control of boundary layer flow property on an airfoil. Measurement of viscous drag of the boundary layer flow over an airfoil with minimal flow disturbance is achievable with newly developed MEMS sensor clusters. These sensor clusters provide information that can be used to actively control actuators to obtain desired flow properties or design a vehicle to satisfy particular boundary layer flow criteria. A series of MEMS sensor clusters has been developed with a data acquisition and control module for local measurements of shear stress, pressure, and temperature on an airfoil. The sensor cluster consists of two shear stress sensors, two pressure sensors, and two temperature sensors on a surface area of 1.24 mm x 1.86 mm. Each sensor is 300 microns square and is placed on a flexible polyimide sheet. The shear stress sensor is a polysilicon hot-film resistor, which is insulated by a vacuum cavity of 200 x 200 x 2 microns. The pressure sensors are silicon piezoresistive type, and the temperature sensors are also hot film polysilicon resistors. The total size of the cluster including sensors and electrical leads is 1 Omm x 1 Omm x 0.1 mm. A typical sensitivity of shear stress sensor is 150 mV/Pascal, the pressure sensors are an absolute type with a measurement range from 9 to 36 psia with 0.8mV/V/psi sensitivity, and the temperature sensors have a measurement resolution of 0.1 degree C. The sensor clusters are interfaced to a data acquisition and control module that consists of two custom ASICs (Application Specific Integrated Circuits) and a micro-controller. The data acquisition and control module transfers data to a host PC that configures and controls a total of three sensor clusters. Functionality of the entire system has been tested in the laboratory, and preliminary test results are presented.

Kahng, Seun↗

Measurement of Thin Film Integrated Passive Devices on SiC through 500 C

Wireless communication in jet engines and high temperature industrial applications requires FD integrated circuits (RFICs) on wide bandgap semiconductors such as Silicon Carbide (SiC). In this paper, thin-film NiCr resistors, MIM capacitors, and spiral inductors are fabricated on a high purity semi-insulating 4H-SiC substrate. The devices are experimentally characterized through 50 GHz at temperatures of up to 500 C and the equivalent circuits are deembedded from the measured data. It is shown that the NiCr resistors are stable within 10% to 300 C while the capacitors have a value stable within 10% through 500 C.

Schwartz, Zachary D.↗

Development of a hydraulic model of the human systemic circulation

Physical and numeric models of the human circulation are constructed for a number of objectives, including studies and training in physiologic control, interpretation of clinical observations, and testing of prosthetic cardiovascular devices. For many of these purposes it is important to quantitatively validate the dynamic response of the models in terms of the input impedance (Z = oscillatory pressure/oscillatory flow). To address this need, the authors developed an improved physical model. Using a computer study, the authors first identified the configuration of lumped parameter elements in a model of the systemic circulation; the result was a good match with human aortic input impedance with a minimum number of elements. Design, construction, and testing of a hydraulic model analogous to the computer model followed. Numeric results showed that a three element model with two resistors and one compliance produced reasonable matching without undue complication. The subsequent analogous hydraulic model included adjustable resistors incorporating a sliding plate to vary the flow area through a porous material and an adjustable compliance consisting of a variable-volume air chamber. The response of the hydraulic model compared favorably with other circulation models.

NASA Program Biomedical Research and Countermeasur↗

Thin-Film Air-Mass-Flow Sensor of Improved Design Developed

Researchers at the NASA Glenn Research Center have developed a new air-mass-flow sensor to solve the problems of existing mass flow sensor designs. NASA's design consists of thin-film resistors in a Wheatstone bridge arrangement. The resistors are fabricated on a thin, constant-thickness airfoil to minimize disturbance to the airflow being measured. The following photograph shows one of NASA s prototype sensors. In comparison to other air-mass-flow sensor designs, NASA s thin-film sensor is much more robust than hot wires, causes less airflow disturbance than pitot tubes, is more accurate than vane anemometers, and is much simpler to operate than thermocouple rakes. NASA s thin-film air-mass-flow sensor works by converting the temperature difference seen at each leg of the thin-film Wheatstone bridge into a mass-flow rate. The following figure shows a schematic of this sensor with air flowing around it. The sensor operates as follows: current is applied to the bridge, which increases its temperature. If there is no flow, all the arms are heated equally, the bridge remains in balance, and there is no signal. If there is flow, the air passing over the upstream legs of the bridge reduces the temperature of the upstream legs and that leads to reduced electrical resistance for those legs. After the air has picked up heat from the upstream legs, it continues and passes over the downstream legs of the bridge. The heated air raises the temperature of these legs, increasing their electrical resistance. The resistance difference between the upstream and downstream legs unbalances the bridge, causing a voltage difference that can be amplified and calibrated to the airflow rate. Separate sensors mounted on the airfoil measure the temperature of the airflow, which is used to complete the calculation for the mass of air passing by the sensor. A current application for air-mass-flow sensors is as part of the intake system for an internal combustion engine. A mass-flow sensor is used to provide accurate information about the amount of air entering the engine so that the amount of fuel can be adjusted to give the most efficient combustion. The ideal mass-flow sensor would be a rugged design that minimizes the disturbance to the flow stream and provides an accurate reading of both smooth and turbulent flows; NASA's design satisfies these requirements better than any existing design. Most of the mass-flow sensors used today are the hot wire variety. Hot wires can be fragile and cannot accurately measure a turbulent or reversing flow, which is often encountered in an intake manifold. Other types of mass-flow sensors include pitot tubes, vane anemometers, and thermocouple rakes-all of which suffer from some type of performance problem. Because it solves these performance problems while maintaining a simple design that lends itself to low-cost manufacturing techniques, NASA s thin-film resistance temperature detector air-mass-flow sensor should lead to more widespread use of mass-flow sensors.

Fralick, Gustave C.↗

Characterization of Transducers and Resonators under High Drive Levels

In many applications, piezoelectric transducers are driven at AC voltage levels well beyond the level for which the material was nominally characterized. In this paper we describe an experimental setup that allows for the determination of the main transducer or resonator properties under large AC drive. A sinusoidal voltage from a waveform generator is amplified and applied across the transducer/resonator in series with a known high power resistor. The amplitude of applied voltage and the amplitude and the relative phase of the current through the resistor are monitored on a digital scope. The frequency of the applied signal is swept through resonance and the voltage/current signals are recorded. After corrections for the series resistance and parasitic elements the technique allows for the determination of the complex impedance spectra of the sample as a function of frequency. In addition, access to the current signal allows for the direct investigation of non-linear effects through the application of Fourier transform techniques on the current signal. Our results indicate that care is required when interpreting impedance data at high drive level due to the frequency dependence of the dissipated power. Although the transducer/resonator at a single frequency and after many cycles may reach thermal equilibrium, the spectra as a whole cannot be considered an isothermal measurement due to the temperature change with frequency. Methods to correct for this effect will be discussed. Results determined from resonators of both soft and hard PZT and a ultrasonic horn transducer are presented.

transducers↗

Power connect safety and connection interlock

A power connect safety and connection interlock system is shown for use with inverters and other DC loads (16) which include capacitor filter banks (14) at their DC inputs. A safety circuit (20) operates a spring (26) biased, solenoid (22) driven mechanical connection interference (24) which prevents mating and therefore electrical connection between the power contactor halves (11, 13) of the main power contacts (12) until the capacitor bank is safely precharged through auxiliary contacts (18). When the DC load (16) is shut down, the capacitor bank (14) is automatically discharged through a discharging power resistor (66) by a MOSFET transistor (60) through a discharging power resistor (66) only when both the main power contacts and auxiliary contacts are disconnected.

Rippel, Wally E.↗

FET commutated current-FED inverter

A shunt switch comprised of a field-effect transistor (Q.sub.1) is employed to commutate a current-fed inverter (10) using thyristors (SCR1, SCR2) or bijunction transistors (Q.sub.2, Q.sub.3) in a full bridge (1, 2, 3, 4) or half bridge (5, 6) and transformer (T.sub.1) configuration. In the case of thyristors, a tapped inverter (12) is employed to couple the inverter to a dc source to back bias the thyristors during commutation. Alternatively, a commutation power supply (20) may be employed for that purpse. Diodes (D.sub.1, D.sub.2) in series with some voltage dropping element (resistor R.sub.12 or resistors R.sub.1, R.sub.2 or Zener diodes D.sub.4, D.sub.5) are connected in parallel with the thyristors in the half bridge and transformer configuration to assure sharing the back bias voltage. A clamp circuit comprised of a winding (18) negatively coupled to the inductor and a diode (D.sub.3) return stored energy from the inductor to the power supply for efficient operation with buck or boost mode.

Rippel, Wally E.↗

Full-charge indicator for battery chargers

A full-charge indicator for battery chargers, includes a transistor which is in a conductive state as long as charging current to the battery is not less than a level which indicates that the battery did not reach full charge. When the battery reaches full charge, a voltage drop in a resistor in the charging current path is not sufficient to maintain the transistor in a conducting state, and therefore it is switched off. When this occurs an LED is turned on, to indicate a full charge state of the battery. A photocoupler together with a photocoupler transistor are included. When the transistor is off, the photocoupler activates the photocoupler transistor to shunt out a resistor, thereby reducing the charging current to the battery to a float charging current and prevent the battery from being overcharged and damaged.

Cole, Steven W.↗

Three-Stage InP Submillimeter-Wave MMIC Amplifier

A submillimeter-wave monolithic integrated- circuit (S-MMIC) amplifier has been designed and fabricated using an indium phosphide (InP) 35-nm gate-length high electron mobility transistor (HEMT) device, developed at Northrop Grumman Corporation. The HEMT device employs two fingers each 15 micrometers wide. The HEMT wafers are grown by molecular beam epitaxy (MBE) and make use of a pseudomorphic In0.75Ga0.25As channel, a silicon delta-doping layer as the electron supply, an In0.52Al0.48As buffer layer, and an InP substrate. The three-stage design uses coplanar waveguide topology with a very narrow ground-to-ground spacing of 14 micrometers. Quarter-wave matching transmission lines, on-chip metal-insulator-metal shunt capacitors, series thin-film resistors, and matching stubs were used in the design. Series resistors in the shunt branch arm provide the basic circuit stabilization. The S-MMIC amplifier was measured for S-parameters and found to be centered at 320 GHz with 13-15-dB gain from 300-345 GHz. This chip was developed as part of the DARPA Submillimeter Wave Imaging Focal Plane Technology (SWIFT) program (see figure). Submillimeter-wave amplifiers could enable more sensitive receivers for earth science, planetary remote sensing, and astrophysics telescopes, particularly in radio astronomy, both from the ground and in space. A small atmospheric window at 340 GHz exists and could enable ground-based observations. However, the submillimeter-wave regime (above 300 GHz) is best used for space telescopes as Earth s atmosphere attenuates most of the signal through water and oxygen absorption. Future radio telescopes could make use of S-MMIC amplifiers for wideband, low noise, instantaneous frequency coverage, particularly in the case of heterodyne array receivers.

Pukala, David↗

Wide-Range Temperature Sensors with High-Level Pulse Train Output

Two types of temperature sensors have been developed for wide-range temperature applications. The two sensors measure temperature in the range of -190 to +200 C and utilize a thin-film platinum RTD (resistance temperature detector) as the temperature-sensing element. Other parts used in the fabrication of these sensors include NPO (negative-positive- zero) type ceramic capacitors for timing, thermally-stable film or wirewound resistors, and high-temperature circuit boards and solder. The first type of temperature sensor is a relaxation oscillator circuit using an SOI (silicon-on-insulator) operational amplifier as a comparator. The output is a pulse train with a period that is roughly proportional to the temperature being measured. The voltage level of the pulse train is high-level, for example 10 V. The high-level output makes the sensor less sensitive to noise or electromagnetic interference. The output can be read by a frequency or period meter and then converted into a temperature reading. The second type of temperature sensor is made up of various types of multivibrator circuits using an SOI type 555 timer and the passive components mentioned above. Three configurations have been developed that were based on the technique of charging and discharging a capacitor through a resistive element to create a train of pulses governed by the capacitor-resistor time constant. Both types of sensors, which operated successfully over the wide temperature range, have potential use in extreme temperature environments including jet engines and space exploration missions.

Hammoud, Ahmad↗

Maintaining Stability During a Conducted-Ripple EMC Test

An improved technique, and electronic circuitry to implement the technique, have been developed for a military-standard electromagnetic-compatibility (EMC) test in which one analyzes susceptibility to low-frequency ripple conducted into the equipment under test via a DC power line. In the traditional technique for performing the particular test, the ripple is coupled onto the DC power line via a transformer. Depending upon some design details of the equipment under test, the inductance of the transformer can contribute a degree of instability that results in an oscillation of amplitude large enough to destroy the equipment. It is usually possible to suppress the oscillation by connecting a damping resistor to the primary terminals of the ripple-injection transformer. However, it is important to emphasize the usually in the preceding sentence: sometimes, the resistive damping becomes insufficient to suppress destructive oscillation. In addition, undesirably, the resistor contributes to power dissipation and power demand, and thereby also necessitates the use of a larger ripple voltage amplifier. Yet another disadvantage of the transformer-coupling technique is that the transformer introduces low-frequency distortion of the injected ripple voltage. The improved technique makes it possible to inject ripple with very low distortion at low frequency, without inducing oscillation. In this technique, a transformer is not used: Instead, power is fed to the equipment under test via series power field-effect transistors (FETs) controlled by a summing operational amplifier. One of the inputs to the amplifier controls the DC component of the power-line voltage; the other input, generated by an external oscillator, controls the ripple component. The circuitry for implementing this technique includes panel displays, an internal power supply for the operational amplifier and panel displays, and amplitude controls for the DC and ripple powerline voltage components.

Vorperian, Vatche↗

RuO2 Thermometer for Ultra-Low Temperatures

A small, high-resolution, low-power thermometer has been developed for use in ultra-low temperatures that uses multiple RuO2 chip resistors. The use of commercially available thick-film RuO2 chip resistors for measuring cryogenic temperatures is well known due to their low cost, long-term stability, and large resistance change.

Hait, Thomas↗

Evaluation of Advanced COTS Passive Devices for Extreme Temperature Operation

Electronic sensors and circuits are often exposed to extreme temperatures in many of NASA deep space and planetary surface exploration missions. Electronics capable of operation in harsh environments would be beneficial as they simplify overall system design, relax thermal management constraints, and meet operational requirements. For example, cryogenic operation of electronic parts will improve reliability, increase energy density, and extend the operational lifetimes of space-based electronic systems. Similarly, electronic parts that are able to withstand and operate efficiently in high temperature environments will negate the need for thermal control elements and their associated structures, thereby reducing system size and weight, enhancing its reliability, improving its efficiency, and reducing cost. Passive devices play a critical role in the design of almost all electronic circuitry. To address the needs of systems for extreme temperature operation, some of the advanced and most recently introduced commercial-off-the-shelf (COTS) passive devices, which included resistors and capacitors, were examined for operation under a wide temperature regime. The types of resistors investigated included high temperature precision film, general purpose metal oxide, and wirewound.

Patterson, Richard↗

N channel JFET based digital logic gate structure

A circuit topography is presented which is used to create usable digital logic gates using N (negatively doped) channel Junction Field Effect Transistors (JFETs) and load resistors, level shifting resistors, and supply rails whose values are based on the direct current (DC) parametric distributions of those JFETs. This method has direct application to the current state of the art in high temperature, for example 300.degree. C. to 500.degree. C. and higher, silicon carbide (SiC) device production. The ability to produce inverting and combinatorial logic enables the production of pulse and edge triggered latches. This scale of logic synthesis would bring digital logic and state machine capabilities to devices operating in extremely hot environments, such as the surface of Venus, near hydrothermal vents, within nuclear reactors (SiC is inherently radiation hardened), and within internal combustion engines. The basic logic gate can be configured as a driver for oscillator circuits allowing for time bases and simple digitizers for resistive or reactive sensors. The basic structure of this innovation, the inverter, can be reconfigured into various analog circuit topographies through the use of feedback structures.

Krasowski, Michael J.↗

Negative feedback avalanche diode

A single-photon avalanche detector is disclosed that is operable at wavelengths greater than 1000 nm and at operating speeds greater than 10 MHz. The single-photon avalanche detector comprises a thin-film resistor and avalanche photodiode that are monolithically integrated such that little or no additional capacitance is associated with the addition of the resistor.

Itzler, Mark Allen↗

Method and Circuit for In-Situ Health Monitoring of Solar Cells in Space

This innovation represents a method and circuit realization of a system designed to make in-situ measurements of test solar-cell operational parameters on orbit using readily available high-temperature and high-ionizing-radiation- tolerant electronic components. This innovation enables on-orbit in-situ solar-array health monitoring and is in response to a need recognized by the U.S. Air Force for future solar arrays for unmanned spacecraft. This system can also be constructed out of commercial-grade electronics and can be embedded into terrestrial solar power system as a diagnostics instrument. This innovation represents a novel approach to I-V curve measurement that is radiation and temperature hard, consumes very few system resources, is economical, and utilizes commercially available components. The circuit will also operate at temperatures as low as 55 C and up to +225 C, allowing it to reside close to the array in direct sunlight. It uses a swept mode transistor functioning as a resistive load while utilizing the solar cells themselves as the biasing device, so the size of the instrument is small and there is no danger of over-driving the cells. Further, this innovation utilizes nearly universal spacecraft bus resources and therefore can be readily adapted to any spacecraft bus allowing for ease of retrofit, or designed into new systems without requiring the addition of infrastructure. One unique characteristic of this innovation is that it effects the measurement of I-V curves without the use of large resistor arrays or active current sources normally used to characterize cells. A single transistor is used as a variable resistive load across the cell. This multi-measurement instrument was constructed using operational amplifiers, analog switches, voltage regulators, MOSFETs, resistors, and capacitors. The operational amplifiers, analog switches, and voltage regulators are silicon-on-insulator (SOI) technology known for its hardness to the effects of ionizing radiation. The SOI components used can tolerate temperatures up to 225 C, which gives plenty of thermal headroom allowing this circuit to perhaps reside in the solar cell panel itself where temperatures can reach over 100 C.

Krasowski, Michael J.↗

Four-Quadrant Analog Multipliers Using G4-FETs

Theoretical analysis and some experiments have shown that the silicon-on-insulator (SOI) 4-gate transistors known as G4-FETs can be used as building blocks of four-quadrant analog voltage multiplier circuits. Whereas a typical prior analog voltage multiplier contains between six and 10 transistors, it is possible to construct a superior voltage multiplier using only four G4-FETs. A G4-FET is a combination of a junction field-effect transistor (JFET) and a metal oxide/semiconductor field-effect transistor (MOSFET). It can be regarded as a single transistor having four gates, which are parts of a structure that affords high functionality by enabling the utilization of independently biased multiple inputs. The structure of a G4-FET of the type of interest here (see Figure 1) is that of a partially-depleted SOI MOSFET with two independent body contacts, one on each side of the channel. The drain current comprises of majority charge carriers flowing from one body contact to the other that is, what would otherwise be the side body contacts of the SOI MOSFET are used here as the end contacts [the drain (D) and the source (S)] of the G4-FET. What would otherwise be the source and drain of the SOI MOSFET serve, in the G4-FET, as two junction-based extra gates (JG1 and JG2), which are used to squeeze the channel via reverse-biased junctions as in a JFET. The G4-FET also includes a polysilicon top gate (G1), which plays the same role as does the gate in an accumulation-mode MOSFET. The substrate emulates a fourth MOS gate (G2). By making proper choices of G4-FET device parameters in conjunction with bias voltages and currents, one can design a circuit in which two input gate voltages (Vin1,Vin2) control the conduction characteristics of G4-FETs such that the output voltage (Vout) closely approximates a value proportional to the product of the input voltages. Figure 2 depicts two such analog multiplier circuits. In each circuit, there is the following: The input and output voltages are differential, The multiplier core consists of four G4- FETs (M1 through M4) biased by a constant current sink (Ibias), and The G4-FETs in two pairs are loaded by two identical resistors (RL), which convert a differential output current to a differential output voltage. The difference between the two circuits stems from their input and bias configurations. In each case, provided that the input voltages remain within their design ranges as determined by considerations of bias, saturation, and cutoff, then the output voltage is nominally given by Vout = kVin1Vin2, where k is a constant gain factor that depends on the design parameters and is different for the two circuits. In experimental versions of these circuits constructed using discrete G4- FETs and resistors, multiplication of voltages in all four quadrants (that is, in all four combinations of input polarities) was demonstrated, and deviations of the output voltages from linear dependence on the input voltages were found to amount to no more than a few percent. It is anticipated that in fully integrated versions of these circuits, the deviations from linearity will be made considerably smaller through better matching of devices.

Mojarradi, Mohammad↗