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At least 181 records · Page 10

Mixed application MMIC technologies - Progress in combining RF, digital and photonic circuits

Approaches for future 'mixed application' monolithic integrated circuits (ICs) employing optical receive/transmit, RF amplification and modulation and digital control functions are discussed. We focus on compatibility of the photonic component fabrication with conventional RF and digital IC technologies. Recent progress at Honeywell in integrating several parts of the desired RF/digital/photonic circuit integration suite required for construction of a future millimeter-wave optically-controlled phased-array element are illustrated.

Swirhun, S.↗

Novel miniaturised wideband baluns for MIC and MMIC applications

Very compact novel planar broadband baluns are described. Each balun consists of two Lange couplers. Less than 0.3 dB and 2.5 deg for the amplitude and phase balances, respectively, have been measured over the 1.0-2.2 GHz bandwidth for a microstrip balun. As compared with other reported baluns, these baluns are simpler, more compact, easier to design, and fabricated on only one side of the substrate. They are thus very attractive for microwave integrated and monolithic integrated circuit applications.

Nguyen, C.↗

W-Band InP Wideband MMIC LNA with 30K Noise Temperature

This paper describe a millimeter wave low noise amplifier with extraordinary low noise, low consumption, and wide frequency range. These results are achieved utilizing state-of-the-art InP HEMT transistors coupled with CPW circuit design. The paper describes the transistor models, modeled and measured on-wafer and in-module results at both 300K am 24K operating temperatures for many samples of the device.

Weinreb, S.↗

Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented.

Ponchak, George E.↗

Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/mm-wave integrated circuits on low resistivity Si wafers. However, the closely spaced transmission lines are susceptible to high levels of cross-coupling, which degrades the overall circuit performance. In this paper, theoretical and experimental results on coupling of Finite Ground Coplanar (FGC) waveguides embedded in polyimide layers are presented for the first time. These results show that FGC lines have approximately 8 dB lower coupling than coupled Coplanar Waveguides. Furthermore, it is shown that the forward and backward coupling characteristics for FGC lines do not resemble the coupling characteristics of other transmission lines such as microstrip.

Ponchak, George E.↗

Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on complementary metal oxide semiconductor (CMOS) (low resistivity) Si wafers. Thin film microstrip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and experimental measurements are used to show that the ground planes must be connected by via holes to reduce coupling in both the forward and backward directions.

Ponchak, George E.↗

Coupling between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing SilSiGe monolithic microwavdmillimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented. A discussion of the electric and magnetic field distributions for the coupled microstrip lines is presented to provide a physical rationale for the presented results.

Ponchak, George E.↗

Hurricane research with the high altitude MMIC sounding radiometer

We present preliminary results for hurricane Erin, made on 9/10/01, which illustrate the very substantial scattering that can be observed over intense convective and precipitating systems, as well as other characteristics of a hurricane.

CAMEX HAMSR microwave sounder hurricane scattering↗

Fixed-Tuned Submillimeter Waveguide Multipliers Using MMIC Technology

In preparation for the insturment ammouncement of opportunity for the Far Infrared and Submillimeter Space Telescope, and ESA/NASA space astrophysics observatory mission, local oscillator sources at high frequencies (1200 GHz) are being developed. As part of a multiplier chain beginning at ~100 GHz we are developing single and multiple diode waveguide circuits up to 640 GHz.

Far Infrared Submillimeter Space Telescope↗

HAMSR - The High Altitude MMIC Sounding Radiometer

WAMSR is a millimeter wave atmospheric temperature and humidity sounder that utilizes state of the art technology to enable substantial reductions in size and mass while at the same time achieve improved measurement sensitivity and accuracy. It is the first such instrument to use receivers based entirely on newly developed monolithic microwave integrated circuit technology. Sponsored by the NASA Instrument Incubator Program, HAMSR has been under development for the past 2 112 years. The first science mission takes place in Florida this summer, where HAMSR is deployed on the NASA ER-2 during the CAMEX-4 hurricane field campaign and will provide core atmospheric soundings to a number of investigators. HAMSR represents the next generation of microwave sounders.

remote sensing↗