Alternative, Green Processes for the Precision Cleaning of Aerospace Hardware
Precision cleaning is necessary to ensure the proper functioning of aerospace hardware, particularly those systems that come in contact with liquid oxygen or hypergolic fuels. Components that have not been cleaned to the appropriate levels may experience problems ranging from impaired performance to catastrophic failure. Traditionally, this has been achieved using various halogenated solvents. However, as information on the toxicological and/or environmental impacts of each came to light, they were subsequently regulated out of use. The solvent currently used in Kennedy Space Center (KSC) precision cleaning operations is Vertrel MCA. Environmental sampling at KSC indicates that continued use of this or similar solvents may lead to high remediation costs that must be borne by the Program for years to come. In response to this problem, the Green Solvents Project seeks to develop state-of-the-art, green technologies designed to meet KSCs precision cleaning needs.Initially, 23 solvents were identified as potential replacements for the current Vertrel MCA-based process. Highly halogenated solvents were deliberately omitted since historical precedents indicate that as the long-term consequences of these solvents become known, they will eventually be regulated out of practical use, often with significant financial burdens for the user. Three solvent-less cleaning processes (plasma, supercritical carbon dioxide, and carbon dioxide snow) were also chosen since they produce essentially no waste stream. Next, experimental and analytical procedures were developed to compare the relative effectiveness of these solvents and technologies to the current KSC standard of Vertrel MCA. Individually numbered Swagelok fittings were used to represent the hardware in the cleaning process. First, the fittings were cleaned using Vertrel MCA in order to determine their true cleaned mass. Next, the fittings were dipped into stock solutions of five commonly encountered contaminants and were weighed again showing typical contaminant deposition levels of approximately 0.00300g per part. They were then cleaned by the solvent or process being tested and then weighed a third time which allowed for the calculation of the cleaning efficiency of the test solvent or process.Based on preliminary experiments, five solvents (ethanol, isopropanol, acetone, ethyl acetate, and tert-butyl acetate) were down selected for further testing. When coupled with ultrasonic agitation, these solvents removed hydrocarbon contaminants as well as Vertrel MCA and showed improved removal of perfluorinated greases. Supercritical carbon dioxide did an excellent job dissolving each of the five contaminants but did a poor job of removing Teflon particles found in the perfluorinated greases. Plasma cleaning efficiency was found to be dependent on which supply gas was used, exposure time, and gas pressure. Under optimized conditions it was found that breathing air, energized to the plasma phase, was able to remove nearly 100% of the contamination.These findings indicate that alternative cleaning methods are indeed able to achieve precision levels of cleanliness. Currently, our team is working with a commercial cleaning company to get independent verification of our results. We are also evaluating the technical and financial aspects of scaling these processes to a size capable of supporting the future cleaning needs of KSC.